Morimoto; Seiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morimoto; Seiichi.The latest application filed is for "mach-zehnder type atomic interferometric gyroscope".

Company Profile

4.13.8

Morimoto; Seiichi - Shiga JP
MORIMOTO; Seiichi - Tokyo JP
Morimoto; Seiichi - Beaverton OR
Morimoto; Seiichi - Kobe JP
Morimoto; Seiichi - Aloha OR
Morimoto; Seiichi - Kashihara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Antioxidant-containing foamable resin particles, method for producing same, foamable particles, and foam-molded article Grant 10,968,339 - Morimoto April 6, 2	2021-04-06
Mach-zehnder Type Atomic Interferometric Gyroscope App 20200333139 - KOZUMA; Mikio ; et al.	2020-10-22
Mach-zehnder Type Atomic Interferometric Gyroscope App 20200318968 - KOZUMA; Mikio ; et al.	2020-10-08
Gyroscope And Angle Measurement Method App 20200300630 - KOZUMA; Mikio ; et al.	2020-09-24
Atomic Interferometric Gyroscope App 20200256677 - KOZUMA; Mikio ; et al.	2020-08-13
Antioxidant-containing Foamable Resin Particles, Method For Producing Same, Foamable Particles, And Foam-molded Article App 20190085160 - MORIMOTO; Seiichi	2019-03-21
Polish to remove topography in sacrificial gate layer prior to gate patterning Grant 8,334,184 - Steigerwald , et al. December 18, 2	2012-12-18
Polish To Remove Topography In Sacrificial Gate Layer Prior To Gate Patterning App 20110147812 - Steigerwald; Joseph M. ; et al.	2011-06-23
Unidirectionally conductive materials for interconnection Grant 7,405,419 - Golzarian , et al. July 29, 2	2008-07-29
Unidirectionally conductive materials for interconnection App 20060228884 - Golzarian; Reza M. ; et al.	2006-10-12
Unidirectionally conductive materials for interconnection Grant 7,084,053 - Golzarian , et al. August 1, 2	2006-08-01
Unidirectionally conductive materials for interconnection App 20050070096 - Golzarian, Reza M. ; et al.	2005-03-31
Merging dummy structure representations for improved distribution of artifacts in a semiconductor layer Grant 6,081,272 - Morimoto , et al. June 27, 2	2000-06-27
Polysilicon polish for patterning improvement Grant 5,911,111 - Bohr , et al. June 8, 1	1999-06-08
Elimination of pad conditioning in a chemical mechanical polishing process Grant 5,672,095 - Morimoto , et al. September 30, 1	1997-09-30
Rotation control system for ultrasonic motor Grant 5,198,732 - Morimoto March 30, 1	1993-03-30
Apparatus for planarizing a dielectric formed over a semiconductor substrate Grant 5,127,196 - Morimoto , et al. July 7, 1	1992-07-07
Method of planarizing a dielectric formed over a semiconductor substrate Grant 5,104,828 - Morimoto , et al. April 14, 1	1992-04-14
Method for conditioning the surface of a polishing pad Grant 5,081,051 - Mattingly , et al. January 14, 1	1992-01-14
Semiconductor planarization process Grant 4,721,548 - Morimoto January 26, 1	1988-01-26
Method of processing fermented liquid Grant 4,600,477 - Higashi , et al. July 15, 1	1986-07-15

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