Moision; William C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Moision; William C..The latest application filed is for "high capacity aluminum spot weld electrode".
- Moision; William C. - Northville MI US
- Moision; William C. - Wayne MI
- - Northville MI US
| Patent | Date |
|---|---|
| System and method of welding a workpiece Grant 10,391,582 - Moision , et al. A | 2019-08-27 |
| Method of dressing a resistance spot welding tip Grant 9,517,527 - Moision , et al. December 13, 2 | 2016-12-13 |
| High capacity aluminum spot welding trans-gun primary cable Grant 9,505,079 - Moision , et al. November 29, 2 | 2016-11-29 |
| Non-destructive aluminum weld quality estimator Grant 9,314,878 - Abou-Nasr , et al. April 19, 2 | 2016-04-19 |
| High Capacity Aluminum Spot Weld Electrode App 20150321282 - Moision; William C. ; et al. | 2015-11-12 |
| Indexing self-piercing die riveter Grant 9,162,277 - Flis , et al. October 20, 2 | 2015-10-20 |
| Method of Dressing a Resistance Spot Welding Tip App 20150283645 - Moision; William C. ; et al. | 2015-10-08 |
| Method and apparatus for clearing a rivet from a riveting tool Grant 9,120,140 - Moision , et al. September 1, 2 | 2015-09-01 |
| Non-destructive Aluminum Weld Quality Estimator App 20150069112 - ABOU-NASR; Mahmoud A. ; et al. | 2015-03-12 |
| Resistance spot weld electrode dresser Grant 8,920,218 - Moision , et al. December 30, 2 | 2014-12-30 |
| Resistance spot weld electrode dresser Grant 08920218 - | 2014-12-30 |
| Indexing Self-piercing Die Riveter App 20140230242 - Flis; Matthew ; et al. | 2014-08-21 |
| Method and Apparatus for Clearing a Rivet from a Riveting Tool App 20140201977 - Moision; William C. ; et al. | 2014-07-24 |
| High Capacity Aluminum Spot Welding Trans-gun Primary Cable App 20140048523 - Moision; William C. ; et al. | 2014-02-20 |
| Resistance Spot Weld Electrode Dresser App 20140013869 - Moision; William C. ; et al. | 2014-01-16 |
| System and Method of Welding a Workpiece App 20130020288 - Moision; William C. ; et al. | 2013-01-24 |
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