| Patent | Date |
|---|
Centering substrates on a chuck
Grant 10,224,225 - Adderly , et al. | 2019-03-05 |
Centering Substrates On A Chuck
App 20180240694 - Adderly; Shawn A. ; et al. | 2018-08-23 |
Centering substrates on a chuck
Grant 9,997,385 - Adderly , et al. June 12, 2 | 2018-06-12 |
Centering Substrates On A Chuck
App 20170221742 - Adderly; Shawn A. ; et al. | 2017-08-03 |
Apparatus and method for centering substrates on a chuck
Grant 9,685,362 - Adderly , et al. June 20, 2 | 2017-06-20 |
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness
Grant 9,576,863 - Adderly , et al. February 21, 2 | 2017-02-21 |
Controlled metal extrusion opening in semiconductor structure and method of forming
Grant 9,484,301 - Levy , et al. November 1, 2 | 2016-11-01 |
Integrated circuit and interconnect, and method of fabricating same
Grant 9,390,969 - DeMuynck , et al. July 12, 2 | 2016-07-12 |
Method Of Fine-tuning Process Controls During Integrated Circuit Chip Manufacturing Based On Substrate Backside Roughness
App 20160181166 - Adderly; Shawn A. ; et al. | 2016-06-23 |
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness
Grant 9,330,988 - Adderly , et al. May 3, 2 | 2016-05-03 |
Uniform roughness on backside of a wafer
Grant 9,275,868 - Adderly , et al. March 1, 2 | 2016-03-01 |
Controlled Metal Extrusion Opening In Semiconductor Structure And Method Of Forming
App 20150255395 - Levy; Max G. ; et al. | 2015-09-10 |
Apparatus and Method for Centering Substrates on a Chuck
App 20150235881 - Adderly; Shawn A. ; et al. | 2015-08-20 |
Semiconductor structures with metal lines
Grant 9,087,839 - Adderly , et al. July 21, 2 | 2015-07-21 |
Controlled metal extrusion opening in semiconductor structure and method of forming
Grant 9,059,258 - Levy , et al. June 16, 2 | 2015-06-16 |
Integrated Circuit And Interconnect, And Method Of Fabricating Same
App 20150140809 - DeMuynck; David A. ; et al. | 2015-05-21 |
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof
Grant 9,006,703 - Adderly , et al. April 14, 2 | 2015-04-14 |
Method For Reducing Lateral Extrusion Formed In Semiconductor Structures And Semiconductor Structures Formed Thereof
App 20150035117 - Adderly; Shawn A. ; et al. | 2015-02-05 |
Uniform Roughness On Backside Of A Wafer
App 20150021743 - ADDERLY; Shawn A. ; et al. | 2015-01-22 |
Semiconductor Structures With Metal Lines
App 20140291802 - Adderly; Shawn A. ; et al. | 2014-10-02 |
Controlled Metal Extrusion Opening In Semiconductor Structure And Method Of Forming
App 20140246777 - Levy; Max G. ; et al. | 2014-09-04 |
Ferro-electric capacitor modules, methods of manufacture and design structures
Grant 8,450,168 - Gambino , et al. May 28, 2 | 2013-05-28 |
Integrated Circuit And Interconnect, And Method Of Fabricating Same
App 20120086101 - DeMuynck; David A. ; et al. | 2012-04-12 |
Ferro-electric Capacitor Modules, Methods Of Manufacture And Design Structures
App 20110316058 - GAMBINO; Jeffrey P. ; et al. | 2011-12-29 |
Phase change element extension embedded in an electrode
Grant 7,682,945 - Lam , et al. March 23, 2 | 2010-03-23 |
Phase Change Element Extension Embedded In An Electrode
App 20090194757 - Lam; Chung H. ; et al. | 2009-08-06 |
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
Grant 7,511,940 - Coolbaugh , et al. March 31, 2 | 2009-03-31 |
Integrated thin-film resistor with direct contact
Grant 7,382,055 - Coker , et al. June 3, 2 | 2008-06-03 |
Formation Of Metal-insulator-metal Capacitor Simultaneously With Aluminum Metal Wiring Level Using A Hardmask
App 20080019077 - Coolbaugh; Douglas D. ; et al. | 2008-01-24 |
Integrated Thin-film Resistor With Direct Contact
App 20070290272 - Coker; Eric M. ; et al. | 2007-12-20 |
Integrated thin-film resistor with direct contact
Grant 7,303,972 - Coker , et al. December 4, 2 | 2007-12-04 |
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
Grant 7,301,752 - Coolbaugh , et al. November 27, 2 | 2007-11-27 |
Pixel Sensor Structure Including Light Pipe And Method For Fabrication Thereof
App 20070187787 - Ackerson; Kristin M. ; et al. | 2007-08-16 |
Integrated Thin-film Resistor With Direct Contact
App 20070166909 - Coker; Eric M. ; et al. | 2007-07-19 |
Formation Of Metal-insulator-metal Capacitor Simultaneously With Aluminum Metal Wiring Level Using A Hardmask
App 20050272219 - Coolbaugh, Douglas D. ; et al. | 2005-12-08 |
Method for reworking copper metallurgy in semiconductor devices
Grant 6,340,601 - Curran, Jr. , et al. January 22, 2 | 2002-01-22 |
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