| Patent | Date |
|---|
Probe card test apparatus and method
Grant 8,531,202 - Mok , et al. September 10, 2 | 2013-09-10 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
Grant 7,952,373 - Mok , et al. May 31, 2 | 2011-05-31 |
High density interconnect system having rapid fabrication cycle
Grant 7,884,634 - Chong , et al. February 8, 2 | 2011-02-08 |
Probe card repair using coupons with spring contacts and separate atachment points
Grant 7,876,087 - Mok , et al. January 25, 2 | 2011-01-25 |
High density interconnect system having rapid fabrication cycle
Grant 7,872,482 - Chong , et al. January 18, 2 | 2011-01-18 |
High density interconnect system for IC packages and interconnect assemblies
Grant 7,812,626 - Bottoms , et al. October 12, 2 | 2010-10-12 |
Probe Card Test Apparatus And Method
App 20100213960 - Mok; Sammy ; et al. | 2010-08-26 |
Massively parallel interface for electronic circuit
Grant 7,772,860 - Chong , et al. August 10, 2 | 2010-08-10 |
High Density Interconnect System For Ic Packages And Interconnect Assemblies
App 20100066393 - Bottoms; W. R. ; et al. | 2010-03-18 |
Systems for testing and packaging integrated circuits
Grant 7,621,761 - Mok , et al. November 24, 2 | 2009-11-24 |
High density interconnect system for IC packages and interconnect assemblies
Grant 7,579,848 - Bottoms , et al. August 25, 2 | 2009-08-25 |
High Density Interconnect System Having Rapid Fabrication Cycle
App 20090153165 - Chong; Fu Chiung ; et al. | 2009-06-18 |
Membrane spring fabrication process
App 20090064498 - Mok; Sammy ; et al. | 2009-03-12 |
Massively Parallel Interface For Electronic Circuit
App 20080297186 - Chong; Fu Chiung ; et al. | 2008-12-04 |
High Density Interconnect System Having Rapid Fabrication Cycle
App 20080246500 - CHONG; Fu Chiung ; et al. | 2008-10-09 |
Massively parallel interface for electronic circuit
Grant 7,403,029 - Chong , et al. July 22, 2 | 2008-07-22 |
High density interconnect system having rapid fabrication cycle
Grant 7,382,142 - Chong , et al. June 3, 2 | 2008-06-03 |
Systems For Testing And Packaging Integrated Circuits
App 20080090429 - Mok; Sammy ; et al. | 2008-04-17 |
Compliance partitioning in testing of integrated circuits
App 20080061808 - Mok; Sammy ; et al. | 2008-03-13 |
Enhanced stress metal spring contactor
Grant 7,247,035 - Mok , et al. July 24, 2 | 2007-07-24 |
Miniaturized Contact Spring
App 20070144841 - Chong; Fu Chiung ; et al. | 2007-06-28 |
Massively Parallel Interface For Electronic Circuit
App 20070057684 - CHONG; Fu Chiung ; et al. | 2007-03-15 |
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
App 20070046304 - Mok; Sammy ; et al. | 2007-03-01 |
Massively parallel interface for electronic circuit
Grant 7,138,818 - Chong , et al. November 21, 2 | 2006-11-21 |
Miniaturized contact spring
Grant 7,137,830 - Lahiri , et al. November 21, 2 | 2006-11-21 |
Systems for testing and packaging integrated circuits
App 20060240690 - Mok; Sammy ; et al. | 2006-10-26 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
Grant 7,126,358 - Mok , et al. October 24, 2 | 2006-10-24 |
Miniaturized contact spring
Grant 7,126,220 - Lahiri , et al. October 24, 2 | 2006-10-24 |
High density interconnect system for IC packages and interconnect assemblies
App 20060186906 - Bottoms; W. R. ; et al. | 2006-08-24 |
Massively parallel interface for electronic circuit
Grant 7,009,412 - Chong , et al. March 7, 2 | 2006-03-07 |
High density interconnect system having rapid fabrication cycle
App 20050275418 - Chong, Fu Chiung ; et al. | 2005-12-15 |
Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
Grant 6,917,525 - Mok , et al. July 12, 2 | 2005-07-12 |
Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
App 20050068054 - Mok, Sammy ; et al. | 2005-03-31 |
Massively parallel interface for electronic circuit
App 20050051353 - Chong, Fu Chiung ; et al. | 2005-03-10 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
App 20050042932 - Mok, Sammy ; et al. | 2005-02-24 |
Systems for testing and packaging integrated circuits
App 20050026476 - Mok, Sammy ; et al. | 2005-02-03 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
Grant 6,815,961 - Mok , et al. November 9, 2 | 2004-11-09 |
Massively parallel interface for electronic circuits
Grant 6,812,718 - Chong , et al. November 2, 2 | 2004-11-02 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
Grant 6,799,976 - Mok , et al. October 5, 2 | 2004-10-05 |
Systems for testing and packaging integrated circuits
Grant 6,791,171 - Mok , et al. September 14, 2 | 2004-09-14 |
Mosaic decal probe
App 20040075455 - Mok, Sammy ; et al. | 2004-04-22 |
Mosaic decal probe
Grant 6,710,609 - Mok , et al. March 23, 2 | 2004-03-23 |
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
App 20040022042 - Mok, Sammy ; et al. | 2004-02-05 |
Mosaic Decal Probe
App 20040008045 - Mok, Sammy ; et al. | 2004-01-15 |
Miniaturized contact spring
App 20030218244 - Lahiri, Syamal Kumar ; et al. | 2003-11-27 |
Miniaturized contact spring
App 20030214045 - Lahiri, Syamal Kumar ; et al. | 2003-11-20 |
Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
App 20030099097 - Mok, Sammy ; et al. | 2003-05-29 |
Systems for testing and packaging integrated circuits
App 20020171133 - Mok, Sammy ; et al. | 2002-11-21 |
| 