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name:-0.01033878326416
name:-0.011826038360596
name:-0.00047111511230469
Mohanakrishnaswamy; Venkatesh Patent Filings

Mohanakrishnaswamy; Venkatesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mohanakrishnaswamy; Venkatesh.The latest application filed is for "mems packaging scheme using dielectric fence".

Company Profile
0.12.8
  • Mohanakrishnaswamy; Venkatesh - Coppell TX
  • Mohanakrishnaswamy; Venkatesh - Chennai IN
  • Mohanakrishnaswamy; Venkatesh - Tamil Nadu IN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming
Grant RE45,286 - Le Neel , et al. December 9, 2
2014-12-09
MEMS packaging scheme using dielectric fence
Grant 8,853,850 - Mohanakrishnaswamy , et al. October 7, 2
2014-10-07
Method of forming a die having an IC region adjacent a MEMS region
Grant 8,853,802 - Mohanakrishnaswamy , et al. October 7, 2
2014-10-07
High aspect ratio capacitively coupled MEMS devices
Grant 8,680,631 - Mohanakrishnaswamy , et al. March 25, 2
2014-03-25
Mems Packaging Scheme Using Dielectric Fence
App 20140061824 - Mohanakrishnaswamy; Venkatesh ;   et al.
2014-03-06
High Aspect Ratio Capacitively Coupled Mems Devices
App 20130228881 - Mohanakrishnaswamy; Venkatesh ;   et al.
2013-09-05
High aspect ratio capacitively coupled MEMS devices
Grant 8,432,006 - Mohanakrishnaswamy , et al. April 30, 2
2013-04-30
MEMS packaging scheme using dielectric fence
Grant 8,405,202 - Mohanakrishnaswamy , et al. March 26, 2
2013-03-26
Method Of Forming A Die Having An Ic Region Adjacent A Mems Region
App 20120235254 - Mohanakrishnaswamy; Venkatesh ;   et al.
2012-09-20
Method of forming a die having an IC region adjacent a MEMS region
Grant 8,193,595 - Mohanakrishnaswamy , et al. June 5, 2
2012-06-05
High Aspect Ratio Capacitively Coupled Mems Devices
App 20120056281 - Mohanakrishnaswamy; Venkatesh ;   et al.
2012-03-08
High aspect ratio all SiGe capacitively coupled MEMS devices
Grant 8,022,491 - Mohanakrishnaswamy , et al. September 20, 2
2011-09-20
Method Of Forming A Die Having An Ic Region Adjacent A Mems Region
App 20110156175 - Mohanakrishnaswamy; Venkatesh ;   et al.
2011-06-30
Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming
Grant 7,943,410 - Le Neel , et al. May 17, 2
2011-05-17
Mems Packaging Scheme Using Dielectric Fence
App 20110042801 - Mohanakrishnaswamy; Venkatesh ;   et al.
2011-02-24
High Aspect Ratio All Sige Capacitively Coupled Mems Devices
App 20100164024 - Mohanakrishnaswamy; Venkatesh ;   et al.
2010-07-01
Embedded Microelectromechanical Systems (mems) Semiconductor Substrate And Related Method Of Forming
App 20100140724 - LE NEEL; Olivier ;   et al.
2010-06-10

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