MOON; Jeong Tak

Patent Applications and Registrations

Patent applications and USPTO patent grants for MOON; Jeong Tak.The latest application filed is for "lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the same".

Company Profile

0.5.20

MOON; Jeong Tak - Suwon-si KR
Moon; Jeong Tak - Jangan-gu KR
MOON; Jeong Tak - Gyeonggi-do KR
Moon; Jeong Tak - Suwon-city KR
Moon; Jeong-Tak - Seongnam KR
Moon, Jeong-Tak - Seongnam-City KR
Moon, Jeong-Tak - Kyongki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead-free Solder Alloy, Solder Paste Comprising The Same, And Semiconductor Device Comprising The Same App 20220212293 - SON; Jae Yeol ; et al.	2022-07-07
Pin-grid-array-type Semiconductor Package App 20210375811 - SON; Jae Yeol ; et al.	2021-12-02
Semiconductor Package Using Core Material For Reverse Reflow App 20210366858 - SON; Jae Yeol ; et al.	2021-11-25
Core For Reverse Reflow, Semiconductor Package, And Method Of Fabricating Semiconductor Package App 20160315040 - SON; Jae Yeol ; et al.	2016-10-27
Solder Ball For Fluxless Bonding, Method Of Manufacturing The Same, And Method Of Forming Solder Bump App 20160244891 - SON; Jae Yeol ; et al.	2016-08-25
Solder balls and semiconductor device employing the same Grant 9,391,039 - Moon , et al. July 12, 2	2016-07-12
Solder Balls And Semiconductor Device Employing The Same App 20150380373 - MOON; Jeong Tak ; et al.	2015-12-31
Lead free solder bumps Grant 9,156,111 - Hong , et al. October 13, 2	2015-10-13
Lead-free Solder, Solder Paste And Semiconductor Device App 20150151386 - HONG; Sung Jae ; et al.	2015-06-04
Metal Ball Fabricating Apparatus App 20150064293 - MOON; Jeong Tak ; et al.	2015-03-05
Anode Active Material For Secondary Battery, And Secondary Battery Including Same App 20140332716 - HONG; Soon Ho ; et al.	2014-11-13
Anode Active Material For Secondary Battery And Method For Manufacturing Same App 20140291574 - HONG; Soon Ho ; et al.	2014-10-02
Tin-based Solder Ball And Semiconductor Package Including The Same App 20140284794 - Lee; Jae Hong ; et al.	2014-09-25
Anode Active Material For Secondary Battery And Method Of Manufacturing The Same App 20140203207 - Jeon; Hee Sang ; et al.	2014-07-24
Anode Active Material For Secondary Battery And Method Of Manufacturing The Same App 20140199594 - HONG; Soon Ho ; et al.	2014-07-17
Tin-based solder ball and semiconductor package including the same Grant 8,716,860 - Lee , et al. May 6, 2	2014-05-06
Anode Active Material For Secondary Battery And Secondary Battery Including The Same App 20140023928 - JEON; Sung Min ; et al.	2014-01-23
Tin-based Solder Ball And Semiconductor Package Including The Same App 20130175688 - LEE; Young Woo ; et al.	2013-07-11
Au-Ag based alloy wire for semiconductor package Grant 8,022,541 - Cho , et al. September 20, 2	2011-09-20
Ag-based Alloy Wire For Semiconductor Package App 20080240975 - Cho; Jong Soo ; et al.	2008-10-02
SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY App 20080230915 - CHO; Jong Soo ; et al.	2008-09-25
Au-ag Based Alloy Wire For Semiconductor Package App 20070278634 - Cho; Jong Soo ; et al.	2007-12-06
Gold-silver bonding wire for semiconductor device Grant 6,700,199 - Moon , et al. March 2, 2	2004-03-02
Gold-silver bonding wire for semiconductor device App 20030209810 - Moon, Jeong-Tak ; et al.	2003-11-13
Apparatus for manufacturing solder balls App 20020005606 - Lee, Jin-Hyung ; et al.	2002-01-17

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