loadpatents
Patent applications and USPTO patent grants for Moreau; David.The latest application filed is for "fin formation for semiconductor device".
Patent | Date |
---|---|
Fin formation for semiconductor device Grant 10,615,255 - Fan , et al. | 2020-04-07 |
Fin Formation For Semiconductor Device App 20170236722 - Fan; Susan S. ;   et al. | 2017-08-17 |
Cryogenic Cooling Apparatus, Methods, And Applications App 20170030626 - Closs; David ;   et al. | 2017-02-02 |
Method for single fin cuts using selective ion implants Grant 9,287,130 - Cai , et al. March 15, 2 | 2016-03-15 |
Extended liner for localized thick copper interconnect Grant 8,946,896 - Moreau , et al. February 3, 2 | 2015-02-03 |
System and Method for Assembly of Packettes Having Closures App 20110265429 - Moreau; David ;   et al. | 2011-11-03 |
System and Method for Assembly of Packettes Having Closures App 20110269610 - Moreau; David ;   et al. | 2011-11-03 |
Extended Liner For Localized Thick Copper Interconnect App 20100171219 - Moreau; David ;   et al. | 2010-07-08 |
NCAGE Code | 4UUH4 | MOREAU, DAVID |
CAGE Code | 4UUH4 | MOREAU, DAVID |
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