loadpatents
Patent applications and USPTO patent grants for Montez; Ruben B..The latest application filed is for "rough mems surface".
Patent | Date |
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Forming a eutectic bond between a wafer having an anti-stiction coating and a cap wafer Grant 10,427,929 - Montez , et al. October 1, 2 | 2019-10-01 |
Rough MEMS surface Grant 9,988,260 - Montez , et al. June 5, 2 | 2018-06-05 |
Method for selective etching using dry film photoresist Grant 9,960,081 - Stevens , et al. May 1, 2 | 2018-05-01 |
Rough Mems Surface App 20170313573 - MONTEZ; RUBEN B. ;   et al. | 2017-11-02 |
Reducing MEMS stiction by deposition of nanoclusters Grant 9,776,853 - Steimle , et al. October 3, 2 | 2017-10-03 |
Etch release residue removal using anhydrous solution Grant 9,663,356 - Kundalgurki , et al. May 30, 2 | 2017-05-30 |
Bonded wafer structure having cavities with low pressure and method for forming Grant 9,637,372 - Steimle , et al. May 2, 2 | 2017-05-02 |
Reducing MEMS stiction by increasing surface roughness Grant 9,550,664 - Montez , et al. January 24, 2 | 2017-01-24 |
Bonded Wafer Structure Having Cavities With Low Pressure And Method For Forming App 20160311676 - STEIMLE; Robert F. ;   et al. | 2016-10-27 |
Reducing MEMS stiction by introduction of a carbon barrier Grant 9,463,973 - Montez , et al. October 11, 2 | 2016-10-11 |
Systems and methods for anchoring components in MEMS semiconductor devices Grant 9,458,010 - Montez , et al. October 4, 2 | 2016-10-04 |
Method of making a MEMS die having a MEMS device on a suspended structure Grant 9,458,008 - Dawson , et al. October 4, 2 | 2016-10-04 |
Fabrication Method For Suspended Mems Device App 20160272482 - DAWSON; CHAD S. ;   et al. | 2016-09-22 |
Reducing MEMS stiction by deposition of nanoclusters Grant 9,434,602 - Steimle , et al. September 6, 2 | 2016-09-06 |
Glass frit wafer bond protective structure Grant 9,425,115 - Montez , et al. August 23, 2 | 2016-08-23 |
Glass Frit Wafer Bond Protective Structure App 20160218045 - MONTEZ; RUBEN B. ;   et al. | 2016-07-28 |
Reducing Mems Stiction By Increasing Surface Roughness App 20160176707 - Montez; Ruben B. ;   et al. | 2016-06-23 |
Reducing Mems Stiction By Deposition Of Nanoclusters App 20160167944 - Steimle; Robert F. ;   et al. | 2016-06-16 |
Through substrate via with diffused conductive component Grant 9,318,376 - Holm , et al. April 19, 2 | 2016-04-19 |
Reducing MEMS stiction by deposition of nanoclusters Grant 9,290,380 - Steimle , et al. March 22, 2 | 2016-03-22 |
Reducing Mems Stiction By Deposition Of Nanoclusters App 20160031698 - Steimle; Robert F. ;   et al. | 2016-02-04 |
Etch Release Residue Removal Using Anhydrous Solution App 20150368099 - Kundalgurki; Srivatsa G. ;   et al. | 2015-12-24 |
Reducing microelectromechanical systems stiction by formation of a silicon carbide layer Grant 9,108,842 - Turner , et al. August 18, 2 | 2015-08-18 |
Reducing Mems Stiction By Introduction Of A Carbon Barrier App 20150054096 - MONTEZ; RUBEN B. ;   et al. | 2015-02-26 |
Reducing Microelectromechanical Systems Stiction By Formation Of A Silicon Carbide Layer App 20150021717 - Turner; Michael D. ;   et al. | 2015-01-22 |
Reducing MEMS stiction by introduction of a carbon barrier Grant 8,895,339 - Montez , et al. November 25, 2 | 2014-11-25 |
Reducing Mems Stiction By Introduction Of A Carbon Barrier App 20140167188 - Montez; Ruben B. ;   et al. | 2014-06-19 |
Reducing Mems Stiction By Deposition Of Nanoclusters App 20140167189 - Steimle; Robert F. ;   et al. | 2014-06-19 |
Glass frit wafer bond protective structure Grant 8,633,088 - Montez , et al. January 21, 2 | 2014-01-21 |
Substrate bonding with metal germanium silicon material Grant 8,592,926 - Montez , et al. November 26, 2 | 2013-11-26 |
Glass Frit Wafer Bond Protective Structure App 20130285228 - Montez; Ruben B. ;   et al. | 2013-10-31 |
Method of making a micro-electro-mechanical-systems (MEMS) device Grant 8,455,286 - Karlin , et al. June 4, 2 | 2013-06-04 |
Substrate Bonding With Metal Germanium Silicon Material App 20120068325 - Montez; Ruben B. ;   et al. | 2012-03-22 |
Substrate bonding with metal germanium silicon material Grant 8,058,143 - Montez , et al. November 15, 2 | 2011-11-15 |
Method of producing microelectromechanical device with isolated microstructures Grant 7,943,525 - Zhang , et al. May 17, 2 | 2011-05-17 |
Substrate Bonding With Metal Germanium Silicon Material App 20100181676 - MONTEZ; RUBEN B. ;   et al. | 2010-07-22 |
Microelectromechanical Device With Isolated Microstructures And Method Of Producing Same App 20100155861 - Zhang; Lisa Z. ;   et al. | 2010-06-24 |
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