Mohn; Fabian
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mohn; Fabian.The latest application filed is for "arrangement of a power semiconductor module and a cooler".
- Mohn; Fabian - Ennetbaden CH
| Patent | Date |
|---|---|
| Arrangement of a Power Semiconductor Module and a Cooler App 20220254653 - Torresin; Daniele ; et al. | 2022-08-11 |
| Power Semiconductor Module with Low Inductance Gate Crossing App 20220238493 - Schroeder; Arne ; et al. | 2022-07-28 |
| Method for producing a semiconductor module by using adhesive attachment prior to sintering Grant 11,348,896 - Liu , et al. May 31, 2 | 2022-05-31 |
| Heat Dissipation For Power Switches App 20220166423 - Salvatore; Giovanni ; et al. | 2022-05-26 |
| Heat dissipation for power switches Grant 11,343,943 - Salvatore , et al. May 24, 2 | 2022-05-24 |
| Electric Power Converter Device With Improved Integration Of Cooler Frame App 20220142015 - GRADINGER; Thomas ; et al. | 2022-05-05 |
| Manufacturing of a power semiconductor module Grant 11,189,556 - Mohn , et al. November 30, 2 | 2021-11-30 |
| Half-bridge module with coaxial arrangement of the DC terminals Grant 11,018,117 - Mohn , et al. May 25, 2 | 2021-05-25 |
| Power Semiconductor Package with Highly Reliable Chip Topside App 20210104449 - Mohn; Fabian ; et al. | 2021-04-08 |
| Resin encapsulated power semiconductor module with exposed terminal areas Grant 10,950,516 - Mohn March 16, 2 | 2021-03-16 |
| Method For Producing A Semiconductor Module App 20200350276 - LUI; Chunlei ; et al. | 2020-11-05 |
| Power module based on multi-layer circuit board Grant 10,636,732 - Mohn , et al. | 2020-04-28 |
| Half-bridge Module With Coaxial Arrangement Of The Dc Terminals App 20200066686 - Mohn; Fabian ; et al. | 2020-02-27 |
| Resin Encapsulated Power Semiconductor Module With Exposed Terminal Areas App 20200066609 - Mohn; Fabian | 2020-02-27 |
| Manufacturing Of A Power Semiconductor Module App 20190273040 - Mohn; Fabian ; et al. | 2019-09-05 |
| Power electronics module with first and second coolers Grant 10,283,436 - Schuderer , et al. | 2019-05-07 |
| Power semiconductor module Grant 10,283,454 - Traub , et al. | 2019-05-07 |
| Semiconductor device Grant 10,192,800 - Mohn , et al. Ja | 2019-01-29 |
| Power Module Based On Multi-layer Circuit Board App 20180366400 - Mohn; Fabian ; et al. | 2018-12-20 |
| Semiconductor module Grant 10,079,193 - Mohn , et al. September 18, 2 | 2018-09-18 |
| Semiconductor Device App 20180090401 - Mohn; Fabian ; et al. | 2018-03-29 |
| Power Semiconductor Module App 20180090441 - Traub; Felix ; et al. | 2018-03-29 |
| Power Electronics Module App 20180040538 - Schuderer; Juergen ; et al. | 2018-02-08 |
| Semiconductor Module App 20170263527 - Mohn; Fabian ; et al. | 2017-09-14 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 