| Patent | Date |
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Interconnects having sealing structures to enable selective metal capping layers
Grant 9,984,922 - He , et al. May 29, 2 | 2018-05-29 |
Interconnects Having Sealing Structures To Enable Selective Metal Capping Layers
App 20160372366 - HE; Jun ; et al. | 2016-12-22 |
Interconnects having sealing structures to enable selective metal capping layers
Grant 9,437,545 - He , et al. September 6, 2 | 2016-09-06 |
Interconnects Having Sealing Structures To Enable Selective Metal Capping Layers
App 20150097292 - HE; Jun ; et al. | 2015-04-09 |
Interconnects having sealing structures to enable selective metal capping layers
Grant 8,928,125 - He , et al. January 6, 2 | 2015-01-06 |
Interconnects Having Sealing Structures To Enable Selective Metal Capping Layers
App 20120007242 - He; Jun ; et al. | 2012-01-12 |
Interconnects having sealing structures to enable selective metal capping layers
Grant 8,058,710 - He , et al. November 15, 2 | 2011-11-15 |
Method for an improved air gap interconnect structure
Grant 7,629,268 - Dubin , et al. December 8, 2 | 2009-12-08 |
Apparatus for an improved air gap interconnect structure
Grant 7,586,196 - Dubin , et al. September 8, 2 | 2009-09-08 |
Protection of seedlayer for electroplating
App 20090117733 - Dubin; Valery M. ; et al. | 2009-05-07 |
Protection of seedlayer for electroplating
Grant 7,525,196 - Dubin , et al. April 28, 2 | 2009-04-28 |
Interconnects having sealing structures to enable selective metal capping layers
App 20080179748 - He; Jun ; et al. | 2008-07-31 |
Interconnects having sealing structures to enable selective metal capping layers
Grant 7,402,519 - He , et al. July 22, 2 | 2008-07-22 |
Method for an improved air gap interconnect structure
App 20080044999 - Dubin; Valery M. ; et al. | 2008-02-21 |
Methods and apparatuses for producing a polymer memory device
Grant 7,326,981 - Hussein , et al. February 5, 2 | 2008-02-05 |
Apparatus for an improved air gap interconnect structure
App 20070284744 - Dubin; Valery M. ; et al. | 2007-12-13 |
Method and apparatus for an improved air gap interconnect structure
Grant 7,304,388 - Dubin , et al. December 4, 2 | 2007-12-04 |
Selectively converted inter-layer dielectric
Grant 7,239,019 - Leu , et al. July 3, 2 | 2007-07-03 |
Method for improving selectivity of electroless metal deposition
Grant 7,223,694 - Cheng , et al. May 29, 2 | 2007-05-29 |
Interconnects having sealing structures to enable selective metal capping layers
App 20060273431 - He; Jun ; et al. | 2006-12-07 |
Methods and apparatuses for producing a polymer memory device
App 20060157764 - Hussein; Makarem A. ; et al. | 2006-07-20 |
Methods and apparatuses for producing a polymer memory device
Grant 7,078,754 - Hussein , et al. July 18, 2 | 2006-07-18 |
Protection of seedlayer for electroplating
App 20060131750 - Dubin; Valery M. ; et al. | 2006-06-22 |
Method of protecting a seed layer for electroplating
Grant 7,060,617 - Dubin , et al. June 13, 2 | 2006-06-13 |
Method of forming a selectively converted inter-layer dielectric using a porogen material
Grant 7,018,918 - Kloster , et al. March 28, 2 | 2006-03-28 |
Selectively converted inter-layer dielectric
App 20050236714 - Leu, Jihperng ; et al. | 2005-10-27 |
Selectively converted inter-layer dielectric
Grant 6,943,121 - Leu , et al. September 13, 2 | 2005-09-13 |
Selectively Converted Inter-layer Dielectric
App 20050181593 - Leu, Jihperng ; et al. | 2005-08-18 |
Damascene interconnect structures
App 20050146048 - Dubin, Valery M. ; et al. | 2005-07-07 |
Methods and apparatuses for producing a polymer memory device
Grant 6,900,063 - Hussein , et al. May 31, 2 | 2005-05-31 |
Methods And Apparatuses For Producing A Polymer Memory Device
App 20050084985 - Hussein, Makarem A. ; et al. | 2005-04-21 |
Methods and apparatuses for producing a polymer memory device
App 20050082584 - Hussein, Makarem A. ; et al. | 2005-04-21 |
Under bump metallurgy for Lead-Tin bump over copper pad
Grant 6,878,465 - Moon , et al. April 12, 2 | 2005-04-12 |
Removing sacrificial material by thermal decomposition
App 20050042874 - Meagley, Robert P. ; et al. | 2005-02-24 |
Method and apparatus for an improved air gap interconnect structure
App 20040266167 - Dubin, Valery M. ; et al. | 2004-12-30 |
Removing sacrificial material by thermal decomposition
Grant 6,833,320 - Meagley , et al. December 21, 2 | 2004-12-21 |
Method for improving selectivity of electroless metal deposition
App 20040253814 - Cheng, Chin-Chang ; et al. | 2004-12-16 |
Method for forming electroless metal low resistivity interconnects
App 20040248403 - Dubin, Valery M. ; et al. | 2004-12-09 |
Selectively converted inter-layer dielectric
App 20040102032 - Kloster, Grant M. ; et al. | 2004-05-27 |
Romoving sacrificial material by thermal decomposition
App 20040087060 - Meagley, Robert P. ; et al. | 2004-05-06 |
Under bump metallurgy for Lead-Tin bump over copper pad
App 20040060970 - Moon, Peter K. ; et al. | 2004-04-01 |
Under bump metallurgy for lead-tin bump over copper pad
Grant 6,703,069 - Moon , et al. March 9, 2 | 2004-03-09 |
Method of protecting a seed layer for electroplating
App 20040000720 - Dubin, Valery M. ; et al. | 2004-01-01 |
Photoimageable material patterning techniques useful in fabricating conductive lines in circuit structures
Grant 6,649,515 - Moon , et al. November 18, 2 | 2003-11-18 |
Patterning Conductive Lines In Circuit Structures
App 20010021581 - MOON, PETER K ; et al. | 2001-09-13 |
Trench isolation process using nitrogen preconditioning to reduce crystal defects
Grant 6,118,168 - Moon , et al. September 12, 2 | 2000-09-12 |
Trench isolation process using nitrogen preconditioning to reduce crystal defects
Grant 5,985,735 - Moon , et al. November 16, 1 | 1999-11-16 |
Polysilicon polish for patterning improvement
Grant 5,911,111 - Bohr , et al. June 8, 1 | 1999-06-08 |
Shallow trench isolation technique
Grant 5,719,085 - Moon , et al. February 17, 1 | 1998-02-17 |
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