Mohamed; Abdul Rahman
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mohamed; Abdul Rahman.The latest application filed is for "clips for semiconductor packages".
- Mohamed; Abdul Rahman - Johor MY
- Mohamed; Abdul Rahman - Muar N/A MY
- Mohamed; Abdul Rahman - Pulau Pinang MY
| Patent | Date |
|---|---|
| Clips for semiconductor packages Grant 11,211,353 - Bajuri , et al. December 28, 2 | 2021-12-28 |
| Clips For Semiconductor Packages App 20210013171 - Bajuri; Mohd Kahar ; et al. | 2021-01-14 |
| Semiconductor device fabricated by flux-free soldering Grant 10,325,838 - Mohamed , et al. | 2019-06-18 |
| Semiconductor Device Fabricated By Flux-free Soldering App 20170365544 - Mohamed; Abdul Rahman ; et al. | 2017-12-21 |
| Adjustable pick-up head and method for manufacturing a device Grant 9,196,521 - Mohamed , et al. November 24, 2 | 2015-11-24 |
| Semiconductor device using diffusion soldering Grant 8,975,117 - Otremba , et al. March 10, 2 | 2015-03-10 |
| Adjustable Pick-up Head and Method for Manufacturing a Device App 20140123454 - Mohamed; Abdul Rahman ; et al. | 2014-05-08 |
| Method of manufacturing electronic device on leadframe Grant 8,642,394 - Mohamed , et al. February 4, 2 | 2014-02-04 |
| Semiconductor Device Using Diffusion Soldering App 20130200532 - Otremba; Ralf ; et al. | 2013-08-08 |
| PROCESS FOR PRODUCING CARBON NANOTUBES (CNTs) App 20110293504 - Mohamed; Abdul Rahman ; et al. | 2011-12-01 |
| Method of producing a thin semiconductor chip Grant 7,863,104 - Kroeninger , et al. January 4, 2 | 2011-01-04 |
| Chip-sized flip-chip semiconductor package and method for making the same Grant 7,615,410 - Goh , et al. November 10, 2 | 2009-11-10 |
| Electronic Device And Method Of Manufacturing App 20090189259 - Mohamed; Abdul Rahman ; et al. | 2009-07-30 |
| Method of Producing a Thin Semiconductor Chip App 20090098684 - Kroeninger; Werner ; et al. | 2009-04-16 |
| Chip-Sized Flip-Chip Semiconductor Package and Method for Making the Same App 20070029666 - Goh; Koh Hoo ; et al. | 2007-02-08 |
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