Mori; Katsunobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mori; Katsunobu.The latest application filed is for "solar cell module and electronics device including the solar cell module".

Company Profile

0.14.15

Mori; Katsunobu - Osaka-shi JP
Mori; Katsunobu - Nara JP
Mori; Katsunobu - Nara-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solar Cell Module And Electronics Device Including The Solar Cell Module App 20100294342 - Nakanishi; Hiroyuki ; et al.	2010-11-25
Semiconductor device having a leading wiring layer Grant 7,445,958 - Suminoe , et al. November 4, 2	2008-11-04
Semiconductor device having a leading wiring layer App 20060237848 - Suminoe; Shinji ; et al.	2006-10-26
Semiconductor device having a leading wiring layer Grant 7,091,616 - Suminoe , et al. August 15, 2	2006-08-15
Semiconductor device and method for manufacturing semiconductor device App 20060163728 - Nakanishi; Hiroyuki ; et al.	2006-07-27
Semiconductor device and manufacturing method for the same App 20050194686 - Iwazaki, Yoshihide ; et al.	2005-09-08
Semiconductor device in which a plurality of electronic components are combined with each other Grant 6,940,175 - Iwazaki , et al. September 6, 2	2005-09-06
Integrated semiconductor circuit including electronic component connected between different component connection portions Grant 6,921,980 - Nakanishi , et al. July 26, 2	2005-07-26
Semiconductor element, semiconductor device, and method for manufacturing semiconductor element App 20050104165 - Ishio, Toshiya ; et al.	2005-05-19
Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof Grant 6,838,748 - Ishio , et al. January 4, 2	2005-01-04
Manufacturing method of semiconductor device Grant 6,831,002 - Iwazaki , et al. December 14, 2	2004-12-14
Semiconductor device with plating wiring connecting IC electrode pad to terminal Grant 6,784,528 - Nakanishi , et al. August 31, 2	2004-08-31
Semiconductor element, semiconductor device, and method for manufacturing semiconductor element App 20030218257 - Ishio, Toshiya ; et al.	2003-11-27
Manufacturing method of semiconductor device App 20030134509 - Iwazaki, Yoshihide ; et al.	2003-07-17
Semiconductor device, stacked type semiconductor device, and manufacturing method of semiconductor device App 20030111721 - Nakanishi, Hiroyuki ; et al.	2003-06-19
Semiconductor device and method of manufacturing same Grant 6,552,426 - Ishio , et al. April 22, 2	2003-04-22
Semiconductor device and manufacturing method thereof App 20030025173 - Suminoe, Shinji ; et al.	2003-02-06
Semiconductor device and manufacturing method thereof App 20020190392 - Iwazaki, Yoshihide ; et al.	2002-12-19
Integrated semiconductor circuit App 20020113323 - Nakanishi, Hiroyuki ; et al.	2002-08-22
Semiconductor integrated circuit device and manufacturing method thereof Grant 6,396,157 - Nakanishi , et al. May 28, 2	2002-05-28
Semiconductor device and manufacturing method of same App 20020014705 - Ishio, Toshiya ; et al.	2002-02-07
Semiconductor device and method of manufacturing same App 20010040285 - Ishio, Toshiya ; et al.	2001-11-15
Semiconductor integrated circuit device and manufacturing method thereof App 20010017426 - Nakanishi, Hiroyuki ; et al.	2001-08-30
Semiconductor Integrated Circuit Device App 20010013643 - NAKANISHI, HIROYUKI ; et al.	2001-08-16
Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow Grant 6,118,184 - Ishio , et al. September 12, 2	2000-09-12
Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads Grant 6,104,084 - Ishio , et al. August 15, 2	2000-08-15
Semiconductor device having external electrodes formed in concave portions of an anisotropic conductive film Grant 5,604,379 - Mori February 18, 1	1997-02-18
Method of making tape carrier semiconductor device Grant 5,336,650 - Chikawa , et al. August 9, 1	1994-08-09
Method of manufacturing a bump electrode Grant 5,310,699 - Chikawa , et al. May 10, 1	1994-05-10

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