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Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive Grant 9,564,153 - Hitomi , et al. February 7, 2 | 2017-02-07 |
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Substrate for suspension Grant 8,399,774 - Hitomi , et al. March 19, 2 | 2013-03-19 |
Wet etched insulator and electronic circuit component Grant 8,308,967 - Sakayori , et al. November 13, 2 | 2012-11-13 |
Substrate For Suspension App 20120090878 - HITOMI; Yoichi ;   et al. | 2012-04-19 |
Substrate for suspension Grant 8,097,811 - Hitomi , et al. January 17, 2 | 2012-01-17 |
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film Grant 8,066,891 - Sakayori , et al. November 29, 2 | 2011-11-29 |
Magnetic head suspension Grant 8,040,634 - Miyazawa , et al. October 18, 2 | 2011-10-18 |
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Magnetic Head Suspension App 20090310260 - Miyazawa; Hiroaki ;   et al. | 2009-12-17 |
Substrate For Suspension App 20080247131 - Hitomi; Yoichi ;   et al. | 2008-10-09 |
Wet etched insulator and electronic circuit component Grant 7,226,806 - Sakayori , et al. June 5, 2 | 2007-06-05 |
Wet etched insulator and electronic circuit component App 20070120229 - Sakayori; Katsuya ;   et al. | 2007-05-31 |
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film App 20070026678 - Sakayori; Katsuya ;   et al. | 2007-02-01 |
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Production process of electronic component using wet etching, electronic component, and suspension for hard disk Grant 6,709,988 - Sakayori , et al. March 23, 2 | 2004-03-23 |
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