Morimoto; Yuta
Patent Applications and Registrations
Patent applications and USPTO patent grants for Morimoto; Yuta.The latest application filed is for "ceramic electronic component".
- Morimoto; Yuta - Kyoto JP
| Patent | Date |
|---|---|
| Module having sealing layer with recess Grant 11,398,436 - Fujii , et al. July 26, 2 | 2022-07-26 |
| High-frequency module Grant 11,297,746 - Otsubo , et al. April 5, 2 | 2022-04-05 |
| High frequency module Grant 11,178,778 - Nomura , et al. November 16, 2 | 2021-11-16 |
| Ceramic Electronic Component App 20210259104 - MURAKITA; Naoya ; et al. | 2021-08-19 |
| Radio Frequency Module App 20200365476 - OTSUBO; Yoshihito ; et al. | 2020-11-19 |
| High-frequency Module App 20200337187 - OTSUBO; Yoshihito ; et al. | 2020-10-22 |
| Antenna-attached Substrate And Antenna Module App 20200303813 - MORIMOTO; Yuta ; et al. | 2020-09-24 |
| High Frequency Module App 20200137893 - NOMURA; Tadashi ; et al. | 2020-04-30 |
| High-frequency module and manufacturing method therefor Grant 10,559,535 - Otsubo , et al. Feb | 2020-02-11 |
| Module App 20200043866 - FUJII; Akihiro ; et al. | 2020-02-06 |
| High-frequency Module And Manufacturing Method Therefor App 20180166394 - OTSUBO; Yoshihito ; et al. | 2018-06-14 |
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