Mok; Lawrence S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mok; Lawrence S..The latest application filed is for "metal-graphite foam composite and a cooling apparatus for using the same".
Company Profile
1.45.33
- Mok; Lawrence S. - Brewster NY
- Mok; Lawrence S - Brewster NY
- Mok; Lawrence S. - Yorktown Heights NY
Patent Activity
| Patent | Date |
|---|---|
| Massively parallel supercomputer Grant 8,667,049 - Blumrich , et al. March 4, 2 | 2014-03-04 |
| Metal-graphite Foam Composite And A Cooling Apparatus For Using The Same App 20120328789 - Lu; Minhua ; et al. | 2012-12-27 |
| Novel Massively Parallel Supercomputer App 20120311299 - Blumrich; Matthias A. ; et al. | 2012-12-06 |
| Massively parallel supercomputer Grant 8,250,133 - Blumrich , et al. August 21, 2 | 2012-08-21 |
| Compliant Vapor Chamber Chip Packaging App 20120170221 - Mok; Lawrence S. | 2012-07-05 |
| Compliant vapor chamber chip packaging Grant 8,176,972 - Mok May 15, 2 | 2012-05-15 |
| Laser annealing for 3-D chip integration Grant 8,138,085 - Chen , et al. March 20, 2 | 2012-03-20 |
| Cooling of substrate using interposer channels Grant 8,110,746 - Lu , et al. February 7, 2 | 2012-02-07 |
| Cooling of substrate using interposer channels Grant 8,059,400 - Lu , et al. November 15, 2 | 2011-11-15 |
| Laser Annealing For 3-d Chip Integration App 20110201199 - Chen; Howard H. ; et al. | 2011-08-18 |
| Laser annealing for 3-D chip integration Grant 7,947,599 - Chen , et al. May 24, 2 | 2011-05-24 |
| Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement Grant 7,948,077 - Andry , et al. May 24, 2 | 2011-05-24 |
| Cooling of substrate using interposer channels Grant 7,888,603 - Lu , et al. February 15, 2 | 2011-02-15 |
| Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device Grant 7,888,786 - Andry , et al. February 15, 2 | 2011-02-15 |
| Method of forming a substrate with interposer channels for cooling the substrate Grant 7,856,711 - Lu , et al. December 28, 2 | 2010-12-28 |
| Computer system performance estimator and layout configurator Grant 7,836,314 - Chieu , et al. November 16, 2 | 2010-11-16 |
| Multiple Chips On A Semiconductor Chip With Cooling Means App 20100117209 - Bezama; Raschid J. ; et al. | 2010-05-13 |
| Novel Massively Parallel Supercomputer App 20090259713 - Blumrich; Matthias A. ; et al. | 2009-10-15 |
| Personal website for electronic commerce on a smart Java card with multiple security check points Grant 7,571,461 - Kwok , et al. August 4, 2 | 2009-08-04 |
| System and method of locating vehicles with keylock signals Grant 7,570,179 - Chieu , et al. August 4, 2 | 2009-08-04 |
| Laser Annealing For 3-d Chip Integration App 20090184264 - Chen; Howard H. ; et al. | 2009-07-23 |
| Massively parallel supercomputer Grant 7,555,566 - Blumrich , et al. June 30, 2 | 2009-06-30 |
| Thermal docking fansink Grant 7,529,085 - Makley , et al. May 5, 2 | 2009-05-05 |
| Cooling Of Substrate Using Interposer Channels App 20090011546 - Lu; Minhua ; et al. | 2009-01-08 |
| Cooling Of Substrate Using Interposer Channels App 20090011547 - Lu; Minhua ; et al. | 2009-01-08 |
| Cooling Of Substrate Using Interposer Channels App 20090008129 - Lu; Minhua ; et al. | 2009-01-08 |
| Cooling Of Substrate Using Interposer Channels App 20090008130 - Lu; Minhua ; et al. | 2009-01-08 |
| Apparatus And Methods For Cooling Semiconductor Integrated Circuit Chip Packages App 20080315403 - Andry; Paul S. ; et al. | 2008-12-25 |
| Semiconductor chip heat transfer device Grant 7,458,413 - Mok December 2, 2 | 2008-12-02 |
| Cooling of substrate using interposer channels Grant 7,434,308 - Lu , et al. October 14, 2 | 2008-10-14 |
| Metal-graphite Foam Composite And A Cooling Apparatus For Using The Same App 20080166492 - Lu; Minhua ; et al. | 2008-07-10 |
| System and Method of Locating Vehicles with Keylock Signals App 20080165033 - Chieu; Trieu C. ; et al. | 2008-07-10 |
| Compliant vapor chamber chip packaging App 20080053640 - Mok; Lawrence S. | 2008-03-06 |
| Computer system performance estimator and layout configurator App 20080046766 - Chieu; Trieu C. ; et al. | 2008-02-21 |
| Thermal docking fansink App 20080002357 - Makley; Albert V. ; et al. | 2008-01-03 |
| Cooling apparatus for heat generating devices Grant 7,273,091 - Bahl , et al. September 25, 2 | 2007-09-25 |
| Apparatus and Methods For Cooling Semiconductor Integrated Circuit Chip Packages App 20070210446 - Andry; Paul S. ; et al. | 2007-09-13 |
| Semiconductor integrated circuit chip packages having integrated microchannel cooling modules Grant 7,230,334 - Andry , et al. June 12, 2 | 2007-06-12 |
| Connector drawer Grant 7,217,144 - Cipolla , et al. May 15, 2 | 2007-05-15 |
| Thermal interposer for thermal management of semiconductor devices Grant 7,180,179 - Mok , et al. February 20, 2 | 2007-02-20 |
| Cooling device using multiple fans and heat sinks Grant 7,128,135 - Mok , et al. October 31, 2 | 2006-10-31 |
| Apparatus and methods for cooling semiconductor integrated circuit chip packages App 20060103011 - Andry; Paul S. ; et al. | 2006-05-18 |
| Cooling device using multiple fans and heat sinks App 20060102324 - Mok; Lawrence S. ; et al. | 2006-05-18 |
| Semiconductor chip heat transfer device App 20060102318 - Mok; Lawrence S. | 2006-05-18 |
| Cooling of substrate using interposer channels App 20060042825 - Lu; Minhua ; et al. | 2006-03-02 |
| Thermal interposer for thermal management of semiconductor devices Grant 7,002,247 - Mok , et al. February 21, 2 | 2006-02-21 |
| Thermal Interposer For Thermal Management Of Semiconductor Devices App 20050280162 - Mok, Lawrence S. ; et al. | 2005-12-22 |
| Thermal interposer for thermal management of semiconductor devices App 20050280128 - Mok, Lawrence S. ; et al. | 2005-12-22 |
| Cooling apparatus for heat generating devices App 20050231916 - Bahl, Manish ; et al. | 2005-10-20 |
| Method of constructing a multicomputer system Grant 6,867,967 - Mok March 15, 2 | 2005-03-15 |
| Personal website for electronic commerce on a smart Java card with multiple security check points App 20050050366 - Kwok, Thomas Y. ; et al. | 2005-03-03 |
| Personal website for electronic commerce on a smart java card with multiple security check points Grant 6,829,711 - Kwok , et al. December 7, 2 | 2004-12-07 |
| Method and arrangement for enhancing the cooling capacity of portable computers Grant 6,816,371 - Agata , et al. November 9, 2 | 2004-11-09 |
| Smart fan modules and system Grant 6,791,836 - Cipolla , et al. September 14, 2 | 2004-09-14 |
| Cooling device with multiple compliant elements Grant 6,778,393 - Messina , et al. August 17, 2 | 2004-08-17 |
| Cooling mechanism for an electronic device Grant 6,752,201 - Cipolla , et al. June 22, 2 | 2004-06-22 |
| Method of constructing a multicomputer system App 20040114323 - Mok, Lawrence S. | 2004-06-17 |
| Method and arrangement for enhancing the cooling capacity of portable computers App 20040114322 - Agata, Hiroaki ; et al. | 2004-06-17 |
| Cooling Device With Multiple Compliant Elements App 20040105234 - Messina, Gaetano P. ; et al. | 2004-06-03 |
| Novel massively parallel supercomputer App 20040103218 - Blumrich, Matthias A ; et al. | 2004-05-27 |
| Cooling Mechanism For An Electronic Device App 20040099404 - Cipolla, Thomas M. ; et al. | 2004-05-27 |
| Smart fan modules and system App 20030198018 - Cipolla, Thomas M. ; et al. | 2003-10-23 |
| Smart fan modules and system Grant 6,592,449 - Cipolla , et al. July 15, 2 | 2003-07-15 |
| Smart fan modules and system App 20020121555 - Cipolla, Thomas M. ; et al. | 2002-09-05 |
| Electronic package with interconnected chips Grant 6,326,696 - Horton , et al. December 4, 2 | 2001-12-04 |
| Method of fabricating an electronic package with interconnected chips Grant 6,306,686 - Horton , et al. October 23, 2 | 2001-10-23 |
| Mechanical packaging and thermal management of flat mirror arrays Grant 5,764,314 - Narayan , et al. June 9, 1 | 1998-06-09 |
| Radio information broadcasting and receiving system Grant 5,581,576 - Lanzetta , et al. December 3, 1 | 1996-12-03 |
| Convertible display computer Grant 5,559,670 - Flint , et al. September 24, 1 | 1996-09-24 |
| Packages for stacked integrated circuit chip cubes Grant 5,343,366 - Cipolla , et al. August 30, 1 | 1994-08-30 |
| High density, high performance memory circuit package Grant 5,268,815 - Cipolla , et al. December 7, 1 | 1993-12-07 |
| Multi-chip module Grant 5,208,729 - Cipolla , et al. May 4, 1 | 1993-05-04 |
| Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface Grant 5,201,866 - Mok April 13, 1 | 1993-04-13 |
| Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation Grant 5,169,805 - Mok , et al. December 8, 1 | 1992-12-08 |
| Electronic device and heat sink assembly Grant 5,057,909 - Mok , et al. October 15, 1 | 1991-10-15 |
| Integrated circuit package with improved cooling means Grant 4,970,579 - Arldt , et al. November 13, 1 | 1990-11-13 |
| High power, pluggable tape automated bonding package Grant 4,939,570 - Bickford , et al. July 3, 1 | 1990-07-03 |
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