Patent | Date |
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Semiconductor device and manufacturing method of semiconductor device using metal oxide Grant 9,515,189 - Wenxu , et al. December 6, 2 | 2016-12-06 |
Structure including gallium nitride substrate and method of manufacturing the gallium nitride substrate Grant 9,337,029 - Wenxu , et al. May 10, 2 | 2016-05-10 |
Graphene devices and methods of manufacturing the same Grant 9,293,596 - Xianyu , et al. March 22, 2 | 2016-03-22 |
Transistors and methods of manufacturing the same Grant 9,257,508 - Lee , et al. February 9, 2 | 2016-02-09 |
Semiconductor Device And Manufacturing Method Of Semiconductor Device Using Metal Oxide App 20160035898 - WENXU; Xianyu ;   et al. | 2016-02-04 |
Graphene transferring methods, device manufacturing method using the same, and substrate structures including graphene Grant 9,196,478 - Lee , et al. November 24, 2 | 2015-11-24 |
Semiconductor device and manufacturing method of semiconductor device using metal oxide Grant 9,184,052 - Wenxu , et al. November 10, 2 | 2015-11-10 |
Structure Including Gallium Nitride Substrate And Method Of Manufacturing The Gallium Nitride Substrate App 20150214037 - WENXU; Xianyu ;   et al. | 2015-07-30 |
Methods of transferring semiconductor elements and manufacturing semiconductor devices Grant 9,082,844 - Cho , et al. July 14, 2 | 2015-07-14 |
Graphene Devices And Methods Of Manufacturing The Same App 20150179814 - XIANYU; Wenxu ;   et al. | 2015-06-25 |
Methods of transferring graphene and manufacturing device using the same Grant 9,056,424 - Wenxu , et al. June 16, 2 | 2015-06-16 |
Method Of Manufacturing Optical Film For Reducing Color Shift, Organic Light-emitting Display Apparatus Using Optical Film For Reducing Color Shift, And Method Of Manufacturing The Same App 20150144918 - CHO; Eun-hyoung ;   et al. | 2015-05-28 |
Electrowetting device and method of manufacturing the same Grant 9,041,999 - Bae , et al. May 26, 2 | 2015-05-26 |
Structure including gallium nitride substrate and method of manufacturing the gallium nitride substrate Grant 9,029,860 - Wenxu , et al. May 12, 2 | 2015-05-12 |
Graphene device and method of manufacturing the same Grant 9,006,044 - Lee , et al. April 14, 2 | 2015-04-14 |
Graphene devices and methods of manufacturing the same Grant 8,999,812 - Xianyu , et al. April 7, 2 | 2015-04-07 |
Electrode structures, gallium nitride based semiconductor devices including the same and methods of manufacturing the same Grant 9,000,485 - Lee , et al. April 7, 2 | 2015-04-07 |
Selective low-temperature ohmic contact formation method for group III-nitride heterojunction structured device Grant 08921220 - | 2014-12-30 |
Selective low-temperature ohmic contact formation method for group III-nitride heterojunction structured device Grant 8,921,220 - Wenxu , et al. December 30, 2 | 2014-12-30 |
Graphene Transferring Methods, Device Manufacturing Method Using The Same, And Substrate Structures Including Graphene App 20140335681 - LEE; Joo-ho ;   et al. | 2014-11-13 |
Graphene device manufacturing apparatus and graphene device manufacturing method using the apparatus Grant 8,877,572 - Lee , et al. November 4, 2 | 2014-11-04 |
Metal-based Solder Composite Including Conductive Self-healing Materials App 20140299231 - CHU; Kun-mo ;   et al. | 2014-10-09 |
Methods Of Transferring Semiconductor Elements And Manufacturing Semiconductor Devices App 20140242782 - CHO; Eun-hyoung ;   et al. | 2014-08-28 |
Methods Of Transferring Graphene And Manufacturing Device Using The Same App 20140174640 - WENXU; Xianyu ;   et al. | 2014-06-26 |
Bonded Substrate Structure Using Siloxane-based Monomer And Method Of Manufacturing The Same App 20140162053 - LEE; Jeong-yub ;   et al. | 2014-06-12 |
Semiconductor Device And Manufacturing Method Of Semiconductor Device Using Metal Oxide App 20140117349 - WENXU; Xianyu ;   et al. | 2014-05-01 |
Structure Including Gallium Nitride Substrate And Method Of Manufacturing The Gallium Nitride Substrate App 20140110717 - WENXU; Xianyu ;   et al. | 2014-04-24 |
Superhydrophobic electromagnetic field shielding material and method of preparing the same Grant 8,680,497 - Cho , et al. March 25, 2 | 2014-03-25 |
Graphene Device Manufacturing Apparatus And Graphene Device Manufacturing Method Using The Apparatus App 20140030857 - LEE; Joo-ho ;   et al. | 2014-01-30 |
LED package structure and manufacturing method, and LED array module Grant 8,592,231 - Shin , et al. November 26, 2 | 2013-11-26 |
Selective Low-temperature Ohmic Contact Formation Method For Group Iii-nitride Heterojunction Structured Device App 20130252410 - WENXU; Xianyu ;   et al. | 2013-09-26 |
Soldering structure and method using Zn Grant 8,517,249 - Choi , et al. August 27, 2 | 2013-08-27 |
Graphene Device And Method Of Manufacturing The Same App 20130193411 - Lee; Chang-seung ;   et al. | 2013-08-01 |
Transistors And Methods Of Manufacturing The Same App 20130193412 - LEE; Chang-seung ;   et al. | 2013-08-01 |
Graphene Devices And Methods Of Manufacturing The Same App 20130161587 - Xianyu; Wenxu ;   et al. | 2013-06-27 |
Electrode Structures, Gallium Nitride Based Semiconductor Devices Including The Same And Methods Of Manufacturing The Same App 20130105863 - Lee; Jeong-yub ;   et al. | 2013-05-02 |
Superhydrophobic Electromagnetic Field Shielding Material And Method Of Preparing The Same App 20130075632 - Cho; Eun-Hyoung ;   et al. | 2013-03-28 |
Electrowetting Device And Method Of Manufacturing The Same App 20130050802 - BAE; Ki-deok ;   et al. | 2013-02-28 |
LED package and fabrication method thereof Grant 8,334,585 - Kwon , et al. December 18, 2 | 2012-12-18 |
Method of manufacturing image forming element, image forming element, and image forming apparatus having the same Grant 8,269,806 - Kwon , et al. September 18, 2 | 2012-09-18 |
Image forming element and manufacturing method thereof Grant 8,162,471 - Shin , et al. April 24, 2 | 2012-04-24 |
Flexible device, flexible pressure sensor Grant 8,107,248 - Shin , et al. January 31, 2 | 2012-01-31 |
Piezoelectric inkjet printhead Grant 8,042,919 - Lim , et al. October 25, 2 | 2011-10-25 |
Light emitting device and method of manufacturing the same Grant 8,013,349 - Choi , et al. September 6, 2 | 2011-09-06 |
LED array module Grant 8,002,443 - Shin , et al. August 23, 2 | 2011-08-23 |
Inkjet printhead having piezoelectric actuator and method of driving the piezoelectric actuator Grant 8,002,391 - Lee , et al. August 23, 2 | 2011-08-23 |
Led Package And Fabrication Method Thereof App 20110175132 - KWON; Ki-hwan ;   et al. | 2011-07-21 |
LED package and fabrication method thereof Grant 7,928,545 - Kwon , et al. April 19, 2 | 2011-04-19 |
Led Package Structure And Manufacturing Method, And Led Array Module App 20110003412 - SHIN; Su-ho ;   et al. | 2011-01-06 |
LED package structure and manufacturing method, and LED array module Grant 7,821,027 - Shin , et al. October 26, 2 | 2010-10-26 |
Method of manufacturing an image drum Grant 7,784,177 - Back , et al. August 31, 2 | 2010-08-31 |
Light emitting device package having a transparent cover Grant 7,781,788 - Darbinian , et al. August 24, 2 | 2010-08-24 |
Inkjet Printhead Having Piezoelectric Actuator And Method Of Driving The Piezoelectric Actuator App 20100194828 - LEE; Hwa-sun ;   et al. | 2010-08-05 |
Wafer level package for surface acoustic wave device and fabrication method thereof Grant 7,755,151 - Lim , et al. July 13, 2 | 2010-07-13 |
Piezoelectric Inkjet Printhead App 20100171797 - LIM; Seung-mo ;   et al. | 2010-07-08 |
Backlight module including at least one luminescence element, and method of fabricating the same Grant 7,741,774 - Choi , et al. June 22, 2 | 2010-06-22 |
Inkjet printhead having piezoelectric actuator and method of driving the piezoelectric actuator Grant 7,722,166 - Lee , et al. May 25, 2 | 2010-05-25 |
Piezoelectric inkjet printhead Grant 7,699,442 - Lim , et al. April 20, 2 | 2010-04-20 |
Flexible Device, Flexible Pressure Sensor, And Fabrication Method Thereof App 20090273909 - SHIN; Kyu-ho ;   et al. | 2009-11-05 |
Lighting device Grant 7,553,047 - Shin , et al. June 30, 2 | 2009-06-30 |
Method Of Manufacturing Image Forming Element, Image Forming Element, And Image Forming Apparatus Having The Same App 20090142712 - Kwon; Ki-hwan ;   et al. | 2009-06-04 |
LED package, manufacturing method thereof, and LED array module using the same Grant 7,514,718 - Shin , et al. April 7, 2 | 2009-04-07 |
Toner adsorption image forming apparatus Grant 7,489,327 - Kweon , et al. February 10, 2 | 2009-02-10 |
Image Forming Element And Fabricating Method Thereof, And Image Forming Apparatus App 20080292814 - KIM; Woon-bae ;   et al. | 2008-11-27 |
Fabrication method of packaging substrate and packaging method using the packaging substrate Grant 7,452,809 - Lee , et al. November 18, 2 | 2008-11-18 |
Wafer level packaging cap and fabrication method thereof Grant 7,449,366 - Lee , et al. November 11, 2 | 2008-11-11 |
Image Forming Element And Fabricating Method Thereof, And Image Forming Apparatus Having The Image Forming Element App 20080252712 - Shin; Su-ho ;   et al. | 2008-10-16 |
Soldering Structure And Method Using Zn App 20080223906 - Choi; Won-kyoung ;   et al. | 2008-09-18 |
High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor Grant 7,417,525 - Lee , et al. August 26, 2 | 2008-08-26 |
Image Forming Element And Its Manufacturing Apparatus And Method App 20080136889 - Yoon; Eung-Yeoul ;   et al. | 2008-06-12 |
Image forming element and manufacturing method thereof App 20080131175 - Shin; Su Ho ;   et al. | 2008-06-05 |
Multi stack packaging chip and method of manufacturing the same Grant 7,335,974 - Hwang , et al. February 26, 2 | 2008-02-26 |
Lighting device App 20080037226 - Shin; Su-ho ;   et al. | 2008-02-14 |
Light emitting device and method of manufacturing the same App 20080023687 - Choi; Seung Tae ;   et al. | 2008-01-31 |
Backlight module including at least one luminescence element, and method of fabricating the same App 20070290613 - Choi; Seung-tae ;   et al. | 2007-12-20 |
Gyro-sensor comprising a plurality of component units, and fabricating method thereof Grant 7,263,883 - Park , et al. September 4, 2 | 2007-09-04 |
Light emitting device package and method of manufacturing the same App 20070194336 - Shin; Su-ho ;   et al. | 2007-08-23 |
Piezoelectric inkjet printhead App 20070176980 - Lim; Seung-mo ;   et al. | 2007-08-02 |
Inkjet printhead having piezoelectric actuator and method of driving the piezoelectric actuator App 20070171262 - Lee; Hwa-sun ;   et al. | 2007-07-26 |
Light emitting device package and method of manufacturing the same App 20070145393 - Darbinian; Arthur ;   et al. | 2007-06-28 |
Image drum and method for manufacturing the image drum App 20070137776 - Back; Kae Dong ;   et al. | 2007-06-21 |
Image forming apparatus App 20070140740 - Kweon; Soon Cheol ;   et al. | 2007-06-21 |
Wafer level package for surface acoustic wave device and fabrication method thereof App 20070096227 - Lim; Ji-hyuk ;   et al. | 2007-05-03 |
Wafer level packaging cap and fabrication method thereof App 20070085195 - Lee; Moon-chul ;   et al. | 2007-04-19 |
High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor App 20070085648 - Lee; Moon Chul ;   et al. | 2007-04-19 |
LED package and fabrication method thereof App 20070039164 - Kwon; Ki-hwan ;   et al. | 2007-02-22 |
LED package and method for fabricating the same App 20070029570 - Shin; Su-ho ;   et al. | 2007-02-08 |
Image drum and a manufacturing method thereof App 20070024691 - Shin; Kyu-ho ;   et al. | 2007-02-01 |
Micro-mirror device package and method for fabricating the same App 20070024549 - Choi; Won-kyoung ;   et al. | 2007-02-01 |
LED package structure and manufacturing method, and LED array module App 20070023893 - Shin; Su-ho ;   et al. | 2007-02-01 |
Led array module App 20070001582 - Shin; Su-ho ;   et al. | 2007-01-04 |
LED package, manufacturing method thereof, and LED array module using the same App 20060279949 - Shin; Kyu-ho ;   et al. | 2006-12-14 |
Multi stack packaging chip and method of manufacturing the same App 20060255443 - Hwang; Jun-sik ;   et al. | 2006-11-16 |
Image sensor package, solid state imaging device, and fabrication methods thereof App 20060138579 - Shin; Kyu-ho ;   et al. | 2006-06-29 |
Fabrication method of packaging substrate and packaging method using the packaging substrate App 20060094158 - Lee; Moon-chul ;   et al. | 2006-05-04 |
Flexible device, flexible pressure sensor, and fabrication method thereof App 20060056161 - Shin; Kyu-ho ;   et al. | 2006-03-16 |
Cap wafer, semiconductor package, and fabricating method thereof App 20060022325 - Hwang; Jun-sik ;   et al. | 2006-02-02 |
Gyro-sensor comprising a plurality of component units, and fabricating method thereof App 20050262941 - Park, Tae-sik ;   et al. | 2005-12-01 |
Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same Grant 6,884,650 - Lee , et al. April 26, 2 | 2005-04-26 |
Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same App 20040106294 - Lee, Eun Sung ;   et al. | 2004-06-03 |
Ink-jet printer head Grant 6,619,779 - Jeon , et al. September 16, 2 | 2003-09-16 |
Ink-jet printer head App 20020041301 - Jeon, Chan-Bong ;   et al. | 2002-04-11 |
Apparatus for jetting ink using a magnet and a plurality of coils installed on a plate to generate a magnetic field Grant 6,244,690 - Kwon , et al. June 12, 2 | 2001-06-12 |
Semiconductor wafer pre-aligning apparatus Grant 5,669,752 - Moon September 23, 1 | 1997-09-23 |