MORIGAMI; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for MORIGAMI; Hideaki.The latest application filed is for "heat radiation member".

Company Profile

0.5.7

MORIGAMI; Hideaki - Toyama-shi Toyama
Morigami; Hideaki - Itami N/A JP
Morigami; Hideaki - Tokyo JP
MORIGAMI; Hideaki - Itami-shi JP
Morigami; Hideaki - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat Radiation Member App 20210398877 - MATSUGI; Ryota ; et al.	2021-12-23
Composite Member App 20210381782 - MATSUGI; Ryota ; et al.	2021-12-09
Composite Member And Method Of Manufacturing Composite Member App 20210002769 - GOTO; Kengo ; et al.	2021-01-07
Manufacturing a heat sink material using a discharge wire Grant 8,664,088 - Morigami , et al. March 4, 2	2014-03-04
Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate Grant 8,178,893 - Takashima , et al. May 15, 2	2012-05-15
Heat Sink Material, Manufacturing Method For The Same, And Semiconductor Laser Device App 20110138627 - MORIGAMI; Hideaki ; et al.	2011-06-16
Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it Grant 7,528,413 - Yoshida , et al. May 5, 2	2009-05-05
Semiconductor Element Mounting Substrate, Semiconductor Device Using the Same, and Method for Manufacturing Semiconductor Element Mounting Substrate App 20090057705 - Takashima; Kouichi ; et al.	2009-03-05
Heat Sink Material, Manufacturing Method For The Same, And Semiconductor Laser Device App 20070215337 - Morigami; Hideaki ; et al.	2007-09-20
Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it App 20050051891 - Yoshida, Katsuhito ; et al.	2005-03-10
Bonding tool, production and handling thereof Grant 5,425,491 - Tanaka , et al. June 20, 1	1995-06-20

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