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Patent applications and USPTO patent grants for Mohanakrishnaswamy; Venkatesh.The latest application filed is for "mems packaging scheme using dielectric fence".
Patent | Date |
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Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming Grant RE45,286 - Le Neel , et al. December 9, 2 | 2014-12-09 |
MEMS packaging scheme using dielectric fence Grant 8,853,850 - Mohanakrishnaswamy , et al. October 7, 2 | 2014-10-07 |
Method of forming a die having an IC region adjacent a MEMS region Grant 8,853,802 - Mohanakrishnaswamy , et al. October 7, 2 | 2014-10-07 |
High aspect ratio capacitively coupled MEMS devices Grant 8,680,631 - Mohanakrishnaswamy , et al. March 25, 2 | 2014-03-25 |
Mems Packaging Scheme Using Dielectric Fence App 20140061824 - Mohanakrishnaswamy; Venkatesh ;   et al. | 2014-03-06 |
High Aspect Ratio Capacitively Coupled Mems Devices App 20130228881 - Mohanakrishnaswamy; Venkatesh ;   et al. | 2013-09-05 |
High aspect ratio capacitively coupled MEMS devices Grant 8,432,006 - Mohanakrishnaswamy , et al. April 30, 2 | 2013-04-30 |
MEMS packaging scheme using dielectric fence Grant 8,405,202 - Mohanakrishnaswamy , et al. March 26, 2 | 2013-03-26 |
Method Of Forming A Die Having An Ic Region Adjacent A Mems Region App 20120235254 - Mohanakrishnaswamy; Venkatesh ;   et al. | 2012-09-20 |
Method of forming a die having an IC region adjacent a MEMS region Grant 8,193,595 - Mohanakrishnaswamy , et al. June 5, 2 | 2012-06-05 |
High Aspect Ratio Capacitively Coupled Mems Devices App 20120056281 - Mohanakrishnaswamy; Venkatesh ;   et al. | 2012-03-08 |
High aspect ratio all SiGe capacitively coupled MEMS devices Grant 8,022,491 - Mohanakrishnaswamy , et al. September 20, 2 | 2011-09-20 |
Method Of Forming A Die Having An Ic Region Adjacent A Mems Region App 20110156175 - Mohanakrishnaswamy; Venkatesh ;   et al. | 2011-06-30 |
Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming Grant 7,943,410 - Le Neel , et al. May 17, 2 | 2011-05-17 |
Mems Packaging Scheme Using Dielectric Fence App 20110042801 - Mohanakrishnaswamy; Venkatesh ;   et al. | 2011-02-24 |
High Aspect Ratio All Sige Capacitively Coupled Mems Devices App 20100164024 - Mohanakrishnaswamy; Venkatesh ;   et al. | 2010-07-01 |
Embedded Microelectromechanical Systems (mems) Semiconductor Substrate And Related Method Of Forming App 20100140724 - LE NEEL; Olivier ;   et al. | 2010-06-10 |
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