Patent | Date |
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Solid-state imaging apparatus Grant 10,497,734 - Ichikawa , et al. De | 2019-12-03 |
Solid-state Imaging Apparatus App 20160284756 - Ichikawa; Takeshi ;   et al. | 2016-09-29 |
Solid-state imaging apparatus having electrical connection portions with lengths extending in first direction longer than in second direction Grant 9,397,131 - Ichikawa , et al. July 19, 2 | 2016-07-19 |
Photoelectric conversion apparatus and image sensing system Grant 9,293,493 - Kobayashi , et al. March 22, 2 | 2016-03-22 |
Photoelectric conversion apparatus Grant 9,263,487 - Kato , et al. February 16, 2 | 2016-02-16 |
Solid-state Imaging Apparatus App 20150179694 - Ichikawa; Takeshi ;   et al. | 2015-06-25 |
Solid-state imaging apparatus Grant 9,000,343 - Ichikawa , et al. April 7, 2 | 2015-04-07 |
Photoelectric conversion element, and photoelectric conversion apparatus and imaging system having a light guide Grant 8,878,115 - Shimotsusa , et al. November 4, 2 | 2014-11-04 |
Photoelectric Conversion Apparatus App 20140306309 - Kato; Taro ;   et al. | 2014-10-16 |
Photoelectric conversion apparatus Grant 8,817,144 - Kato , et al. August 26, 2 | 2014-08-26 |
Solid-state Imaging Apparatus App 20130092822 - Ichikawa; Takeshi ;   et al. | 2013-04-18 |
Photoelectric Conversion Apparatus And Image Sensing System App 20120200728 - Kobayashi; Masahiro ;   et al. | 2012-08-09 |
Photoelectric Conversion Apparatus App 20120200751 - Kato; Taro ;   et al. | 2012-08-09 |
Photoelectric Conversion Element, And Photoelectric Conversion Apparatus And Imaging System Using The Same App 20120199725 - Shimotsusa; Mineo ;   et al. | 2012-08-09 |
Structure with through hole, production method thereof, and liquid discharge head Grant 7,270,759 - Hayakawa , et al. September 18, 2 | 2007-09-18 |
Structure with through hole, production method thereof, and liquid discharge head App 20060068570 - Hayakawa; Yukihiro ;   et al. | 2006-03-30 |
Heating resistor film, recording head substrate, recording head, and recording apparatus Grant 6,964,471 - Tamura , et al. November 15, 2 | 2005-11-15 |
Structure provided with through hole, method of manufacture therefor, and liquid discharge head Grant 6,799,839 - Hayakawa , et al. October 5, 2 | 2004-10-05 |
Structure provided with through hole, method of manufacture therefor, and liquid discharge head App 20030081068 - Hayakawa, Yukihiro ;   et al. | 2003-05-01 |
Heating resistor film, recording head substrate, recording head, and recording apparatus App 20030076384 - Tamura, Seiichi ;   et al. | 2003-04-24 |
Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head Grant 6,143,190 - Yagi , et al. November 7, 2 | 2000-11-07 |
Pattern forming method by imparting hydrogen atoms and selectively depositing metal film Grant 5,861,233 - Sekine , et al. January 19, 1 | 1999-01-19 |
Method of manufacturing semiconductor devices Grant 5,731,131 - Momma , et al. March 24, 1 | 1998-03-24 |
Process for manufacturing a semiconductor device by applying a non-single-crystalline material on a sidewall inside of an opening portion for growing a single-crystalline semiconductor body Grant 5,612,230 - Yuzurihara , et al. March 18, 1 | 1997-03-18 |
Semiconductor memory device Grant 5,567,962 - Miyawaki , et al. October 22, 1 | 1996-10-22 |
Semiconductor memory device including gate electrode sandwiching a channel region Grant 5,331,197 - Miyawaki , et al. July 19, 1 | 1994-07-19 |