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Patent applications and USPTO patent grants for Moret; Eric J. M..The latest application filed is for "adaptive thermal actuator array for wafer-level applications".
Patent | Date |
---|---|
Adaptive thermal actuator array for wafer-level applications Grant 10,120,018 - Moret November 6, 2 | 2018-11-06 |
Adaptive Thermal Actuator Array For Wafer-level Applications App 20180067160 - Moret; Eric J.M. | 2018-03-08 |
Systems, methods, and apparatuses for implementing fast throughput die handling for synchronous multi-die testing Grant 9,835,679 - Moret December 5, 2 | 2017-12-05 |
Positioning and socketing for semiconductor dice Grant 8,797,053 - Rutigliano , et al. August 5, 2 | 2014-08-05 |
Positioning And Socketing For Semiconductor Dice App 20120299609 - Rutigliano; Michael L. ;   et al. | 2012-11-29 |
Temporary package for at-speed functional test of semiconductor chip Grant 7,960,190 - Moret , et al. June 14, 2 | 2011-06-14 |
Temporary Package For At-speed Functional Test Of Semiconductor Chip App 20100151598 - Moret; Eric J. M. ;   et al. | 2010-06-17 |
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