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Patent applications and USPTO patent grants for Mont; Frank W..The latest application filed is for "novel epitaxial semiconductor material regions for transistor devices and methods of forming same".
Patent | Date |
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Epitaxial semiconductor material regions for transistor devices and methods of forming same Grant 11,362,177 - Malinowski , et al. June 14, 2 | 2022-06-14 |
Epitaxial semiconductor material regions for transistor devices and methods of forming same Grant 11,205,699 - Malinowski , et al. December 21, 2 | 2021-12-21 |
Ultra-low reflectance broadband omni-directional anti-reflection coating Grant 11,088,291 - Chhajed , et al. August 10, 2 | 2021-08-10 |
Novel Epitaxial Semiconductor Material Regions For Transistor Devices And Methods Of Forming Same App 20210233999 - Malinowski; Arkadiusz ;   et al. | 2021-07-29 |
Dummy Fill Structures App 20210125922 - LEE; Tung-Hsing ;   et al. | 2021-04-29 |
Novel Epitaxial Semiconductor Material Regions For Transistor Devices And Methods Of Forming Same App 20210118993 - Malinowski; Arkadiusz ;   et al. | 2021-04-22 |
Chamferless via structures Grant 10,957,588 - Lenhardt , et al. March 23, 2 | 2021-03-23 |
Chamferless via structures Grant 10,937,694 - Lenhardt , et al. March 2, 2 | 2021-03-02 |
Chamferless via structures Grant 10,903,118 - Lenhardt , et al. January 26, 2 | 2021-01-26 |
Devices and methods of forming low resistivity noble metal interconnect Grant 10,679,937 - Zhang , et al. | 2020-06-09 |
Methods of mitigating cobalt diffusion in contact structures and the resulting devices Grant 10,658,176 - Mont , et al. | 2020-05-19 |
Skip via structures Grant 10,636,698 - Zhang , et al. | 2020-04-28 |
Methods of protecting structure of integrated circuit from rework Grant 10,636,656 - Sun , et al. | 2020-04-28 |
Methods Of Mitigating Cobalt Diffusion In Contact Structures And The Resulting Devices App 20200083040 - Mont; Frank W. ;   et al. | 2020-03-12 |
Chamferless Via Structures App 20190333814 - LENHARDT; Mark L. ;   et al. | 2019-10-31 |
Chamferless Via Structures App 20190333813 - LENHARDT; Mark L. ;   et al. | 2019-10-31 |
Methods Of Protecting Structure Of Integrated Circuit From Rework App 20190318927 - Sun; Lei ;   et al. | 2019-10-17 |
Chamferless via structures Grant 10,388,565 - Lenhardt , et al. A | 2019-08-20 |
Skip Via Structures App 20190221473 - Zhang; Xunyuan ;   et al. | 2019-07-18 |
Skip via structures Grant 10,262,892 - Zhang , et al. | 2019-04-16 |
Via and skip via structures Grant 10,157,833 - Zhang , et al. Dec | 2018-12-18 |
Via And Skip Via Structures App 20180342454 - Zhang; Xunyuan ;   et al. | 2018-11-29 |
Middle-of-line Local Interconnect Structures With Hybrid Features App 20180308752 - Zhang; Xunyuan ;   et al. | 2018-10-25 |
Chamferless Via Structures App 20180269103 - LENHARDT; Mark L. ;   et al. | 2018-09-20 |
Self-aligned lithographic patterning Grant 10,056,292 - Law , et al. August 21, 2 | 2018-08-21 |
Post spacer self-aligned cuts Grant 10,056,291 - Law , et al. August 21, 2 | 2018-08-21 |
Chamferless via structures Grant 10,032,668 - Lenhardt , et al. July 24, 2 | 2018-07-24 |
Post Spacer Self-aligned Cuts App 20180144976 - LAW; Shao Beng ;   et al. | 2018-05-24 |
Self-aligned Lithographic Patterning App 20180144979 - Law; Shao Beng ;   et al. | 2018-05-24 |
Skip Via Structures App 20180130699 - Zhang; Xunyuan ;   et al. | 2018-05-10 |
Environmentally green process and composition for cobalt wet etch Grant 9,947,547 - Mont , et al. April 17, 2 | 2018-04-17 |
Devices And Methods Of Forming Low Resistivity Noble Metal Interconnect App 20180040555 - ZHANG; Xunyuan ;   et al. | 2018-02-08 |
Environmentally Green Process And Composition For Cobalt Wet Etch App 20180005839 - Mont; Frank W. ;   et al. | 2018-01-04 |
Devices And Methods Of Forming Low Resistivity Noble Metal Interconnect With Improved Adhesion App 20170345766 - ZHANG; Xunyuan ;   et al. | 2017-11-30 |
Devices And Methods Of Forming Low Resistivity Noble Metal Interconnect App 20170345752 - ZHANG; Xunyuan ;   et al. | 2017-11-30 |
Devices and methods of forming low resistivity noble metal interconnect Grant 9,831,174 - Zhang , et al. November 28, 2 | 2017-11-28 |
Interconnect structures Grant 9,831,124 - Zhang , et al. November 28, 2 | 2017-11-28 |
Methods employing sacrificial barrier layer for protection of vias during trench formation Grant 9,799,559 - Siddiqui , et al. October 24, 2 | 2017-10-24 |
Cobalt interconnects covered by a metal cap Grant 9,799,555 - Zhang , et al. October 24, 2 | 2017-10-24 |
Tunable nanoporous films on polymer substrates, and method for their manufacture Grant 9,732,427 - Poxson , et al. August 15, 2 | 2017-08-15 |
Chamferless Via Structures App 20170133268 - LENHARDT; Mark L. ;   et al. | 2017-05-11 |
Chamferless via structures Grant 9,613,862 - Lenhardt , et al. April 4, 2 | 2017-04-04 |
Ultra-low Reflectance Broadband Omni-directional Anti-reflection Coating App 20170084760 - Chhajed; Sameer ;   et al. | 2017-03-23 |
Chamferless Via Structures App 20170062331 - LENHARDT; Mark L. ;   et al. | 2017-03-02 |
Chamferless Via Structures App 20170062275 - LENHARDT; Mark L. ;   et al. | 2017-03-02 |
Forming interconnect features with reduced sidewall tapering Grant 9,373,543 - Mont , et al. June 21, 2 | 2016-06-21 |
Broad Band Anti-Reflection Coating for Photovoltaic Devices and Other Devices App 20150349147 - Xi; Jingqun ;   et al. | 2015-12-03 |
Tunable Nanoporous Films On Polymer Substrates, And Method For Their Manufacture App 20130209780 - Poxson; David J. ;   et al. | 2013-08-15 |
Method And Structure Of Optical Thin Film Using Crystallized Nano-porous Material App 20130170044 - Mont; Frank W. ;   et al. | 2013-07-04 |
Spectrally Tunable Optical Filter App 20130021669 - Xi; Jingqun ;   et al. | 2013-01-24 |
High Transmittance Optical Windows And Method Of Constructing The Same App 20110168261 - Welser; Roger E. ;   et al. | 2011-07-14 |
Ultra-low Reflectance Broadband Omni-directional Anti-reflection Coating App 20110120554 - Chhajed; Sameer ;   et al. | 2011-05-26 |
Light emitting device with fine pattern App 20100148199 - Kim; Jong Kyu ;   et al. | 2010-06-17 |
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