Morinaga; Yuji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Morinaga; Yuji.The latest application filed is for "electronic device, connection body, and manufacturing method for electronic device".
- Morinaga; Yuji - Hanno JP
- MORINAGA; Yuji - Hanno-Shi JP
- Morinaga; Yuji - Saitama JP
| Patent | Date |
|---|---|
| Electronic device, connection body, and manufacturing method for electronic device Grant 11,404,353 - Umeda , et al. August 2, 2 | 2022-08-02 |
| Electronic device and connection body Grant 11,211,311 - Umeda , et al. December 28, 2 | 2021-12-28 |
| Electronic device and connection body Grant 10,910,292 - Umeda , et al. February 2, 2 | 2021-02-02 |
| Electronic device and connector Grant 10,896,868 - Umeda , et al. January 19, 2 | 2021-01-19 |
| Electronic Device, Connection Body, And Manufacturing Method For Electronic Device App 20200219797 - UMEDA; Soichiro ; et al. | 2020-07-09 |
| Electronic device Grant 10,615,092 - Umeda , et al. | 2020-04-07 |
| Electronic device Grant 10,600,712 - Morinaga , et al. | 2020-03-24 |
| Electronic Device And Connection Body App 20200011904 - UMEDA; Soichiro ; et al. | 2020-01-09 |
| Electronic Device And Connection Body App 20190378782 - UMEDA; Soichiro ; et al. | 2019-12-12 |
| Semiconductor module Grant 10,461,042 - Ikeda , et al. Oc | 2019-10-29 |
| Electronic Device And Connector App 20190318982 - UMEDA; Soichiro ; et al. | 2019-10-17 |
| Electronic Device App 20190237377 - UMEDA; Soichiro ; et al. | 2019-08-01 |
| Semiconductor module Grant 10,319,704 - Ikeda , et al. | 2019-06-11 |
| Heat dissipating structure Grant 10,251,256 - Ikeda , et al. | 2019-04-02 |
| Semiconductor device having a bypass capacitor Grant 10,243,477 - Morinaga , et al. | 2019-03-26 |
| Electronic Device App 20190051577 - MORINAGA; Yuji ; et al. | 2019-02-14 |
| Semiconductor device Grant 10,199,486 - Morinaga , et al. Fe | 2019-02-05 |
| Semiconductor Device App 20180367054 - MORINAGA; Yuji ; et al. | 2018-12-20 |
| Semiconductor Device App 20180366567 - MORINAGA; Yuji ; et al. | 2018-12-20 |
| Heat dissipating structure Grant 10,159,166 - Ikeda , et al. Dec | 2018-12-18 |
| Method of manufacturing bonded body Grant 10,083,844 - Matsubayashi , et al. September 25, 2 | 2018-09-25 |
| Semiconductor Module App 20180226356 - IKEDA; Kosuke ; et al. | 2018-08-09 |
| Semiconductor Module App 20180182745 - IKEDA; Kosuke ; et al. | 2018-06-28 |
| Heat Dissipating Structure App 20170311482 - IKEDA; Kosuke ; et al. | 2017-10-26 |
| Heat Dissipating Structure App 20170303385 - Ikeda; Kosuke ; et al. | 2017-10-19 |
| Semiconductor module Grant 9,704,828 - Ikeda , et al. July 11, 2 | 2017-07-11 |
| Method Of Manufacturing Bonded Body App 20170103903 - MATSUBAYASHI; Ryo ; et al. | 2017-04-13 |
| Semiconductor Module App 20160254250 - IKEDA; Kosuke ; et al. | 2016-09-01 |
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