loadpatents
name:-0.043037176132202
name:-0.033146142959595
name:-0.0010051727294922
Moghadam; Farhad Patent Filings

Moghadam; Farhad

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moghadam; Farhad.The latest application filed is for "rf power source operation in plasma enhanced processes".

Company Profile
0.27.24
  • Moghadam; Farhad - Saratoga CA
  • MOGHADAM; Farhad - Seoul JP
  • Moghadam; Farhad - Los Gatos CA
  • Moghadam, Farhad - Saratogo CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
RF Power Source Operation In Plasma Enhanced Processes
App 20210125820 - Moghadam; Farhad ;   et al.
2021-04-29
Method For Producing Dn Gel Membrane
App 20200316529 - KASAHARA; Shohei ;   et al.
2020-10-08
Plasma processes for depositing low dielectric constant films
Grant 7,560,377 - Cheung , et al. July 14, 2
2009-07-14
Apparatus and method for heating substrates
Grant 7,431,585 - Zhao , et al. October 7, 2
2008-10-07
Apparatus and method for heating substrates
Grant 7,381,052 - Zhao , et al. June 3, 2
2008-06-03
Methods And Apparatus For E-beam Treatment Used To Fabricate Integrated Circuit Devices
App 20070275569 - MOGHADAM; FARHAD ;   et al.
2007-11-29
Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices
Grant 7,256,139 - Moghadam , et al. August 14, 2
2007-08-14
Apparatus and method for heating substrates
App 20060223233 - Zhao; Jun ;   et al.
2006-10-05
Plasma processes for depositing low dielectric constant films
App 20050191846 - Cheung, David ;   et al.
2005-09-01
Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices
Grant 6,936,551 - Moghadam , et al. August 30, 2
2005-08-30
Method and apparatus for selectively changing thin film composition during electroless deposition in a single chamber
App 20050181226 - Weidman, Timothy W. ;   et al.
2005-08-18
Plasma processes for depositing low dielectric constant films
Grant 6,930,061 - Cheung , et al. August 16, 2
2005-08-16
Silicon carbide deposited by high density plasma chemical-vapor deposition with bias
Grant 6,926,926 - Cho , et al. August 9, 2
2005-08-09
Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices
App 20050130404 - Moghadam, Farhad ;   et al.
2005-06-16
Plasma processes for depositing low dielectric constant films
Grant 6,869,896 - Cheung , et al. March 22, 2
2005-03-22
Apparatus for improving barrier layer adhesion to HDP-FSG thin films
Grant 6,803,325 - M'Saad , et al. October 12, 2
2004-10-12
Method of improving moisture resistance of low dielectric constant films
Grant 6,743,737 - Yau , et al. June 1, 2
2004-06-01
Plasma processes for depositing low dielectric constant films
Grant 6,734,115 - Cheung , et al. May 11, 2
2004-05-11
Plasma processes for depositing low dielectric constant films
App 20040082199 - Cheung, David ;   et al.
2004-04-29
Cluster tool for E-beam treated films
App 20040069410 - Moghadam, Farhad ;   et al.
2004-04-15
Adjustable dual frequency voltage dividing plasma reactor
Grant 6,706,138 - Barnes , et al. March 16, 2
2004-03-16
Plasma processes for depositing low dielectric constant films
App 20040038545 - Cheung, David ;   et al.
2004-02-26
Process and an integrated tool for low k dielectric deposition including a pecvd capping module
App 20040020601 - Zhao, Jun ;   et al.
2004-02-05
Low-bias-deposited high-density-plasma chemical-vapor-deposition silicate glass layers
Grant 6,667,248 - M'Saad , et al. December 23, 2
2003-12-23
Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices
App 20030232495 - Moghadam, Farhad ;   et al.
2003-12-18
Plasma processes for depositing low dielectric constant films
Grant 6,660,656 - Cheung , et al. December 9, 2
2003-12-09
Method of depositing low dielectric constant carbon doped silicon oxide
Grant 6,632,735 - Yau , et al. October 14, 2
2003-10-14
Apparatus and method for heating substrates
App 20030138560 - Zhao, Jun ;   et al.
2003-07-24
Plasma processes for depositing low dielectric constant films
Grant 6,596,655 - Cheung , et al. July 22, 2
2003-07-22
Ultrasonic spray coating of liquid precursor for low K dielectric coatings
Grant 6,583,071 - Weidman , et al. June 24, 2
2003-06-24
Plasma processes for depositing low dielectric constant films
Grant 6,562,690 - Cheung , et al. May 13, 2
2003-05-13
Plasma processes for depositing low dielectric constant films
App 20030064610 - Cheung, David ;   et al.
2003-04-03
Plasma processes for depositing low dielectric constant films
Grant 6,541,282 - Cheung , et al. April 1, 2
2003-04-01
Method of improving moisture resistance of low dielectric constant films
App 20030054667 - Yau, Wai-Fan ;   et al.
2003-03-20
Low-bias-deposited high-density-plasma chemical-vapor-deposition silicate glass layers
App 20030050724 - M'Saad, Hichem ;   et al.
2003-03-13
Silicon carbide deposited by high density plasma chemical-vapor deposition with bias
App 20030049388 - Cho, Seon-Mee ;   et al.
2003-03-13
Adjustable dual frequency voltage dividing plasma reactor
App 20030037881 - Barnes, Michael S. ;   et al.
2003-02-27
Method of depositing low dielectric constant carbon doped silicon oxide
App 20030032305 - Yau, Wai-Fan ;   et al.
2003-02-13
Apparatus for improving barrier layer adhesion to HDP-FSG thin films
App 20020150682 - M'Saad, Hichem ;   et al.
2002-10-17
Method of improving moisture resistance of low dielectric constant films
Grant 6,448,187 - Yau , et al. September 10, 2
2002-09-10
Process gas distribution for forming stable fluorine-doped silicate glass and other films
Grant 6,383,954 - Wang , et al. May 7, 2
2002-05-07
Plasma processes for depositing low dielectric constant films
App 20020045361 - Cheung, David ;   et al.
2002-04-18
Plasma processes for depositing low dielectric constant films
Grant 6,348,725 - Cheung , et al. February 19, 2
2002-02-19
Plasma processes for depositing low dielectric constant films
Grant 6,303,523 - Cheung , et al. October 16, 2
2001-10-16
Method of improving moisture resistance of low dielectric constant films
App 20010026849 - Yau, Wai-Fan ;   et al.
2001-10-04
Plasma Processes For Depositing Low Dielectric Constant Films
App 20010005546 - CHEUNG, DAVID ;   et al.
2001-06-28
Plasma Processes For Depositing Low Dielectric Constant Films
App 20010004479 - CHEUNG, DAVID ;   et al.
2001-06-21
Method of improving moisture resistance of low dielectric constant films
Grant 6,245,690 - Yau , et al. June 12, 2
2001-06-12
Symmetric tunable inductively coupled HDP-CVD reactor
Grant 6,170,428 - Redeker , et al. January 9, 2
2001-01-09
Deposition of an inter layer dielectric formed on semiconductor wafer by sub atmospheric CVD
Grant 5,872,401 - Huff , et al. February 16, 1
1999-02-16
UV transparent oxynitride deposition in single wafer PECVD system
Grant 5,260,236 - Petro , et al. November 9, 1
1993-11-09
Company Registrations
SEC0001322090Moghadam Farhad

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