Modi; Mitul B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Modi; Mitul B..The latest application filed is for "conductive coating for a microelectronics package".

Company Profile

2.10.16

Modi; Mitul B. - Phoenix AZ
Modi; Mitul B - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive coating for a microelectronics package Grant 10,910,314 - Weng , et al. February 2, 2	2021-02-02
Systems and methods for electromagnetic interference shielding Grant 10,763,220 - Dias , et al. Sep	2020-09-01
Conductive Coating For A Microelectronics Package App 20200118930 - Weng; Li-Sheng ; et al.	2020-04-16
Conductive coating for a microelectronics package Grant 10,510,667 - Weng , et al. Dec	2019-12-17
Systems And Methods For Electromagnetic Interference Shielding App 20190157215 - Dias; Rajendra C. ; et al.	2019-05-23
Systems and methods for electromagnetic interference shielding Grant 10,229,887 - Dias , et al.	2019-03-12
Conductive Coating For A Microelectronics Package App 20180174972 - Weng; Li-Sheng ; et al.	2018-06-21
Semiconductor Package With Electromagnetic Interference Shielding Structures App 20180166363 - Heppner; Joshua D. ; et al.	2018-06-14
Integrated Circuit Package Having Integrated Emi Shield App 20170287847 - Dias; Rajendra C. ; et al.	2017-10-05
Systems And Methods For Electromagnetic Interference Shielding App 20170287846 - Dias; Rajendra C. ; et al.	2017-10-05
Perforated Conductive Material For Emi Shielding Of Semiconductor Device And Components App 20170250145 - Dias; Rajendra C. ; et al.	2017-08-31
Perforated conductive material for EMI shielding of semiconductor device and components Grant 9,704,811 - Dias , et al. July 11, 2	2017-07-11
Perforated Conductive Material For Emi Shielding Of Semiconductor Device And Components App 20170179040 - Dias; Rajendra C. ; et al.	2017-06-22
Underfill device and method Grant 9,516,752 - Brusso , et al. December 6, 2	2016-12-06
Underfill Device And Method App 20130208411 - Brusso; Patricia A. ; et al.	2013-08-15
Underfill device and method Grant 8,399,291 - Brusso , et al. March 19, 2	2013-03-19
Flexible core for enhancement of package interconnect reliability Grant 7,633,142 - Modi , et al. December 15, 2	2009-12-15
Flexible core for enhancement of package interconnect reliability Grant 7,352,061 - Modi , et al. April 1, 2	2008-04-01
Flexible core for enhancement of package interconnect reliability App 20080054446 - Modi; Mitul B. ; et al.	2008-03-06
Flexible core for enhancement of package interconnect reliablity App 20080057630 - Modi; Mitul B. ; et al.	2008-03-06
No flow underfill device and method App 20070026575 - Subramanian; Sankara J. ; et al.	2007-02-01
Underfill device and method App 20070004085 - Brusso; Patricia A. ; et al.	2007-01-04
Flexible core for enhancement of package interconnect reliability App 20060261464 - Modi; Mitul B. ; et al.	2006-11-23

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