Moloney; Gerard S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moloney; Gerard S..The latest application filed is for "system and method for cmp having multi-pressure zone loading for improved edge and annular zone material removal control".

Company Profile

0.8.8

Moloney; Gerard S. - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing head, retaining ring for use therewith and method fo polishing a substrate Grant 7,118,456 - Moloney , et al. October 10, 2	2006-10-10
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control App 20060105685 - Kajiwara; Jiro ; et al.	2006-05-18
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control Grant 6,966,822 - Kajiwara , et al. November 22, 2	2005-11-22
Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface Grant 6,893,327 - Kajiwara , et al. May 17, 2	2005-05-17
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control App 20040029503 - Kajiwara, Jiro ; et al.	2004-02-12
Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal Grant 6,641,461 - Wang , et al. November 4, 2	2003-11-04
System and method for CMP head having multi-pressure annular zone subcarrier material removal control Grant 6,623,343 - Kajiwara , et al. September 23, 2	2003-09-23
Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution App 20030171076 - Moloney, Gerard S. ; et al.	2003-09-11
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control Grant 6,558,232 - Kajiwara , et al. May 6, 2	2003-05-06
Chemical mechanical polishing apparatus and method having a soft backed polishing head Grant 6,527,625 - Kajiwara , et al. March 4, 2	2003-03-04
Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface App 20020182867 - Kajiwara, Jiro ; et al.	2002-12-05
Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring App 20020173242 - Wang, Huey-Ming ; et al.	2002-11-21
Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal App 20020173240 - Wang, Huey-Ming ; et al.	2002-11-21
System and method for CMP head having multi-pressure annular zone subcarrier material removal control App 20020115397 - Kajiwara, Jiro ; et al.	2002-08-22
Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control Grant 6,309,290 - Wang , et al. October 30, 2	2001-10-30
Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring App 20010007810 - Moloney, Gerard S. ; et al.	2001-07-12

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