loadpatents
name:-0.0193190574646
name:-0.017174959182739
name:-0.0083839893341064
MOMOSE; Fumihiko Patent Filings

MOMOSE; Fumihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for MOMOSE; Fumihiko.The latest application filed is for "solder material for semiconductor device".

Company Profile
4.15.16
  • MOMOSE; Fumihiko - Higashi-chikuma-gun JP
  • Momose; Fumihiko - Nagano JP
  • Momose; Fumihiko - Kawasaki JP
  • MOMOSE; Fumihiko - Kawasaki-shi JP
  • Momose; Fumihiko - Higashichikuma Gun JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Solder Material For Semiconductor Device
App 20210407953 - WATANABE; Hirohiko ;   et al.
2021-12-30
Solder material for semiconductor device
Grant 11,145,615 - Watanabe , et al. October 12, 2
2021-10-12
Wire bonding apparatus
Grant 10,896,892 - Momose , et al. January 19, 2
2021-01-19
Semiconductor Module And Method For Manufacturing Same
App 20200388553 - NISHIDA; Yuhei ;   et al.
2020-12-10
Solder Material For Semiconductor Device
App 20200303337 - WATANABE; Hirohiko ;   et al.
2020-09-24
Solder material for semiconductor device
Grant 10,727,194 - Watanabe , et al.
2020-07-28
Semiconductor device and a method of manufacturing the same
Grant 10,497,586 - Tamai , et al. De
2019-12-03
Semiconductor device
Grant 10,297,527 - Saito , et al.
2019-05-21
Semiconductor device
Grant 10,276,474 - Saito , et al.
2019-04-30
Semiconductor device and method of manufacturing semiconductor device
Grant 10,199,305 - Momose , et al. Fe
2019-02-05
Semiconductor device and manufacturing method of semiconductor device
Grant 10,157,877 - Kido , et al. Dec
2018-12-18
Semiconductor device with heat dissipation and method of making same
Grant 10,090,222 - Hirao , et al. October 2, 2
2018-10-02
Semiconductor device and method of manufacturing same
Grant 10,090,223 - Momose , et al. October 2, 2
2018-10-02
Semiconductor Device With Heat Dissipation And Method Of Making Same
App 20180240730 - HIRAO; Akira ;   et al.
2018-08-23
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20180190570 - MOMOSE; Fumihiko ;   et al.
2018-07-05
Semiconductor device
Grant 9,978,701 - Saito , et al. May 22, 2
2018-05-22
Solder Material For Semiconductor Device
App 20180033761 - WATANABE; Hirohiko ;   et al.
2018-02-01
Semiconductor Device And A Method Of Manufacturing The Same
App 20170372977 - TAMAI; Yuta ;   et al.
2017-12-28
Semiconductor Device And Method Of Manufacturing Same
App 20170317008 - MOMOSE; Fumihiko ;   et al.
2017-11-02
Semiconductor device and method for manufacturing the semiconductor device
Grant 9,748,186 - Momose , et al. August 29, 2
2017-08-29
Semiconductor Device
App 20170077009 - SAITO; Takashi ;   et al.
2017-03-16
Semiconductor Device And Method For Manufacturing Semiconductor Device
App 20160225688 - SAITO; Takashi ;   et al.
2016-08-04
Semiconductor Device
App 20160035683 - SAITO; Takashi ;   et al.
2016-02-04
Semiconductor Device And Manufacturing Method Of Semiconductor Device
App 20160035690 - KIDO; Kazumasa ;   et al.
2016-02-04
Semiconductor Device And Method For Manufacturing The Semiconductor Device
App 20150380368 - MOMOSE; Fumihiko ;   et al.
2015-12-31
Semiconductor Device
App 20150303166 - MOMOSE; Fumihiko ;   et al.
2015-10-22
Semiconductor device and method for manufacturing the same
Grant 8,860,220 - Momose , et al. October 14, 2
2014-10-14
Semiconductor Device And Method For Manufacturing The Same
App 20130244380 - MOMOSE; Fumihiko ;   et al.
2013-09-19
Semiconductor device and method for manufacturing the same
Grant 8,395,262 - Momose , et al. March 12, 2
2013-03-12
Semiconductor Device And Method For Manufacturing The Same
App 20110186999 - Momose; Fumihiko ;   et al.
2011-08-04

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