loadpatents
name:-0.019340991973877
name:-0.025676965713501
name:-0.0014419555664062
Montez; Ruben B. Patent Filings

Montez; Ruben B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Montez; Ruben B..The latest application filed is for "rough mems surface".

Company Profile
1.29.22
  • Montez; Ruben B. - Cedar Park TX
  • Montez; Ruben B. - Austin TX
  • Montez; Ruben B - Cedar Park TX US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Forming a eutectic bond between a wafer having an anti-stiction coating and a cap wafer
Grant 10,427,929 - Montez , et al. October 1, 2
2019-10-01
Rough MEMS surface
Grant 9,988,260 - Montez , et al. June 5, 2
2018-06-05
Method for selective etching using dry film photoresist
Grant 9,960,081 - Stevens , et al. May 1, 2
2018-05-01
Rough Mems Surface
App 20170313573 - MONTEZ; RUBEN B. ;   et al.
2017-11-02
Reducing MEMS stiction by deposition of nanoclusters
Grant 9,776,853 - Steimle , et al. October 3, 2
2017-10-03
Etch release residue removal using anhydrous solution
Grant 9,663,356 - Kundalgurki , et al. May 30, 2
2017-05-30
Bonded wafer structure having cavities with low pressure and method for forming
Grant 9,637,372 - Steimle , et al. May 2, 2
2017-05-02
Reducing MEMS stiction by increasing surface roughness
Grant 9,550,664 - Montez , et al. January 24, 2
2017-01-24
Bonded Wafer Structure Having Cavities With Low Pressure And Method For Forming
App 20160311676 - STEIMLE; Robert F. ;   et al.
2016-10-27
Reducing MEMS stiction by introduction of a carbon barrier
Grant 9,463,973 - Montez , et al. October 11, 2
2016-10-11
Systems and methods for anchoring components in MEMS semiconductor devices
Grant 9,458,010 - Montez , et al. October 4, 2
2016-10-04
Method of making a MEMS die having a MEMS device on a suspended structure
Grant 9,458,008 - Dawson , et al. October 4, 2
2016-10-04
Fabrication Method For Suspended Mems Device
App 20160272482 - DAWSON; CHAD S. ;   et al.
2016-09-22
Reducing MEMS stiction by deposition of nanoclusters
Grant 9,434,602 - Steimle , et al. September 6, 2
2016-09-06
Glass frit wafer bond protective structure
Grant 9,425,115 - Montez , et al. August 23, 2
2016-08-23
Glass Frit Wafer Bond Protective Structure
App 20160218045 - MONTEZ; RUBEN B. ;   et al.
2016-07-28
Reducing Mems Stiction By Increasing Surface Roughness
App 20160176707 - Montez; Ruben B. ;   et al.
2016-06-23
Reducing Mems Stiction By Deposition Of Nanoclusters
App 20160167944 - Steimle; Robert F. ;   et al.
2016-06-16
Through substrate via with diffused conductive component
Grant 9,318,376 - Holm , et al. April 19, 2
2016-04-19
Reducing MEMS stiction by deposition of nanoclusters
Grant 9,290,380 - Steimle , et al. March 22, 2
2016-03-22
Reducing Mems Stiction By Deposition Of Nanoclusters
App 20160031698 - Steimle; Robert F. ;   et al.
2016-02-04
Etch Release Residue Removal Using Anhydrous Solution
App 20150368099 - Kundalgurki; Srivatsa G. ;   et al.
2015-12-24
Reducing microelectromechanical systems stiction by formation of a silicon carbide layer
Grant 9,108,842 - Turner , et al. August 18, 2
2015-08-18
Reducing Mems Stiction By Introduction Of A Carbon Barrier
App 20150054096 - MONTEZ; RUBEN B. ;   et al.
2015-02-26
Reducing Microelectromechanical Systems Stiction By Formation Of A Silicon Carbide Layer
App 20150021717 - Turner; Michael D. ;   et al.
2015-01-22
Reducing MEMS stiction by introduction of a carbon barrier
Grant 8,895,339 - Montez , et al. November 25, 2
2014-11-25
Reducing Mems Stiction By Introduction Of A Carbon Barrier
App 20140167188 - Montez; Ruben B. ;   et al.
2014-06-19
Reducing Mems Stiction By Deposition Of Nanoclusters
App 20140167189 - Steimle; Robert F. ;   et al.
2014-06-19
Glass frit wafer bond protective structure
Grant 8,633,088 - Montez , et al. January 21, 2
2014-01-21
Substrate bonding with metal germanium silicon material
Grant 8,592,926 - Montez , et al. November 26, 2
2013-11-26
Glass Frit Wafer Bond Protective Structure
App 20130285228 - Montez; Ruben B. ;   et al.
2013-10-31
Method of making a micro-electro-mechanical-systems (MEMS) device
Grant 8,455,286 - Karlin , et al. June 4, 2
2013-06-04
Substrate Bonding With Metal Germanium Silicon Material
App 20120068325 - Montez; Ruben B. ;   et al.
2012-03-22
Substrate bonding with metal germanium silicon material
Grant 8,058,143 - Montez , et al. November 15, 2
2011-11-15
Method of producing microelectromechanical device with isolated microstructures
Grant 7,943,525 - Zhang , et al. May 17, 2
2011-05-17
Substrate Bonding With Metal Germanium Silicon Material
App 20100181676 - MONTEZ; RUBEN B. ;   et al.
2010-07-22
Microelectromechanical Device With Isolated Microstructures And Method Of Producing Same
App 20100155861 - Zhang; Lisa Z. ;   et al.
2010-06-24

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed