Mollat; Martin B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mollat; Martin B..The latest application filed is for "high-voltage variable breakdown voltage (bv) diode for electrostatic discharge (esd) applications".

Company Profile

0.10.9

Mollat; Martin B. - McKinney TX US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor wafer having test modules including pin matrix selectable test devices Grant 8,436,635 - Mollat , et al. May 7, 2	2013-05-07
High-voltage variable breakdown voltage (BV) diode for electrostatic discharge (ESD) applications Grant 8,174,077 - Mollat , et al. May 8, 2	2012-05-08
High-voltage Variable Breakdown Voltage (bv) Diode For Electrostatic Discharge (esd) Applications App 20110278693 - Mollat; Martin B. ; et al.	2011-11-17
High-voltage variable breakdown voltage (BV) diode for electrostatic discharge (ESD) applications Grant 7,986,010 - Mollat , et al. July 26, 2	2011-07-26
Semiconductor Wafer Having Test Modules Including Pin Matrix Selectable Test Devices App 20110050275 - MOLLAT; MARTIN B. ; et al.	2011-03-03
Method to manufacture a thin film resistor Grant 7,838,429 - Phan , et al. November 23, 2	2010-11-23
Method for locating a sub-surface feature using a scatterometer Grant 7,776,625 - Mollat , et al. August 17, 2	2010-08-17
High-voltage Variable Breakdown Voltage (bv) Diode For Electrostatic Discharge (esd) Applications App 20100193868 - Mollat; Martin B. ; et al.	2010-08-05
High-voltage variable breakdown voltage (BV) diode for electrostatic discharge (ESD) applications Grant 7,709,329 - Mollat , et al. May 4, 2	2010-05-04
Method To Manufacture A Thin Film Resistor App 20090023263 - Phan; Tony ; et al.	2009-01-22
High-voltage variable breakdown voltage (BV) diode for electrostatic discharge (ESD) applications App 20080197451 - Mollat; Martin B. ; et al.	2008-08-21
Methods for analyzing critical defects in analog integrated circuits Grant 7,415,378 - Mollat , et al. August 19, 2	2008-08-19
A Method For Locating A Sub-surface Feature Using A Scatterometer App 20070287204 - Mollat; Martin B. ; et al.	2007-12-13
Integrated circuit having a transistor level top side wafer contact and a method of manufacture therefor Grant 7,262,109 - Lin , et al. August 28, 2	2007-08-28
Integrated circuit having a transistor level top side wafer contact and a method of manufacture therefor App 20070045732 - Lin; John ; et al.	2007-03-01
Method of manufacturing a metal-insulator-metal capacitor using an etchback process Grant 7,118,958 - Phan , et al. October 10, 2	2006-10-10
Method of manufacturing a metal-insulator-metal capacitor using an etchback process App 20060197134 - Phan; Tony T. ; et al.	2006-09-07
Method for analyzing critical defects in analog integrated circuits App 20060171221 - Mollat; Martin B. ; et al.	2006-08-03

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