Morban; Norliza

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morban; Norliza.The latest application filed is for "semiconductor packages and methods for manufacturing thereof".

Company Profile

4.4.6

Morban; Norliza - Melaka MY
Morban; Norliza - Kg. Pernu MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Packages and Methods for Manufacturing Thereof App 20220199478 - Yeo; Si Hao Vincent ; et al.	2022-06-23
Formation of conductive connection tracks in package mold body using electroless plating Grant 11,296,000 - Danny Koh , et al. April 5, 2	2022-04-05
Semiconductor Package and Method for Fabricating a Semiconductor Package App 20220037222 - Saw; Khay Chwan Andrew ; et al.	2022-02-03
Lead frames for semiconductor packages Grant 11,152,288 - Bonifacio , et al. October 19, 2	2021-10-19
Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating App 20200350222 - Danny Koh; Cher Hau ; et al.	2020-11-05
Lead Frames For Semiconductor Packages App 20200343166 - Bonifacio; Eric Lopez ; et al.	2020-10-29
Formation of conductive connection tracks in package mold body using electroless plating Grant 10,741,466 - Danny Koh , et al. A	2020-08-11
Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating App 20190157173 - Danny Koh; Cher Hau ; et al.	2019-05-23
Universal lead frame for flat no-leads packages Grant 9,252,089 - Mak , et al. February 2, 2	2016-02-02
Universal Lead Frame for Flat No-Leads Packages App 20150303134 - Mak; Chee Hoe ; et al.	2015-10-22

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