Mori; Ryuichiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mori; Ryuichiro.The latest application filed is for "plastic-packaged semiconductor device including a plurality of chips".
- Mori; Ryuichiro - Tokyo JP
- Mori; Ryuichiro - Itami JP
| Patent | Date |
|---|---|
| Plastic-packaged semiconductor device including a plurality of chips Grant 6,369,447 - Mori April 9, 2 | 2002-04-09 |
| Plastic-packaged Semiconductor Device Including A Plurality Of Chips App 20020000672 - MORI, RYUICHIRO | 2002-01-03 |
| Semiconductor module comprising semiconductor packages Grant 5,903,049 - Mori May 11, 1 | 1999-05-11 |
| Method of making resin molded semiconductor device Grant 5,139,969 - Mori August 18, 1 | 1992-08-18 |
| Resin sealed semiconductor device Grant 4,942,454 - Mori , et al. July 17, 1 | 1990-07-17 |
| Resin-encapsulated semiconductor device Grant 4,884,124 - Mori , et al. November 28, 1 | 1989-11-28 |
| Die bonding apparatus Grant 4,878,610 - Mori , et al. November 7, 1 | 1989-11-07 |
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