Moorthy; Madhu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moorthy; Madhu.The latest application filed is for "atomic layer deposition of tungsten materials".

Company Profile

0.8.7

Moorthy; Madhu - San Jose CA US
Moorthy; Madhu - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Atomic layer deposition of tungsten materials Grant 8,513,116 - Khandelwal , et al. August 20, 2	2013-08-20
Atomic Layer Deposition Of Tungsten Materials App 20120244699 - KHANDELWAL; AMIT ; et al.	2012-09-27
Atomic layer deposition of tungsten materials Grant 8,211,799 - Khandelwal , et al. July 3, 2	2012-07-03
Atomic Layer Deposition Of Tungsten Materials App 20110244682 - KHANDELWAL; AMIT ; et al.	2011-10-06
Atomic layer deposition of tungsten materials Grant 7,964,505 - Khandelwal , et al. June 21, 2	2011-06-21
Methods for depositing tungsten layers employing atomic layer deposition techniques Grant 7,745,333 - Lai , et al. June 29, 2	2010-06-29
Ruthenium or cobalt as an underlayer for tungsten film deposition Grant 7,691,442 - Gandikota , et al. April 6, 2	2010-04-06
Ruthenium As An Underlayer For Tungsten Film Deposition App 20090142474 - Gandikota; Srinivas ; et al.	2009-06-04
Atomic Layer Deposition Of Tungsten Materials App 20090053893 - Khandelwal; Amit ; et al.	2009-02-26
Methods For Depositing Tungsten Layers Employing Atomic Layer Deposition Techniques App 20080280438 - Lai; Ken Kaung ; et al.	2008-11-13
Ruthenium as an underlayer for tungsten film deposition Grant 7,429,402 - Gandikota , et al. September 30, 2	2008-09-30
Methods for depositing tungsten layers employing atomic layer deposition techniques Grant 7,405,158 - Lai , et al. July 29, 2	2008-07-29
Ruthenium as an underlayer for tungsten film deposition App 20060128150 - Gandikota; Srinivas ; et al.	2006-06-15
Methods for depositing tungsten layers employing atomic layer deposition techniques App 20060009034 - Lai; Ken Kaung ; et al.	2006-01-12

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