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Patent applications and USPTO patent grants for Moore; Tanya Yvette.The latest application filed is for "micro-transfer printing stamps and components".
Patent | Date |
---|---|
Multi-layer stamp Grant 11,318,663 - Moore , et al. May 3, 2 | 2022-05-03 |
Micro-transfer Printing Stamps And Components App 20210300098 - Moore; Tanya Yvette ;   et al. | 2021-09-30 |
Transfer stamps with multiple separate pedestals Grant 11,062,936 - Moore , et al. July 13, 2 | 2021-07-13 |
Transfer Stamps With Multiple Separate Pedestals App 20210193500 - Moore; Tanya Yvette ;   et al. | 2021-06-24 |
Structures and methods for electrical connection of micro-devices and substrates Grant 11,024,608 - Meitl , et al. June 1, 2 | 2021-06-01 |
Multi-layer Stamp App 20210101329 - Moore; Tanya Yvette ;   et al. | 2021-04-08 |
High-precision printed structures Grant 10,937,679 - Cok , et al. March 2, 2 | 2021-03-02 |
Multi-layer stamp Grant 10,899,067 - Moore , et al. January 26, 2 | 2021-01-26 |
High-precision Printed Structures App 20200357677 - Cok; Ronald S. ;   et al. | 2020-11-12 |
Interconnection by lateral transfer printing Grant 10,749,093 - Meitl , et al. A | 2020-08-18 |
High-precision printed structures Grant 10,714,374 - Cok , et al. | 2020-07-14 |
Interconnection By Lateral Transfer Printing App 20200052176 - Meitl; Matthew ;   et al. | 2020-02-13 |
Interconnection by lateral transfer printing Grant 10,510,937 - Meitl , et al. Dec | 2019-12-17 |
Interconnection By Lateral Transfer Printing App 20190157532 - Meitl; Matthew ;   et al. | 2019-05-23 |
Structures And Methods For Electrical Connection Of Micro-devices And Substrates App 20180323178 - Meitl; Matthew ;   et al. | 2018-11-08 |
Micro-device Pockets For Transfer Printing App 20180286734 - Meitl; Matthew ;   et al. | 2018-10-04 |
Multi-layer Stamp App 20170173852 - Moore; Tanya Yvette ;   et al. | 2017-06-22 |
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