MORI; Hodaka
Patent Applications and Registrations
Patent applications and USPTO patent grants for MORI; Hodaka.The latest application filed is for "sensing system and storage medium storing data structure used in sensing system".
- MORI; Hodaka - Kariya-city JP
- Mori; Hodaka - Kariya JP
| Patent | Date |
|---|---|
| Sensing System And Storage Medium Storing Data Structure Used In Sensing System App 20210364443 - MORI; Hodaka ; et al. | 2021-11-25 |
| Synthetic resin molded article and method for producing the same Grant 10,696,544 - Ishikawa , et al. June 30, 2 | 2020-06-30 |
| Resin molded article and method for manufacturing the same Grant 10,569,456 - Izumi , et al. Feb | 2020-02-25 |
| Resin molded body Grant 10,446,458 - Yamakawa , et al. Oc | 2019-10-15 |
| Resin Metal Joint And Pressure Sensor App 20190232617 - ISHIKAWA; Motomi ; et al. | 2019-08-01 |
| Synthetic Resin Molded Article And Method For Producing The Same App 20190161339 - ISHIKAWA; Motomi ; et al. | 2019-05-30 |
| Method For Producing Resin Molded Body App 20190091907 - MORI; Hodaka ; et al. | 2019-03-28 |
| Resin Molded Body App 20180315675 - YAMAKAWA; Hiroyuki ; et al. | 2018-11-01 |
| Resin Molded Article And Method For Manufacturing The Same App 20170266857 - IZUMI; Ryosuke ; et al. | 2017-09-21 |
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