| Patent | Date |
|---|
Design Enhanced 3d Printed Support Block
App 20220279689 - Burgess; Darin ; et al. | 2022-09-01 |
Low Temperature, Reworkable, And No-underfill Attach Process For Fine Pitch Ball Grid Arrays Having Solder Balls With Epoxy And Solder Material
App 20220108965 - Mohammed; Anwar A. ; et al. | 2022-04-07 |
Design Enhanced 3d Printed Support Block
App 20220078955 - Burgess; Darin ; et al. | 2022-03-10 |
Modified Controlled Cavitation For Cosmetics And Medicinal Drugs In Manufacturing Environments
App 20200038822 - Mohammed; Anwar A. | 2020-02-06 |
Stretchable And Self-healing Solders For Dies And Components In Manufacturing Environments
App 20200043880 - Mohammed; Anwar A. | 2020-02-06 |
Methods and apparatus for a substrate core layer
Grant 10,212,818 - Yu , et al. Feb | 2019-02-19 |
Methods and Apparatus for a Substrate Core Layer
App 20180288880 - Yu; Fei ; et al. | 2018-10-04 |
Apparatus and method for an optical package structure using aluminum nitride
Grant 9,112,091 - Mohammed , et al. August 18, 2 | 2015-08-18 |
Devices and methods for 2.5D interposers
Grant 8,952,533 - Mohammed , et al. February 10, 2 | 2015-02-10 |
Thermal Management In 2.5 D Semiconductor Packaging
App 20140332948 - Mohammed; Anwar A. ; et al. | 2014-11-13 |
Thermal management in 2.5 D semiconductor packaging
Grant 8,884,425 - Mohammed , et al. November 11, 2 | 2014-11-11 |
Monolithic Optical Packages and Methods Using Aluminum Nitride
App 20140097333 - Mohammed; Anwar A. ; et al. | 2014-04-10 |
Devices and Methods for 2.5D Interposers
App 20140070406 - Mohammed; Anwar A. ; et al. | 2014-03-13 |
Flange for semiconductor die
Grant 8,604,609 - Mohammed , et al. December 10, 2 | 2013-12-10 |
Large sized silicon interposers overcoming the reticle area limitations
Grant 8,519,543 - Song , et al. August 27, 2 | 2013-08-27 |
Methods and Apparatus for a Substrate Core Layer
App 20130186676 - Yu; Fei ; et al. | 2013-07-25 |
Flange for Semiconductor Die
App 20130037932 - Mohammed; Anwar A. ; et al. | 2013-02-14 |
Thermally Enhanced Stacked Package and Method
App 20120299173 - Mohammed; Anwar A. ; et al. | 2012-11-29 |
Flange for semiconductor die
Grant 8,314,487 - Mohammed , et al. November 20, 2 | 2012-11-20 |
High Power Ceramic on Copper Package
App 20120104582 - Mohammed; Anwar A. ; et al. | 2012-05-03 |
High power ceramic on copper package
Grant 8,110,445 - Mohammed , et al. February 7, 2 | 2012-02-07 |
Air cavity package with copper heat sink and ceramic window frame
Grant 8,013,429 - Mohammed , et al. September 6, 2 | 2011-09-06 |
Flange for Semiconductor Die
App 20110147921 - Mohammed; Anwar A. ; et al. | 2011-06-23 |
Air Cavity Package with Copper Heat Sink and Ceramic Window Frame
App 20110012254 - Mohammed; Anwar A. ; et al. | 2011-01-20 |
High Power Ceramic on Copper Package
App 20100283134 - Mohammed; Anwar A. ; et al. | 2010-11-11 |
Integrated circuit package and method of assembling the same
App 20070029664 - Mohammed; Anwar A. ; et al. | 2007-02-08 |
Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
Grant 6,681,483 - Crescenzi, Jr. , et al. January 27, 2 | 2004-01-27 |
Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
App 20020113673 - Crescenzi, E. James JR. ; et al. | 2002-08-22 |
| 