| Patent | Date |
|---|
Component retrieve device and component retrieve method
Grant 10,614,189 - Moriizumi , et al. | 2020-04-07 |
Component Retrieve Device And Component Retrieve Method
App 20180330035 - Moriizumi; Kiyokazu ; et al. | 2018-11-15 |
Electronic component assembly apparatus
Grant 9,545,044 - Takada , et al. January 10, 2 | 2017-01-10 |
Electronic component inspection apparatus and method
Grant 9,541,602 - Kurosawa , et al. January 10, 2 | 2017-01-10 |
Component Selection Device And Component Selection Method
App 20160155089 - NAKASHIMA; Tomokazu ; et al. | 2016-06-02 |
Electronic component and electronic component assembly apparatus
Grant 9,307,686 - Takada , et al. April 5, 2 | 2016-04-05 |
Electronic Component Assembly Apparatus
App 20150113799 - TAKADA; Katsumi ; et al. | 2015-04-30 |
Electronic Component Inspection Apparatus And Method
App 20140361782 - KUROSAWA; Hiroshi ; et al. | 2014-12-11 |
Electronic Component And Electronic Component Assembly Apparatus
App 20120275128 - TAKADA; Katsumi ; et al. | 2012-11-01 |
Part Information Providing System, Part Information Providing Apparatus, And Non-transitory Computer-readable Medium In Which Part Information Providing Program Is Stored
App 20120095884 - TANABE; Misako ; et al. | 2012-04-19 |
Design Apparatus For Electronic Device, Program For Designing Electronic Device, And Method Of Designing Electronic Device
App 20110208484 - EZAKI; Kouhei ; et al. | 2011-08-25 |
Connection Member And Printed Circuit Board Unit
App 20100246149 - Nakashima; Tomokazu ; et al. | 2010-09-30 |
Mobile Terminal Device
App 20100124952 - Moriizumi; Kiyokazu ; et al. | 2010-05-20 |
Front-and-back electrically conductive substrate
Grant 7,579,553 - Moriizumi August 25, 2 | 2009-08-25 |
Electrolytic capacitor
Grant 7,298,605 - Itoh , et al. November 20, 2 | 2007-11-20 |
Method for making a front and back conductive substrate
Grant 7,222,420 - Moriizumi May 29, 2 | 2007-05-29 |
Electrolytic capacitor
App 20060285275 - Itoh; Masayuki ; et al. | 2006-12-21 |
Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
Grant 7,005,318 - Moriizumi , et al. February 28, 2 | 2006-02-28 |
Front-and-back electrically conductive substrate and method for manufacturing same
App 20040173890 - Moriizumi, Kiyokazu | 2004-09-09 |
Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
App 20040166617 - Moriizumi, Kiyokazu ; et al. | 2004-08-26 |
Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
Grant 6,717,262 - Moriizumi , et al. April 6, 2 | 2004-04-06 |
Key switch and keyboard
Grant 6,618,239 - Takahashi , et al. September 9, 2 | 2003-09-09 |
Key switch and keyboard
App 20020185364 - Takahashi, Kouki ; et al. | 2002-12-12 |
Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same
Grant 6,465,085 - Song , et al. October 15, 2 | 2002-10-15 |
Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip
Grant 6,410,983 - Moriizumi , et al. June 25, 2 | 2002-06-25 |
Front-and-back electrically conductive substrate and method for manufacturing same
App 20020027022 - Moriizumi, Kiyokazu | 2002-03-07 |
Multilayer thin-film wiring board
Grant 6,303,877 - Moriizumi , et al. October 16, 2 | 2001-10-16 |
Multilayer Thin-film Wiring Board
App 20010011607 - MORIIZUMI, KIYOKAZU ; et al. | 2001-08-09 |
Circuit arrangement for multilayer printed circuit board
Grant 5,496,971 - Moriizumi , et al. March 5, 1 | 1996-03-05 |
Module sealing structure
Grant 4,949,219 - Moriizumi , et al. August 14, 1 | 1990-08-14 |
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