Molinelli Acocella; Joyce
Patent Applications and Registrations
Patent applications and USPTO patent grants for Molinelli Acocella; Joyce.The latest application filed is for "non-destructive bond line thickness measurement of thermal interface material on silicon packages".
- Molinelli Acocella; Joyce - Poughquag NY
| Patent | Date |
|---|---|
| Non-destructive Bond Line Thickness Measurement Of Thermal Interface Material On Silicon Packages App 20210123729 - Zhang; Hongqing ; et al. | 2021-04-29 |
| Fabricating coolant-cooled heat sinks with internal thermally-conductive fins Grant 10,842,043 - Zhang , et al. November 17, 2 | 2020-11-17 |
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