MORIMOTO; Kei

Patent Applications and Registrations

Patent applications and USPTO patent grants for MORIMOTO; Kei.The latest application filed is for "processes for manufacturing resin molded articles".

Company Profile

0.5.8

MORIMOTO; Kei - Kanagawa JP
Morimoto; Kei - Hiratsuka JP
Morimoto; Kei - Kanagawa-ken JP
Morimoto; Kei - Hiratsuka-shi JP
Morimoto; Kei - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Processes For Manufacturing Resin Molded Articles App 20160298242 - MORIMOTO; Kei ; et al.	2016-10-13
Polyamide Resin Composition For Portable Electronic Device And Molded Article For Portable Electronic Device App 20150080516 - KUMAZAWA; Teruhisa ; et al.	2015-03-19
Flame-retardant polyamide resin composition and molded article Grant 8,053,500 - Morimoto , et al. November 8, 2	2011-11-08
Fiber-reinforced thermoplastic resin molded article Grant 7,858,172 - Imaizumi , et al. December 28, 2	2010-12-28
Polyamide Resin Composition for Portable Electronic Device and Molded Article for Portable Electronic Device App 20100227122 - Kumazawa; Teruhisa ; et al.	2010-09-09
Flame-retardant Polyamide Resin Composition And Molded Article App 20100069539 - Morimoto; Kei ; et al.	2010-03-18
Fiber-reinforced Thermoplastic Resin Molded Article App 20100009158 - Imaizumi; Hiroyuki ; et al.	2010-01-14
Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device Grant 7,644,855 - Mori , et al. January 12, 2	2010-01-12
Polyamide Resin Composition And Molded Article App 20090280311 - Kumazawa; Teruhisa ; et al.	2009-11-12
Exterior molding body comprising a long fiber reinforced thermoplastic resin Grant 7,465,481 - Imaizumi , et al. December 16, 2	2008-12-16
Exterior Molding Body Comprising a Long Fiber Reinforced Thermoplastic Resin App 20070243343 - Imaizumi; Hiroyuki ; et al.	2007-10-18
Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device App 20050173498 - Mori, Nobuki ; et al.	2005-08-11
Polyamide resin composition having improved weathering resistance and its molded products Grant 6,855,755 - Morimoto , et al. February 15, 2	2005-02-15

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