loadpatents
Patent applications and USPTO patent grants for Momota; Atsushi.The latest application filed is for "position detection system".
Patent | Date |
---|---|
Position detection system Grant 11,408,970 - Kobayashi , et al. August 9, 2 | 2022-08-09 |
Position Detection System App 20210247482 - KOBAYASHI; Tadashi ;   et al. | 2021-08-12 |
Index deriving device, wearable device, and mobile device Grant 10,912,510 - Nishiyama , et al. February 9, 2 | 2021-02-09 |
Abnormality detection apparatus and notification apparatus Grant 10,493,915 - Kobayashi , et al. De | 2019-12-03 |
Abnormality Detection Apparatus and Notification Apparatus App 20190126822 - KOBAYASHI; Tadashi ;   et al. | 2019-05-02 |
Index Deriving Device, Wearable Device, And Mobile Device App 20180146907 - Nishiyama; Hideki ;   et al. | 2018-05-31 |
Method of manufacturing a rigid printed wiring board Grant 8,091,218 - Momota , et al. January 10, 2 | 2012-01-10 |
Bending-Type Rigid Printed Wiring Board and Process for Producing the Same App 20100294544 - Momota; Atsushi ;   et al. | 2010-11-25 |
Junction box and connector Grant 7,001,187 - Terunuma , et al. February 21, 2 | 2006-02-21 |
Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof Grant 6,921,869 - Terunuma , et al. July 26, 2 | 2005-07-26 |
Junction box, connector, and connecting terminal for use in the box and connector Grant 6,905,346 - Momota , et al. June 14, 2 | 2005-06-14 |
Junction box and connector App 20050054222 - Terunuma, Ichiro ;   et al. | 2005-03-10 |
Junction box and connector Grant 6,736,648 - Terunuma , et al. May 18, 2 | 2004-05-18 |
Junction box Grant 6,707,689 - Momota , et al. March 16, 2 | 2004-03-16 |
Junction box App 20030076650 - Momota, Atsushi ;   et al. | 2003-04-24 |
Junction box and connector App 20030077926 - Terunuma, Ichiro ;   et al. | 2003-04-24 |
Junction box, connector, and connecting terminal for use in the box and connector App 20030077927 - Momota, Atsushi ;   et al. | 2003-04-24 |
Interlayer connection structure of multilayer wiring board, method of manufacturing flexible printed circuit board and method of forming land thereof App 20030056978 - Terunuma, Ichiro ;   et al. | 2003-03-27 |
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