Moriceau; Hubert

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moriceau; Hubert.The latest application filed is for "method for producing an epitaxial layer on a growth plate".

Company Profile

11.93.85

Moriceau; Hubert - Saint-Egreve FR
Moriceau; Hubert - St. Egreve FR
Moriceau; Hubert - S-Tegreve FR
Moriceau; Hubert - St Egreve F
Moriceau; Hubert - Stegreve FR
Moriceau; Hubert - Eareve FR
Moriceau, Hubert - St Egreise FR
Moriceau; Hubert - Seyssins FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for transferring a useful layer Grant 10,755,967 - Moriceau , et al. A	2020-08-25
Method for transfer of a useful layer Grant 10,727,106 - Moriceau , et al.	2020-07-28
Method for producing an epitaxial layer on a growth plate Grant 10,651,032 - Moriceau , et al.	2020-05-12
Method for direct bonding of III-V semiconductor substrates with a radical oxide layer Grant 10,586,783 - Moriceau , et al.	2020-03-10
Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates Grant 10,497,609 - Fournel , et al. De	2019-12-03
Metal-metal direct bonding method Grant 10,483,111 - Gondcharton , et al. Nov	2019-11-19
Method For Producing An Epitaxial Layer On A Growth Plate App 20190206678 - MORICEAU; Hubert ; et al.	2019-07-04
Method For Transferring A Useful Layer App 20190206721 - MORICEAU; Hubert ; et al.	2019-07-04
Method for transfer of a useful layer App 20190198385 - MORICEAU; Hubert ; et al.	2019-06-27
Method for assembling substrates by bonding indium phosphate surfaces Grant 10,283,364 - Imbert , et al.	2019-05-07
Photovoltaic cell, including a crystalline silicon oxide passivation thin film, and method for producing same Grant 10,276,738 - Mur , et al.	2019-04-30
Method For Assembling Substrates By Bonding Indium Phosphate Surfaces App 20180330950 - IMBERT; Bruno ; et al.	2018-11-15
Method for recycling a substrate holder Grant 10,100,400 - Fournel , et al. October 16, 2	2018-10-16
Method For Direct Bonding Of Substrates Including Thinning Of The Edges Of At Least One Of The Two Substrates App 20180158719 - FOURNEL; Frank ; et al.	2018-06-07
Process for producing a structure by assembling at least two elements by direct adhesive bonding Grant 9,922,953 - Gondcharton , et al. March 20, 2	2018-03-20
Method for performing direct bonding between two structures Grant 9,922,954 - Moriceau , et al. March 20, 2	2018-03-20
Method for producing a strained semiconductor on insulator substrate Grant 9,899,217 - Reboh , et al. February 20, 2	2018-02-20
Metal-metal Direct Bonding Method App 20180019124 - GONDCHARTON; Paul ; et al.	2018-01-18
Method for thinning samples Grant 9,842,742 - Dechamp , et al. December 12, 2	2017-12-12
Method For Performing Direct Bonding Between Two Structures App 20170179073 - MORICEAU; Hubert ; et al.	2017-06-22
Method For Manufacturing Substrates App 20170133347 - MORICEAU; Hubert ; et al.	2017-05-11
Method for thinning samples App 20170117158 - DECHAMP; Jerome ; et al.	2017-04-27
Process For Producing A Structure By Assembling At Least Two Elements By Direct Adhesive Bonding App 20170025377 - GONDCHARTON; Paul ; et al.	2017-01-26
Method of fabricating polymer film in the cavity of a wafer Grant 9,219,004 - Moriceau , et al. December 22, 2	2015-12-22
Method for the treatment and direct bonding of a material layer Grant 9,209,068 - Moriceau , et al. December 8, 2	2015-12-08
Method For Producing A Thick Crystalline Layer App 20150349191 - MORICEAU; Hubert ; et al.	2015-12-03
Method For The Treatment And Direct Bonding Of A Material Layer App 20150194337 - Moriceau; Hubert ; et al.	2015-07-09
Double layer transfer method Grant 9,076,841 - Fournel , et al. July 7, 2	2015-07-07
Method Of Fabricating A Semiconductor Substrate On Insulator App 20150155170 - REBOH; Shay ; et al.	2015-06-04
Method of sealing two plates with the formation of an ohmic contact therebetween Grant 8,975,156 - Pocas , et al. March 10, 2	2015-03-10
Method for transferring a thin layer of monocrystalline silicon Grant 8,906,780 - Argoud , et al. December 9, 2	2014-12-09
Method for producing a photovoltaic cell including the preparation of the surface of a crystalline silicon substrate Grant 8,877,539 - Moriceau , et al. November 4, 2	2014-11-04
Method for producing hybrid components Grant 8,871,607 - Signamarcheix , et al. October 28, 2	2014-10-28
Double Layer Transfer Method App 20140295642 - Fournel; Frank ; et al.	2014-10-02
Method For Performing A Mechanical Operation In A Structure Comprising Two Layers Of Different Stiffness App 20140238213 - Moriceau; Hubert ; et al.	2014-08-28
Method For Recycling A Substrate Holder App 20140178596 - FOURNEL; Frank ; et al.	2014-06-26
Process for fabricating an acoustic wave resonator comprising a suspended membrane Grant 8,715,517 - Imbert , et al. May 6, 2	2014-05-06
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Grant 8,679,946 - Moriceau , et al. March 25, 2	2014-03-25
Method for trimming a structure obtained by the assembly of two plates Grant 8,628,674 - Zussy , et al. January 14, 2	2014-01-14
Process for the transfer of a thin film comprising an inclusion creation step Grant 8,609,514 - Moriceau , et al. December 17, 2	2013-12-17
Process For The Transfer Of A Thin Film Comprising An Inclusion Creation Step App 20130273713 - MORICEAU; Hubert ; et al.	2013-10-17
Process for assembling substrates with low-temperature heat treatments Grant 8,530,331 - Beneyton , et al. September 10, 2	2013-09-10
Manufacturing Process For A Stacked Structure Comprising A Thin Layer Bonding To A Target Substrate App 20130230967 - Moriceau; Hubert ; et al.	2013-09-05
Method for making a planar membrane Grant 8,501,026 - Constancias , et al. August 6, 2	2013-08-06
Process For Producing A Film, For Example A Single-crystal Film, On A Polymer Substrate App 20130196484 - Moriceau; Hubert ; et al.	2013-08-01
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Grant 8,481,409 - Moriceau , et al. July 9, 2	2013-07-09
Process for the transfer of a thin film comprising an inclusion creation step Grant 8,470,712 - Moriceau , et al. June 25, 2	2013-06-25
Manufacturing A Flexible Structure By Transfers Of Layers App 20130156989 - MORICEAU; Hubert ; et al.	2013-06-20
Method For Transferring A Thin Layer Of Monocrystalline Silicon App 20130092320 - Argoud; Maxime ; et al.	2013-04-18
Method For Trimming A Structure Obtained By The Assembly Of Two Plates App 20130078785 - Zussy; Marc ; et al.	2013-03-28
Method for making a stressed structure designed to be dissociated Grant 8,389,379 - Fournel , et al. March 5, 2	2013-03-05
Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water Grant 8,382,933 - Fournel , et al. February 26, 2	2013-02-26
Method for trimming a structure obtained by the assembly of two plates Grant 8,329,048 - Zussy , et al. December 11, 2	2012-12-11
Nitrogen-plasma surface treatment in a direct bonding method Grant 8,318,586 - Libralesso , et al. November 27, 2	2012-11-27
Photovoltaic Cell, Including A Crystalline Silicon Oxide Passivation Thin Film, And Method For Producing Same App 20120291861 - Mur; Pierre ; et al.	2012-11-22
Method For Producing A Photovoltaic Cell Including The Preparation Of The Surface Of A Crystalline Silicon Substrate App 20120288985 - Moriceau; Hubert ; et al.	2012-11-15
Method and device for separating a structure Grant 8,302,278 - Zussy , et al. November 6, 2	2012-11-06
Process for transferring films Grant 8,303,745 - Moriceau , et al. November 6, 2	2012-11-06
Device For Separation Of A Stacked Structure And Associated Method App 20120261076 - Moriceau; Hubert ; et al.	2012-10-18
Method for transferring chips onto a substrate Grant 8,288,250 - Clavelier , et al. October 16, 2	2012-10-16
Method for producing ordered nanostructures Grant 8,207,048 - Fournel , et al. June 26, 2	2012-06-26
Process for Fabricating an Acoustic Wave Resonator Comprising a Suspended Membrane App 20120145667 - IMBERT; Bruno ; et al.	2012-06-14
Stacked structure and production method thereof Grant 8,193,069 - Moriceau , et al. June 5, 2	2012-06-05
Method For Making A Planar Membrane App 20120100719 - Constancias; Christophe ; et al.	2012-04-26
Process For Assembling Substrates With Low-temperature Heat Treatments App 20120088352 - Beneyton; Remi ; et al.	2012-04-12
Deformation moderation method Grant 8,034,208 - Moriceau , et al. October 11, 2	2011-10-11
Method For Producing Hybrid Components App 20110163410 - Signamarcheix; Thomas ; et al.	2011-07-07
Nitrogen-plasma Surface Treatment In A Direct Bonding Method App 20110129986 - Libralesso; Laure ; et al.	2011-06-02
Method of fabricating a mixed microtechnology structure and a structure obtained thereby Grant 7,947,564 - Kostrzewa , et al. May 24, 2	2011-05-24
Solid immersion lens and related method for making same Grant 7,940,477 - Brun , et al. May 10, 2	2011-05-10
Process For The Transfer Of A Thin Film Comprising An Inclusion Creation Step App 20110092051 - Moriceau; Hubert ; et al.	2011-04-21
Assembling two substrates by molecular adhesion Grant 7,906,362 - Feuillet , et al. March 15, 2	2011-03-15
Detachable substrate with controlled mechanical strength and method of producing same Grant 7,902,038 - Aspar , et al. March 8, 2	2011-03-08
Process for the transfer of a thin film Grant 7,883,994 - Moriceau , et al. February 8, 2	2011-02-08
Method of fabricating a microelectronic structure of a semiconductor on insulator type with different patterns Grant 7,879,690 - Augendre , et al. February 1, 2	2011-02-01
Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areas Grant 7,781,300 - Moriceau , et al. August 24, 2	2010-08-24
Method for production of a very thin layer with thinning by means of induced self-support Grant 7,776,714 - Moriceau , et al. August 17, 2	2010-08-17
Method for fabricating a semiconductor on insulator wafer Grant 7,776,716 - Deguet , et al. August 17, 2	2010-08-17
Solid Immersion Lens and Related Method for Making Same App 20100200770 - Brun; Mickael ; et al.	2010-08-12
Method For Making A Stressed Structure Designed To Be Dissociated App 20100167499 - Fournel; Franck ; et al.	2010-07-01
Detachable substrate or detachable structure and method for the production thereof Grant 7,713,369 - Aspar , et al. May 11, 2	2010-05-11
Method Of Producing A Mixed Substrate App 20100081280 - Moriceau; Hubert ; et al.	2010-04-01
Method and device for measuring bond energy Grant 7,688,946 - Rieutord , et al. March 30, 2	2010-03-30
Method For Transferring Chips Onto A Substrate App 20100075461 - Clavelier; Laurent ; et al.	2010-03-25
Methods for preparing a bonding surface of a semiconductor wafer Grant 7,645,392 - Maunand Tussot , et al. January 12, 2	2010-01-12
Compliant Substrate In Particular For Hetero-Epitaxial Depositing App 20090311477 - ASPAR; Bernard ; et al.	2009-12-17
Process For Fabricating A Flexible Electronic Device Of The Screen Type, Including A Plurality Of Thin-film Components App 20090262294 - TEMPLIER; Francois ; et al.	2009-10-22
Method Of Fabricating A Microelectronic Structure Of A Semiconductor On Insulator Type With Different Patterns App 20090246946 - Augendre; Emmanuel ; et al.	2009-10-01
Method for fabricating a substrate with useful layer on high resistivity support Grant 7,586,154 - Ghyselen , et al. September 8, 2	2009-09-08
Simplified method of producing an epitaxially grown structure Grant 7,579,259 - Fournel , et al. August 25, 2	2009-08-25
Method And Device For Separating A Structure App 20090165277 - Zussy; Marc ; et al.	2009-07-02
Process For Assembling Substrates With Low-temperature Heat Treatments App 20090162991 - Beneyton; Remi ; et al.	2009-06-25
Method of producing a complex structure by assembling stressed structures Grant 7,550,052 - Fournel , et al. June 23, 2	2009-06-23
Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized Grant 7,541,263 - Moriceau , et al. June 2, 2	2009-06-02
Deformation Moderation Method App 20090133819 - Moriceau; Hubert ; et al.	2009-05-28
Process For Transferring Films App 20090133811 - Moriceau; Hubert ; et al.	2009-05-28
Method For Trimming A Structure Obtained By The Assembly Of Two Plates App 20090095399 - Zussy; Marc ; et al.	2009-04-16
Method of producing mixed substrates and structure thus obtained Grant 7,494,897 - Fournel , et al. February 24, 2	2009-02-24
Method for the molecular bonding of microelectronic components to a polymer film Grant 7,476,595 - Moriceau , et al. January 13, 2	2009-01-13
Assembling Two Substrates by Molecular Adhesion App 20080296712 - Feuillet; Guy ; et al.	2008-12-04
Simplified Method of Producing an Epitaxially Grown Structure App 20080272396 - Fournel; Frank ; et al.	2008-11-06
Method of preparing a silicon dioxide layer by high temperature oxidation on a substrate having, at least on the surface, germanium or a silicon-germanium alloy Grant 7,435,690 - Moriceau , et al. October 14, 2	2008-10-14
Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water App 20080196747 - Fournel; Frank ; et al.	2008-08-21
Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate Grant 7,407,867 - Ghyselen , et al. August 5, 2	2008-08-05
Method Of Fabricating A Mixed Microtechnology Structue And A Structure Obtained Thereby App 20080079123 - Kostrzewa; Marek ; et al.	2008-04-03
Method and Device for Measuring Bond Energy App 20080063143 - Rieutord; Francois ; et al.	2008-03-13
Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film App 20080041517 - Moriceau; Hubert ; et al.	2008-02-21
Method For Fabricating A Semiconductor On Insulator Wafer App 20070284660 - Deguet; Chrystel ; et al.	2007-12-13
Method For Fabricating A Substrate With Useful Layer On High Resistivity Support App 20070269663 - Ghyselen; Bruno ; et al.	2007-11-22
Method for Providing Mixed Stacked Structures, with Various Insulating Zones and/or Electrically Conductiong Zones Vertically Localized App 20070259528 - Moriceau; Hubert ; et al.	2007-11-08
Process For The Transfer Of A Thin Film App 20070232025 - Moriceau; Hubert ; et al.	2007-10-04
Method For Producing Ordered Nanostructures App 20070228378 - FOURNEL; Franck ; et al.	2007-10-04
Method for fabricating a substrate with useful layer on high resistivity support Grant 7,268,060 - Ghyselen , et al. September 11, 2	2007-09-11
Method for separating wafers bonded together to form a stacked structure Grant 7,264,996 - Moriceau , et al. September 4, 2	2007-09-04
Method For Producing Mixed Stacked Structures, Different Insulating Areas And/Or Localised Vertical Electrical conducting Areas App 20070202660 - Moriceau; Hubert ; et al.	2007-08-30
Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure Grant 7,258,743 - Fournel , et al. August 21, 2	2007-08-21
Method for bonding semiconductor structures together Grant 7,235,461 - Maleville , et al. June 26, 2	2007-06-26
Multifunctional metallic bonding Grant 7,232,739 - Kerdiles , et al. June 19, 2	2007-06-19
Process for the transfer of a thin film Grant 7,229,899 - Moriceau , et al. June 12, 2	2007-06-12
Method for producing a stacked structure Grant 7,229,897 - Fournel , et al. June 12, 2	2007-06-12
Method for the molecular bonding of microelectronic components to a polymer film App 20070117258 - Moriceau; Hubert ; et al.	2007-05-24
Method of sealing two plates with the formation of an ohmic contact therebetween App 20070072391 - Pocas; Stephane ; et al.	2007-03-29
Multifunctional metallic bonding Grant 7,189,632 - Kerdiles , et al. March 13, 2	2007-03-13
Method for production of a very thin layer with thinning by means of induced self-support App 20070020895 - Moriceau; Hubert ; et al.	2007-01-25
Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate App 20060286770 - Ghyselen; Bruno ; et al.	2006-12-21
Stacked structure and production method thereof App 20060281212 - Moriceau; Hubert ; et al.	2006-12-14
Methods for preparing a bonding surface of a semiconductor wafer App 20060273068 - Maunand Tussot; Corinne ; et al.	2006-12-07
Multifunctional metallic bonding App 20060228820 - Kerdiles; Sebastien ; et al.	2006-10-12
Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate Grant 7,115,481 - Ghyselen , et al. October 3, 2	2006-10-03
Method for making a stressed structure designed to be dissociated App 20060205179 - Fournel; Franck ; et al.	2006-09-14
Method of producing mixed substrates and structure thus obtained App 20060166461 - Fournel; Franck ; et al.	2006-07-27
Method of producing a complex structure by assembling stressed structures App 20060141742 - Fournel; Franck ; et al.	2006-06-29
Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials Grant 7,041,227 - Fournel , et al. May 9, 2	2006-05-09
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate App 20060079071 - Moriceau; Hubert ; et al.	2006-04-13
Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer Grant 6,991,995 - Aulnette , et al. January 31, 2	2006-01-31
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials Grant 6,991,944 - Rayssac , et al. January 31, 2	2006-01-31
Method for making a stacked comprising a thin film adhering to a target substrate Grant 6,974,759 - Moriceau , et al. December 13, 2	2005-12-13
Method of preparing a silicon dioxide layer by high temperature oxidation on a substrate having, at least on the surface, germanium or a silicon-germanium alloy App 20050215071 - Moriceau, Hubert ; et al.	2005-09-29
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials App 20050130429 - Rayssac, Olivier ; et al.	2005-06-16
Method for improving the quality of heterostructure App 20050130393 - Blondeau, Beryl ; et al.	2005-06-16
Method for fabricating a substrate with useful layer on high resistivity support App 20050112845 - Ghyselen, Bruno ; et al.	2005-05-26
Method for separating wafers bonded together to form a stacked structure App 20050112847 - Moriceau, Hubert ; et al.	2005-05-26
Method for producing a stacked structure App 20050101095 - Fournel, Franck ; et al.	2005-05-12
Multifunctional metallic bonding App 20050048739 - Kerdiles, Sebastien ; et al.	2005-03-03
Detachable substrate or detachable structure and method for the production thereof App 20050029224 - Aspar, Bernard ; et al.	2005-02-10
Method for bonding semiconductor structures together App 20040248379 - Maleville, Christophe ; et al.	2004-12-09
Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate App 20040248378 - Ghyselen, Bruno ; et al.	2004-12-09
Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer App 20040248380 - Aulnette, Cecile ; et al.	2004-12-09
Method for separating two elements and a device therefor Grant 6,821,376 - Rayssac , et al. November 23, 2	2004-11-23
Detachable substrate with controlled mechanical hold and method for production thereof App 20040222500 - Aspar, Bernard ; et al.	2004-11-11
Method for making a thin film using pressurization Grant 6,809,044 - Aspar , et al. October 26, 2	2004-10-26
Method for producing a buried layer of material in another material Grant 6,808,967 - Aspar , et al. October 26, 2	2004-10-26
Multilayer structure with controlled internal stresses and making same Grant 6,756,285 - Moriceau , et al. June 29, 2	2004-06-29
Method for transferring a thin film comprising a step of generating inclusions Grant 6,756,286 - Moriceau , et al. June 29, 2	2004-06-29
Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials App 20040074866 - Fournel, Franck ; et al.	2004-04-22
Method for automatic organization of microstructures or nanostructures and related device obtained Grant 6,724,017 - Semeria , et al. April 20, 2	2004-04-20
Process for the transfer of a thin film comprising an inclusion creation step App 20040058555 - Moriceau, Hubert ; et al.	2004-03-25
Method for making a stacked structure comprising a thin film adhering to a target substrate App 20040014299 - Moriceau, Hubert ; et al.	2004-01-22
Method for automatic organisation of microstructures or nanostructures and related device obtained App 20030186512 - Semeria, Marie-No?euml;lle ; et al.	2003-10-02
Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure App 20030175531 - Fournel, Frank ; et al.	2003-09-18
Heat treatment method for semiconductor substrates Grant 6,403,450 - Maleville , et al. June 11, 2	2002-06-11
Selective transfer of elements from one support to another support Grant 6,204,079 - Aspar , et al. March 20, 2	2001-03-20
Garnet-type magnetic material high faraday rotation magnetic film containing such a material and process for the production thereof Grant 4,698,281 - Armand , et al. October 6, 1	1987-10-06