Molla; Jaynal A

Patent Applications and Registrations

Patent applications and USPTO patent grants for Molla; Jaynal A.The latest application filed is for "semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods".

Company Profile

13.45.37

Molla; Jaynal A - Gilbert AZ
Molla; Jaynal A. - Gilbert AZ
Molla; Jaynal A. - Austin TX
Molla; Jaynal A. - Chandler AZ
Molla; Jaynal A. - Endicott NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged dies with metal outer layers extending from die back sides toward die front sides Grant 11,437,276 - Molla , et al. September 6, 2	2022-09-06
Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof Grant 11,128,268 - Kishore , et al. September 21, 2	2021-09-21
Semiconductor Dies Having Ultra-thin Wafer Backmetal Systems, Microelectronic Devices Containing The Same, And Associated Fabrication Methods App 20210167033 - Sun; Tianwei ; et al.	2021-06-03
Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods Grant 10,923,451 - Sun , et al. February 16, 2	2021-02-16
Semiconductor Dies Having Ultra-thin Wafer Backmetal Systems, Microelectronic Devices Containing The Same, And Associated Fabrication Methods App 20210020595 - Sun; Tianwei ; et al.	2021-01-21
Microelectronic components having integrated heat dissipation posts and systems including the same Grant 10,861,764 - Viswanathan , et al. December 8, 2	2020-12-08
Semiconductor device package and methods of manufacture thereof Grant 10,825,747 - Li , et al. November 3, 2	2020-11-03
Packaged Dies With Metal Outer Layers Extending From Die Back Sides Toward Die Front Sides App 20200335398 - Molla; Jaynal A. ; et al.	2020-10-22
Thick-silver Layer Interface App 20200335420 - Viswanathan; Lakshminarayan ; et al.	2020-10-22
Method of wafer dicing for wafers with backside metallization and packaged dies Grant 10,741,446 - Molla , et al. A	2020-08-11
Thick-silver layer interface Grant 10,727,153 - Viswanathan , et al.	2020-07-28
Molded air cavity packages and methods for the production thereof Grant 10,529,638 - Sanchez , et al. J	2020-01-07
Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof Grant 10,485,091 - Molla , et al. Nov	2019-11-19
Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof Grant 10,431,449 - Molla , et al. O	2019-10-01
Molded air cavity packages and methods for the production thereof Grant 10,396,006 - Sanchez , et al. A	2019-08-27
Microelectronic Components Having Integrated Heat Dissipation Posts And Systems Including The Same App 20190206759 - Viswanathan; Lakshminarayan ; et al.	2019-07-04
Microelectronic Systems Containing Embedded Heat Dissipation Structures And Methods For The Fabrication Thereof App 20190148138 - MOLLA; JAYNAL A. ; et al.	2019-05-16
Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof Grant 10,269,678 - Viswanathan , et al.	2019-04-23
Molded Air Cavity Packages And Methods For The Production Thereof App 20190109060 - SANCHEZ; AUDEL ; et al.	2019-04-11
Microelectronic Modules With Sinter-bonded Heat Dissipation Structures And Methods For The Fabrication Thereof App 20190098743 - MOLLA; JAYNAL A. ; et al.	2019-03-28
Molded Air Cavity Packages And Methods For The Production Thereof App 20190051571 - SANCHEZ; AUDEL ; et al.	2019-02-14
Molded Air Cavity Packages And Methods For The Production Thereof App 20190043775 - SANCHEZ; AUDEL ; et al.	2019-02-07
Molded Air Cavity Packages And Methods For The Production Thereof App 20190043774 - SANCHEZ; AUDEL ; et al.	2019-02-07
Molded air cavity packages and methods for the production thereof Grant 10,199,303 - Sanchez , et al. Fe	2019-02-05
Molded air cavity packages and methods for the production thereof Grant 10,199,302 - Sanchez , et al. Fe	2019-02-05
Method Of Wafer Dicing For Wafers With Backside Metallization And Packaged Dies App 20190013242 - Molla; Jaynal A. ; et al.	2019-01-10
Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof Grant 10,141,182 - Molla , et al. Nov	2018-11-27
Semiconductor devices with protruding conductive vias and methods of making such devices Grant 9,941,210 - Viswanathan , et al. April 10, 2	2018-04-10
Air Cavity Packages And Methods For The Production Thereof App 20180082915 - VISWANATHAN; LAKSHMINARAYAN ; et al.	2018-03-22
Air cavity packages and methods for the production thereof Grant 9,922,894 - Viswanathan , et al. March 20, 2	2018-03-20
Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices Grant 9,875,987 - Viswanathan , et al. January 23, 2	2018-01-23
Semiconductor Device Package And Methods Of Manufacture Thereof App 20180012815 - LI; LI ; et al.	2018-01-11
Semiconductor device package and methods of manufacture thereof Grant 9,799,580 - Li , et al. October 24, 2	2017-10-24
Semiconductor Device Package And Methods Of Manufacture Thereof App 20170278763 - LI; Li ; et al.	2017-09-28
Thick-silver Layer Interface App 20170263529 - Viswanathan; Lakshminarayan ; et al.	2017-09-14
Thick-silver layer interface for a semiconductor die and corresponding thermal layer Grant 9,698,116 - Viswanathan , et al. July 4, 2	2017-07-04
Electronic devices with semiconductor die coupled to a thermally conductive substrate Grant 9,589,860 - Viswanathan , et al. March 7, 2	2017-03-07
Solder wettable flanges and devices and systems incorporating solder wettable flanges Grant 9,538,659 - Viswanathan , et al. January 3, 2	2017-01-03
Electronic Devices With Attached Die Structures And Methods Of Formation Of Such Devices App 20160365323 - Viswanathan; Lakshminarayan ; et al.	2016-12-15
Semiconductor device with mechanical lock features between a semiconductor die and a substrate Grant 9,425,161 - Viswanathan , et al. August 23, 2	2016-08-23
Thick-silver Layer Interface App 20160126206 - Viswanathan; Lakshminarayan ; et al.	2016-05-05
Electronic Devices With Solderable Die Structures And Methods Of Formation Of Such Devices App 20160099199 - Viswanathan; Lakshminarayan ; et al.	2016-04-07
Semiconductor Device With Mechanical Lock Features Between A Semiconductor Die And A Substrate App 20150333031 - VISWANATHAN; LAKSHMINARAYAN ; et al.	2015-11-19
Packaged semiconductor devices and methods of their fabrication Grant 9,099,567 - Viswanathan , et al. August 4, 2	2015-08-04
Packaged Semiconductor Devices And Methods Of Their Fabrication App 20150146399 - VISWANATHAN; LAKSHMINARAYAN ; et al.	2015-05-28
Solder Wettable Flanges And Devices And Systems Incorporating Solder Wettable Flanges App 20150055310 - VISWANATHAN; LAKSHMINARAYAN ; et al.	2015-02-26
Magnetoresistive device and method of packaging same Grant 7,829,980 - Molla , et al. November 9, 2	2010-11-09
Methods and apparatus for a dual-metal magnetic shield structure Grant 7,598,596 - Molla , et al. October 6, 2	2009-10-06
Magnetoresistive Device And Method Of Packaging Same App 20080266938 - Molla; Jaynal A. ; et al.	2008-10-30
Method of applying cladding material on conductive lines of MRAM devices Grant 7,402,529 - Molla , et al. July 22, 2	2008-07-22
Methods and apparatus for a dual-metal magnetic shield structure App 20080116535 - Molla; Jaynal A. ; et al.	2008-05-22
Method for fabricating a flux concentrating system for use in a magnetoelectronics device Grant 7,279,341 - Meixner , et al. October 9, 2	2007-10-09
Cladded conductor for use in a magnetoelectronics device and method for fabricating the same Grant 7,105,363 - Durlam , et al. September 12, 2	2006-09-12
Method of applying cladding material on conductive lines of MRAM devices App 20050263400 - Molla, Jaynal A. ; et al.	2005-12-01
Method for fabricating a flux concentrating system for use in a magnetoelectronics device App 20050208681 - Meixner, Thomas V. ; et al.	2005-09-22
Method for fabricating a flux concentrating system for use in a magnetoelectronics device Grant 6,943,038 - Meixner , et al. September 13, 2	2005-09-13
Magnetic shielding for electronic circuits which include magnetic materials Grant 6,936,763 - Rizzo , et al. August 30, 2	2005-08-30
Method of applying cladding material on conductive lines of MRAM devices Grant 6,927,072 - Molla , et al. August 9, 2	2005-08-09
Method For Fabricating A Flux Concentrating System For Use In A Magnetoelectronics Device App 20050164413 - Meixner, Thomas V. ; et al.	2005-07-28
Cladded conductor for use in a magnetoelectronics device and method for fabricating the same App 20050158992 - Durlam, Mark A. ; et al.	2005-07-21
Compositions and methods for the electroless deposition of NiFe on a work piece App 20050095855 - D'urso, John J. ; et al.	2005-05-05
Cladded conductor for use in a magnetoelectronics device and method for fabricating the same Grant 6,885,074 - Durlam , et al. April 26, 2	2005-04-26
Method of forming a flux concentrating layer of a magnetic device App 20040175845 - Molla, Jaynal A. ; et al.	2004-09-09
Cladded conductor for use in a magnetoelectronics device and method for fabricating the same App 20040099908 - Durlam, Mark A. ; et al.	2004-05-27
Magnetic shielding for electronic circuits which include magnetic materials App 20040000415 - Rizzo, Nicholas D. ; et al.	2004-01-01
Method of applying cladding material on conductive lines of MRAM devices App 20030170976 - Molla, Jaynal A. ; et al.	2003-09-11
Field emission device having a vacuum bridge focusing structure and method Grant 6,137,213 - Moyer , et al. October 24, 2	2000-10-24
Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate Grant 5,798,050 - Gaynes , et al. August 25, 1	1998-08-25
Interconnection method and structure for organic circuit boards Grant 5,435,057 - Bindra , et al. July 25, 1	1995-07-25
Method of solder bonding processor package Grant 5,432,998 - Galasco , et al. July 18, 1	1995-07-18
Interconnection method and structure for organic circuit boards Grant 5,298,685 - Bindra , et al. March 29, 1	1994-03-29
Method of forming a conductive end portion on a flexible circuit member Grant 5,237,743 - Busacco , et al. August 24, 1	1993-08-24
Method of fabricating nendritic materials Grant 5,185,073 - Bindra , et al. February 9, 1	1993-02-09
Separable electrical connection technology Grant 5,137,461 - Bindra , et al. August 11, 1	1992-08-11

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