Moghadam; Farhad K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moghadam; Farhad K..The latest application filed is for "contact metallization scheme using a barrier layer over a silicide layer".

Company Profile

0.21.16

Moghadam; Farhad K. - Saratoga CA
Moghadam; Farhad K - Saratoga CA
Moghadam; Farhad K. - Los Gatos CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Deposition-selective etch-deposition process for dielectric film gapfill Grant 7,799,698 - Zhang , et al. September 21, 2	2010-09-21
Deposition-selective etch-deposition process for dielectric film gapfill Grant 7,691,753 - Zhang , et al. April 6, 2	2010-04-06
Contact metallization scheme using a barrier layer over a silicide layer Grant 7,514,353 - Weidman , et al. April 7, 2	2009-04-07
Sequential gas flow oxide deposition technique Grant 7,399,388 - Moghadam , et al. July 15, 2	2008-07-15
Integrated low k dielectrics and etch stops Grant 7,227,244 - Bjorkman , et al. June 5, 2	2007-06-05
Method of depositing low k films Grant 7,160,821 - Huang , et al. January 9, 2	2007-01-09
Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications Grant 7,151,053 - Lee , et al. December 19, 2	2006-12-19
Contact metallization scheme using a barrier layer over a silicide layer App 20060251800 - Weidman; Timothy W. ; et al.	2006-11-09
Deposition-selective Etch-deposition Process For Dielectric Film Gapfill App 20060228886 - Zhang; Lin ; et al.	2006-10-12
Deposition process for high aspect ratio trenches Grant 7,097,886 - Moghadam , et al. August 29, 2	2006-08-29
Deposition-selective etch-deposition process for dielectric film gapfill Grant 7,081,414 - Zhang , et al. July 25, 2	2006-07-25
Method of depositing low k films App 20050260864 - Huang, Tzu-Fang ; et al.	2005-11-24
Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generation Grant 6,958,112 - Karim , et al. October 25, 2	2005-10-25
Method of depositing dielectric materials in damascene applications App 20050233576 - Lee, Ju-Hyung ; et al.	2005-10-20
Method of depositing dielectric materials in damascene applications Grant 6,890,850 - Lee , et al. May 10, 2	2005-05-10
Integrated low K dielectrics and etch stops Grant 6,858,153 - Bjorkman , et al. February 22, 2	2005-02-22
Integrated low k dielectrics and etch stops App 20050023694 - Bjorkman, Claes H. ; et al.	2005-02-03
Sequential gas flow oxide deposition technique App 20050019494 - Moghadam, Farhad K. ; et al.	2005-01-27
[deposition-selective Etch-deposition Process For Dielectric Film Gapfill] App 20040251236 - Zhang, Lin ; et al.	2004-12-16
Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generation App 20040241342 - Karim, M. Ziaul ; et al.	2004-12-02
Method of depositing low K films Grant 6,806,207 - Huang , et al. October 19, 2	2004-10-19
Deposition process for high aspect ratio trenches App 20040115898 - Moghadam, Farhad K. ; et al.	2004-06-17
Compact and high throughput semiconductor fabrication system App 20040018070 - Zhao, Jun ; et al.	2004-01-29
Integrated low k dielectrics and etch stops Grant 6,669,858 - Bjorkman , et al. December 30, 2	2003-12-30
Method of depositing low K films App 20030162410 - Huang, Tzu-Fang ; et al.	2003-08-28
Method of depositing low k films using an oxidizing plasma Grant 6,593,247 - Huang , et al. July 15, 2	2003-07-15
Method of depositing dielectric materials in damascene applications App 20030129827 - Lee, Ju-Hyung ; et al.	2003-07-10
Contact and via fabrication technologies Grant 6,495,470 - Sadjadi , et al. December 17, 2	2002-12-17
Intergrated low k dielectrics and etch stops App 20020084257 - Bjorkman, Claes H. ; et al.	2002-07-04
Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound Grant 6,413,583 - Moghadam , et al. July 2, 2	2002-07-02
Integrated low k dielectrics and etch stops App 20020074309 - Bjorkman, Claes H. ; et al.	2002-06-20
Contact And Via Fabrication Technologies App 20020031901 - SADJADI, S.M. REZA ; et al.	2002-03-14
Integrated low K dielectrics and etch stops Grant 6,340,435 - Bjorkman , et al. January 22, 2	2002-01-22
Silicon Nitride Composite Hdp/cvd Process App 20020000664 - CHENG, LIE-YEA ; et al.	2002-01-03
Contact and via fabrication technologies Grant 5,883,436 - Sadjadi , et al. March 16, 1	1999-03-16
Dielectric deposition and cleaning process for improved gap filling and device planarization Grant 5,426,076 - Moghadam June 20, 1	1995-06-20
Method for improving stability of tungsten chemical vapor deposition Grant 5,326,723 - Petro , et al. July 5, 1	1994-07-05

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