Monfarad; Ali Heydari

Patent Applications and Registrations

Patent applications and USPTO patent grants for Monfarad; Ali Heydari.The latest application filed is for "surface smoothened ultrahigh conductivity composite lid for improved marking permanency of semiconductor packaged devices".

Company Profile

0.4.8

Monfarad; Ali Heydari - Albany CA
Monfarad, Ali Heydari - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface Smoothened Ultrahigh Conductivity Composite Lid For Improved Marking Permanency Of Semiconductor Packaged Devices App 20100052154 - Monfarad; Ali Heydari ; et al.	2010-03-04
Embedded microchannel cooling package for a central processor unit Grant 7,515,415 - Monfarad , et al. April 7, 2	2009-04-07
Direct contact cooling liquid embedded package for a central processor unit App 20070177352 - Monfarad; Ali Heydari ; et al.	2007-08-02
Embedded microchannel cooling package for a central processor unit App 20070177351 - Monfarad; Ali Heydari ; et al.	2007-08-02
Apparatus and method for cooling electronic systems App 20040163403 - Monfarad, Ali Heydari	2004-08-26
Refrigeration cooling assisted MEMS-based micro-channel cooling system Grant 6,741,469 - Monfarad May 25, 2	2004-05-25
Field replaceable packaged refrigeration module with capillary pumped loop for cooling electronic components App 20040079100 - Monfarad, Ali Heydari	2004-04-29
Field replaceable packaged refrigeration module with thermosyphon for cooling electronic components App 20040065111 - Monfarad, Ali Heydari	2004-04-08
Field replaceable packard refrigeration module with vapor chamber heat sink for cooling electronic components App 20040055322 - Monfarad, Ali Heydari	2004-03-25
Multiple compressor refrigeration heat sink module for cooling electronic components Grant 6,687,122 - Monfarad February 3, 2	2004-02-03
Field replaceable packaged refrigeration heat sink module for cooling electronic components Grant 6,637,231 - Monfarad October 28, 2	2003-10-28
Multiple compressor refrigeration heat sink module for cooling electronic components App 20030043542 - Monfarad, Ali Heydari	2003-03-06

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