Molis; Steven E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Molis; Steven E..The latest application filed is for "mass spectrometry system and method for contaminant identification in semiconductor fabrication".

Company Profile

0.13.10

Molis; Steven E. - Patterson NY
Molis; Steven E - Patterson NY
Molis; Steven E. - Brewster NY
Molis; Steven E. - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mass Spectrometry System And Method For Contaminant Identification In Semiconductor Fabrication App 20170154763 - Yuan; Qin ; et al.	2017-06-01
Releasable buried layer for 3-D fabrication and methods of manufacturing Grant 9,040,390 - Daubenspeck , et al. May 26, 2	2015-05-26
Enhanced diffusion barrier for interconnect structures Grant 8,742,581 - Yang , et al. June 3, 2	2014-06-03
Releasable Buried Layer For 3-d Fabrication And Methods Of Manufacturing App 20130320521 - DAUBENSPECK; Timothy H. ; et al.	2013-12-05
Enhanced Diffusion Barrier For Interconnect Structures App 20130168863 - Yang; Chih-Chao ; et al.	2013-07-04
Enhanced diffusion barrier for interconnect structures Grant 8,420,531 - Yang , et al. April 16, 2	2013-04-16
Enhanced Diffusion Barrier For Interconnect Structures App 20120326311 - Yang; Chih-Chao ; et al.	2012-12-27
Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system Grant 7,932,342 - Molis , et al. April 26, 2	2011-04-26
Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular species Grant 7,838,428 - Chen , et al. November 23, 2	2010-11-23
Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby Grant 7,737,029 - Kim , et al. June 15, 2	2010-06-15
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH App 20100009161 - Edelstein; Daniel C. ; et al.	2010-01-14
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength Grant 7,615,482 - Edelstein , et al. November 10, 2	2009-11-10
Methods of Forming Metal Interconnect Structures on Semiconductor Substrates Using Oxygen-Removing Plasmas and Interconnect Structures Formed Thereby App 20090239374 - Kim; Jae hak ; et al.	2009-09-24
Method To Improve Wettability By Reducing Liquid Polymer Macromolecule Mobility Through Forming Polymer Blend System App 20090182161 - MOLIS; Steven E. ; et al.	2009-07-16
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH App 20080233366 - Edelstein; Daniel C. ; et al.	2008-09-25
Method Of Repairing Process Induced Dielectric Damage By The Use Of Gcib Surface Treatment Using Gas Clusters Of Organic Molecular Species App 20070224824 - Chen; Shyng-Tsong ; et al.	2007-09-27
Fluorinated carbon polymer composites Grant 5,571,852 - Afzali-Ardakani , et al. November 5, 1	1996-11-05
Fluorinated carbon polymer composites Grant 5,556,899 - Afzali-Ardakani , et al. September 17, 1	1996-09-17
Fluorinated carbon polymer composites Grant 5,397,863 - Afzali-Ardakani , et al. March 14, 1	1995-03-14
Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment Grant 5,019,210 - Chou , et al. May 28, 1	1991-05-28

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