Moon; Ho-Jeong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moon; Ho-Jeong.The latest application filed is for "x-ray system, semiconductor package, and tray having x-ray absorption filter".

Company Profile

1.10.14

Moon; Ho-Jeong - Daejeon KR
Moon; Ho-Jeong - Cheonan-si KR
Moon; Ho-Jeong - Hwasung-City KR
Moon; Ho-Jeong - Seoul KR
Moon; Ho-Jeong - Chungcheongnam-do KR
Moon; Ho-Jeong - Cheonan-City KR
Moon; Ho-Jeong - Cheonan KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
X-ray system, semiconductor package, and tray having X-ray absorption filter Grant 11,217,495 - Kim , et al. January 4, 2	2022-01-04
X-ray System, Semiconductor Package, And Tray Having X-ray Absorption Filter App 20200402864 - KIM; SANG-YOUNG ; et al.	2020-12-24
X-ray System, Semiconductor Package, And Tray Having X-ray Absorption Filter App 20170301591 - KIM; SANG-YOUNG ; et al.	2017-10-19
X-ray system, semiconductor package, and tray having X-ray absorption filter Grant 9,728,293 - Kim , et al. August 8, 2	2017-08-08
X-ray System, Semiconductor Package, And Tray Having X-ray Absorption Filter App 20150103974 - KIM; SANG-YOUNG ; et al.	2015-04-16
Adhesion test method using elastic plate Grant 8,448,506 - Yoon , et al. May 28, 2	2013-05-28
Adhesion Test Method Using Elastic Plate App 20100206062 - YOON; Yeo-Hoon ; et al.	2010-08-19
Method Of Conducting Preconditioned Reliability Test Of Semiconductor Package Using Convection And 3-d Imaging App 20100177165 - Oh; Hye-Kyong ; et al.	2010-07-15
Circuit board having a heating means and a hermetically sealed multi-chip package Grant 7,692,291 - Moon , et al. April 6, 2	2010-04-06
Semiconductor packages and electronic products employing the same App 20090146300 - Yang; Se-Young ; et al.	2009-06-11
Semiconductor package having thermal interface material (TIM) Grant 7,081,375 - Baek , et al. July 25, 2	2006-07-25
Method of forming a solder ball on a board and the board App 20060035453 - Kim; Seung-Woo ; et al.	2006-02-16
Ball grid array attaching means having improved reliability and method of manufacturing same Grant 6,963,033 - Kim , et al. November 8, 2	2005-11-08
Semiconductor package having thermal interface material (TIM) App 20040197948 - Baek, Joong-Hyun ; et al.	2004-10-07
Multi-chip package with soft element and method of manufacturing the same App 20040163843 - Shin, Dong-Kil ; et al.	2004-08-26
Semiconductor package having thermal interface material (TIM) Grant 6,756,668 - Baek , et al. June 29, 2	2004-06-29
Hollow solder structure having improved reliability and method of manufacturing same Grant 6,638,638 - Kim , et al. October 28, 2	2003-10-28
Semiconductor package having thermal interface material (TIM) App 20030080411 - Baek, Joong-Hyun ; et al.	2003-05-01
Hollow Solder Structure Having Improved Reliability And Method Of Manufacturing Same App 20030052156 - Kim, Sang-Young ; et al.	2003-03-20
Ball grid array attaching means having improved reliability and method of manufacturing same App 20030051909 - Kim, Sang-Young ; et al.	2003-03-20
Circuit board having a heating means and a hermetically sealed multi-chip package App 20020158330 - Moon, Ho-Jeong ; et al.	2002-10-31

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