MORIMOTO; Nobuyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for MORIMOTO; Nobuyuki.The latest application filed is for "ventilation fan and ventilation system".
Company Profile
2.31.35
- MORIMOTO; Nobuyuki - Aichi JP
- Morimoto; Nobuyuki - Bunkyo-ku N/A JP
- Morimoto; Nobuyuki - Yamagata N/A JP
- Morimoto; Nobuyuki - Nagoya JP
- Morimoto; Nobuyuki - Tokyo JP
- Morimoto; Nobuyuki - Minato-ku JP
- Morimoto; Nobuyuki - Nagoya-shi JP
- Morimoto; Nobuyuki - Sodegaura JP
Patent Activity
| Patent | Date |
|---|---|
| Ventilation Fan And Ventilation System App 20210293426 - SAKAI; Hirosato ; et al. | 2021-09-23 |
| Ventilation fan and ventilation system Grant 11,054,158 - Sakai , et al. July 6, 2 | 2021-07-06 |
| Ventilation Fan And Ventilation System App 20190242599 - SAKAI; Hirosato ; et al. | 2019-08-08 |
| Ventilation fan and ventilation system Grant 10,302,321 - Sakai , et al. | 2019-05-28 |
| Hybrid gel comprising chemically crosslinked hyaluronic acid derivative and pharmaceutical composition comprising the same Grant 8,987,230 - Akiyoshi , et al. March 24, 2 | 2015-03-24 |
| Ventilation Fan And Ventilation System App 20150050876 - Sakai; Hirosato ; et al. | 2015-02-19 |
| Method of manufacturing bonded wafer Grant 8,802,540 - Morimoto , et al. August 12, 2 | 2014-08-12 |
| Fastening tool Grant 8,671,803 - Katsunuma , et al. March 18, 2 | 2014-03-18 |
| Method for producing semiconductor substrate Grant 8,183,133 - Murakami , et al. May 22, 2 | 2012-05-22 |
| Bonded wafer and method for producing bonded wafer Grant 8,048,767 - Morimoto , et al. November 1, 2 | 2011-11-01 |
| Method for producing bonded wafer Grant 8,048,769 - Morimoto , et al. November 1, 2 | 2011-11-01 |
| Method for producing a bonded wafer Grant 8,003,494 - Nishihata , et al. August 23, 2 | 2011-08-23 |
| Method of producing semiconductor substrate having an SOI structure Grant 7,951,692 - Murakami , et al. May 31, 2 | 2011-05-31 |
| Method for producing bonded silicon wafer Grant 7,927,957 - Kusaba , et al. April 19, 2 | 2011-04-19 |
| Method of producing bonded wafer Grant 7,902,043 - Morimoto , et al. March 8, 2 | 2011-03-08 |
| Method For Producing Semiconductor Substrate App 20110027969 - MURAKAMI; Satoshi ; et al. | 2011-02-03 |
| Laminated substrate manufacturing method and laminated substrate manufactured by the method Grant 7,858,494 - Endo , et al. December 28, 2 | 2010-12-28 |
| Method of manufacturing bonded wafer Grant 7,855,132 - Endo , et al. December 21, 2 | 2010-12-21 |
| Method for producing semiconductor substrate Grant 7,851,337 - Murakami , et al. December 14, 2 | 2010-12-14 |
| Method For Producing A Bonded Wafer App 20100248447 - Nishihata; Hideki ; et al. | 2010-09-30 |
| Method for evaluation of bonded wafer Grant 7,799,655 - Murakami , et al. September 21, 2 | 2010-09-21 |
| Method of producing semiconductor substrate having an SOI structure Grant 7,795,117 - Murakami , et al. September 14, 2 | 2010-09-14 |
| Hybrid Gel Comprising Chemically Crosslinked Hyaluronic Acid Derivative And Pharmaceutical Composition Comprising The Same App 20100204102 - Akiyoshi; Kazunari ; et al. | 2010-08-12 |
| Fastening Tool App 20100199810 - Katsunuma; Toshinari ; et al. | 2010-08-12 |
| Method For Producing Bonded Wafer App 20100178750 - Murakami; Satoshi ; et al. | 2010-07-15 |
| SOI wafer and its manufacturing method Grant 7,713,838 - Endo , et al. May 11, 2 | 2010-05-11 |
| Method For Producing Bonded Silicon Wafer App 20100068867 - Kusaba; Tatsumi ; et al. | 2010-03-18 |
| Method For Producing Bonded Wafer App 20100015779 - Morimoto; Nobuyuki ; et al. | 2010-01-21 |
| Method for producing bonded wafer App 20090186464 - Morimoto; Nobuyuki ; et al. | 2009-07-23 |
| Method for producing SOI wafer Grant 7,563,697 - Morimoto , et al. July 21, 2 | 2009-07-21 |
| SOI wafer and its manufacturing method Grant 7,544,583 - Endo , et al. June 9, 2 | 2009-06-09 |
| Process for cleaning silicon substrate Grant 7,534,728 - Nishihata , et al. May 19, 2 | 2009-05-19 |
| Method For Manufacturing Soi Substrate App 20090117708 - Nishihata; Hideki ; et al. | 2009-05-07 |
| Method for producing SOI wafer Grant 7,510,948 - Morimoto , et al. March 31, 2 | 2009-03-31 |
| Method of producing bonded wafer Grant 7,507,641 - Morimoto , et al. March 24, 2 | 2009-03-24 |
| Method Of Producing Semiconductor Substrate App 20090075453 - MURAKAMI; Satoshi ; et al. | 2009-03-19 |
| Method for manufacturing semiconductor substrate Grant 7,494,899 - Endo , et al. February 24, 2 | 2009-02-24 |
| Method Of Producing Bonded Wafer App 20090023272 - NISHIHATA; Hideki ; et al. | 2009-01-22 |
| Method for producing soi wafer App 20090023269 - Morimoto; Nobuyuki ; et al. | 2009-01-22 |
| Method for producing bonded wafer Grant 7,446,016 - Endo , et al. November 4, 2 | 2008-11-04 |
| Method Of Manufacturing Bonded Wafer App 20080248630 - ENDO; Akihiko ; et al. | 2008-10-09 |
| Method of manufacturing bonded wafer App 20080227271 - MORIMOTO; Nobuyuki ; et al. | 2008-09-18 |
| Method For Evaluation Of Bonded Wafer App 20080220589 - Murakami; Satoshi ; et al. | 2008-09-11 |
| Method of producing bonded wafer App 20080124897 - Morimoto; Nobuyuki ; et al. | 2008-05-29 |
| Process for producing SOI wafer Grant 7,358,147 - Morimoto , et al. April 15, 2 | 2008-04-15 |
| Method Of Producing Bonded Wafer App 20080070377 - Morimoto; Nobuyuki ; et al. | 2008-03-20 |
| Bonded wafer and method of manufacturing the same App 20080061452 - NISHIHATA; Hideki ; et al. | 2008-03-13 |
| Bonded Wafer And Method For Producing Bonded Wafer App 20080057676 - Morimoto; Nobuyuki ; et al. | 2008-03-06 |
| Method of producing bonded wafer App 20070298589 - Nishihata; Hideki ; et al. | 2007-12-27 |
| Method of producing semiconductor substrate App 20070275566 - Murakami; Satoshi ; et al. | 2007-11-29 |
| Method for producing semiconductor substrate App 20070264797 - Murakami; Satoshi ; et al. | 2007-11-15 |
| Process for producing soi wafer App 20070190737 - Morimoto; Nobuyuki ; et al. | 2007-08-16 |
| Method Of Manufacturing Bonded Wafer App 20070184631 - Nakamura; Shinya ; et al. | 2007-08-09 |
| Laminated Substrate Manufacturing Method and Laminated Substrate Manufactured by the Method App 20070048971 - Endo; Akihiko ; et al. | 2007-03-01 |
| Soi wafer and its manufacturing method App 20070032043 - Endo; Akihiko ; et al. | 2007-02-08 |
| Soi wafer and its manufacturing method App 20070026637 - Endo; Akihiko ; et al. | 2007-02-01 |
| Method for manufacturing semiconductor substrate App 20070004169 - Endo; Akihiko ; et al. | 2007-01-04 |
| Method for producing bonded wafer App 20060281280 - Endo; Akihiko ; et al. | 2006-12-14 |
| Method for producing soi wafer App 20060266437 - Morimoto; Nobuyuki ; et al. | 2006-11-30 |
| Process for cleaning silicon substrate App 20060234461 - Nishihata; Hideki ; et al. | 2006-10-19 |
| Range hood App 20020023637 - Okamoto, Toshinobu ; et al. | 2002-02-28 |
| Crystalline aluminosilicate ISI-6 Grant 4,695,440 - Morimoto , et al. * September 22, 1 | 1987-09-22 |
| Process for preparing a crystalline aluminosilicate Grant 4,578,259 - Morimoto , et al. March 25, 1 | 1986-03-25 |
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