Morioka; Muneharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morioka; Muneharu.The latest application filed is for "lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device".

Company Profile

0.17.18

Morioka; Muneharu - Kanagawa N/A JP
Morioka; Muneharu - Kawasaki JP
Morioka; Muneharu - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device Grant 8,552,542 - Morioka October 8, 2	2013-10-08
Lead Frame, Semiconductor Device, Method Of Manufacturing Lead Frame, And Method Of Manufacturing Semiconductor Device App 20130069214 - MORIOKA; Muneharu	2013-03-21
Lead Frame And Method For Manufacturing Semiconductor Device Using The Same App 20110266661 - MORIOKA; Muneharu	2011-11-03
Semiconductor package, lead frame, and wiring board with the same App 20100290202 - Sasaki; Hideki ; et al.	2010-11-18
Method of manufacturing semiconductor device App 20100055844 - Morioka; Muneharu	2010-03-04
Method of fabricating semiconductor device Grant 7,556,985 - Fukasawa , et al. July 7, 2	2009-07-07
Semiconductor device having a ball grid array and a fabrication process thereof Grant 7,064,047 - Fukasawa , et al. June 20, 2	2006-06-20
Method of fabricating semiconductor device App 20060030127 - Fukasawa; Norio ; et al.	2006-02-09
Method of fabricating a semiconductor device having a groove formed in a resin layer Grant 6,987,054 - Fukasawa , et al. January 17, 2	2006-01-17
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device Grant 6,881,611 - Fukasawa , et al. April 19, 2	2005-04-19
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board Grant 6,875,638 - Yoneda , et al. April 5, 2	2005-04-05
Semiconductor device having a ball grid array and a fabrication process thereof App 20040259346 - Fukasawa, Norio ; et al.	2004-12-23
Semiconductor device having a ball grid array and a fabrication process thereof Grant 6,784,542 - Fukasawa , et al. August 31, 2	2004-08-31
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board App 20040053444 - Yoneda, Yoshiyuki ; et al.	2004-03-18
Resin for semiconductor wire Grant 6,700,198 - Toya , et al. March 2, 2	2004-03-02
Method of forming an insulative substrate having conductive filled vias Grant 6,693,029 - Iijima , et al. February 17, 2	2004-02-17
Semiconductor device having a ball grid array and a fabrication process thereof App 20040012088 - Fukasawa, Norio ; et al.	2004-01-22
Semiconductor device having a ball grid array and a fabrication process thereof Grant 6,657,282 - Fukasawa , et al. December 2, 2	2003-12-02
Multilayer wiring substrate having differential signal wires and a general signal wire in different planes Grant 6,573,600 - Kikuchi , et al. June 3, 2	2003-06-03
Semiconductor device and method for manufacturing substrate of the same App 20030087483 - Iijima, Makoto ; et al.	2003-05-08
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board App 20030082846 - Yoneda, Yoshiyuki ; et al.	2003-05-01
Mold for fabricating semiconductor devices Grant 6,471,501 - Shinma , et al. October 29, 2	2002-10-29
Semiconductor device having a ball grid array and a fabrication process thereof Grant 6,455,920 - Fukasawa , et al. September 24, 2	2002-09-24
Semiconductor device having a ball grid array and a fabrication process thereof App 20020089040 - Fukasawa, Norio ; et al.	2002-07-11
Semiconductor device having a ball grid array and a fabrication process thereof App 20020089054 - Fukasawa, Norio ; et al.	2002-07-11
Semiconductor device and method of producing the same Grant 6,396,155 - Nukiwa , et al. May 28, 2	2002-05-28
Multilayer wiring substrate having differential signal wires and a general signal wire in different planes App 20020060366 - Kikuchi, Atsushi ; et al.	2002-05-23
Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device App 20020030258 - Fukasawa, Norio ; et al.	2002-03-14
Semiconductor device and method for manufacturing substrate of the same Grant 6,351,031 - Iijima , et al. February 26, 2	2002-02-26
Carrier substrate for producing semiconductor device Grant 6,348,416 - Toya , et al. February 19, 2	2002-02-19
Resin for semiconductor wire App 20020019133 - Toya, Hideki ; et al.	2002-02-14
Semiconductor Device Having A Ball Grid Array And A Fabrication Process Thereof App 20010011772 - FUKASAWA, NORIO ; et al.	2001-08-09
Method And Mold For Manufacturing Semiconductor Device, Semiconductor Device, And Method For Mounting The Device App 20010003049 - FUKASAWA, NORIO ; et al.	2001-06-07

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