Mori; Terutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mori; Terutaka.The latest application filed is for "thin film probe sheet and semiconductor chip inspection system".

Company Profile

0.10.11

Mori; Terutaka - Urayasu JP
Mori; Terutaka - Urayasu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thin Film Probe Sheet And Semiconductor Chip Inspection System App 20110014727 - YABUSHITA; Akira ; et al.	2011-01-20
Connection Device And Test System App 20090209053 - KASUKABE; Susumu ; et al.	2009-08-20
Connection device and test system Grant 7,541,202 - Kasukabe , et al. June 2, 2	2009-06-02
Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip Grant 7,390,732 - Watanabe , et al. June 24, 2	2008-06-24
Fabrication method of semiconductor integrated circuit device Grant 7,351,597 - Wada , et al. April 1, 2	2008-04-01
Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor Device App 20080029763 - Kasukabe; Susumu ; et al.	2008-02-07
Connection Device And Test System App 20080009082 - Kasukabe; Susumu ; et al.	2008-01-10
Connection device and test system Grant 7,285,430 - Kasukabe , et al. October 23, 2	2007-10-23
Fabrication Method Of Semiconductor Integrated Circuit Device App 20070218572 - Wada; Yuji ; et al.	2007-09-20
Fabrication method of semiconductor integrated circuit device Grant 7,219,422 - Wada , et al. May 22, 2	2007-05-22
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Grant 7,198,962 - Kohno , et al. April 3, 2	2007-04-03
Thin film probe sheet and semiconductor chip inspection system App 20060094162 - Yabushita; Akira ; et al.	2006-05-04
Connecting apparatus, semiconductor chip inspecting apparatus, and method for manufacturing semiconductor device App 20060043593 - Mori; Terutaka ; et al.	2006-03-02
Connection device and test system App 20040235207 - Kasukabe, Susumu ; et al.	2004-11-25
Fabrication method of semiconductor integrated circuit device App 20040183556 - Wada, Yuji ; et al.	2004-09-23
Connection device and test system Grant 6,759,258 - Kasukabe , et al. July 6, 2	2004-07-06
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step App 20030203521 - Kohno, Ryuji ; et al.	2003-10-30
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step App 20020182796 - Kohno, Ryuji ; et al.	2002-12-05
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Grant 6,455,335 - Kohno , et al. September 24, 2	2002-09-24
Connector and probing system Grant 6,305,230 - Kasukabe , et al. October 23, 2	2001-10-23
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Grant 6,197,603 - Kohno , et al. March 6, 2	2001-03-06

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