MORI; Hiroyasu
Patent Applications and Registrations
Patent applications and USPTO patent grants for MORI; Hiroyasu.The latest application filed is for "inductor and method for manufacturing inductor".
- MORI; Hiroyasu - Nagaokakyo-shi JP
- Mori; Hiroyasu - Nagaokakyo JP
- Mori; Hiroyasu - Tsurugashima JP
- MORI; Hiroyasu - Tsurugashima-shi JP
- Mori; Hiroyasu - Kawagoe JP
- Mori; Hiroyasu - Kawagoe-shi JP
- Mori; Hiroyasu - Tamagawa-Mura JP
- Mori, Hiroyasu - Saitama-Ken JP
| Patent | Date |
|---|---|
| Inductor And Method For Manufacturing Inductor App 20220310309 - ARAI; Takumi ; et al. | 2022-09-29 |
| Inductor Grant 11,437,184 - Mori , et al. September 6, 2 | 2022-09-06 |
| Inductor App 20200312534 - MORI; Hiroyasu ; et al. | 2020-10-01 |
| Inductor And Manufacturing Method Thereof App 20200312533 - MORI; Hiroyasu | 2020-10-01 |
| Surface-mount inductor Grant 10,224,144 - Watanabe , et al. | 2019-03-05 |
| Surface-mount Inductor And Method For Manufacturing The Same App 20160181014 - WATANABE; Ryota ; et al. | 2016-06-23 |
| Surface-mount inductor and production method thereof Grant 9,305,702 - Sasamori , et al. April 5, 2 | 2016-04-05 |
| Surface-Mount Inductor App 20140062639 - Sasamori; Kunio ; et al. | 2014-03-06 |
| Surface-mount Inductor And Production Method Thereof App 20140062638 - SASAMORI; Kunio ; et al. | 2014-03-06 |
| Surface-Mount Inductor App 20140062640 - Sasamori; Kunio ; et al. | 2014-03-06 |
| Method for manufacturing laminated electronic component Grant 6,889,423 - Sakakura , et al. May 10, 2 | 2005-05-10 |
| Laminated electronic component and manufacturing method Grant 6,727,795 - Sakakura , et al. April 27, 2 | 2004-04-27 |
| Laminated electronic component and manufacturing method App 20040046631 - Sakakura, Mitsuo ; et al. | 2004-03-11 |
| Method for manufacturing laminated electronic component Grant 6,692,609 - Kobayashi , et al. February 17, 2 | 2004-02-17 |
| Laminated electronic component and manufacturing method App 20020118089 - Sakakura, Mitsuo ; et al. | 2002-08-29 |
| Method for manufacturing laminated electronic component App 20020053128 - Kobayashi, Seiichi ; et al. | 2002-05-09 |
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