Mocuta; Dan Mihai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mocuta; Dan Mihai.The latest application filed is for "high-k and metal filled trench-type edram capacitor with electrode depth and dimension control".
- Mocuta; Dan Mihai - Lagrangeville NY
| Patent | Date |
|---|---|
| High-K and metal filled trench-type EDRAM capacitor with electrode depth and dimension control Grant 9,059,194 - Brodsky , et al. June 16, 2 | 2015-06-16 |
| High-k And Metal Filled Trench-type Edram Capacitor With Electrode Depth And Dimension Control App 20150102463 - Brodsky; Colin J. ; et al. | 2015-04-16 |
| High-K and Metal Filled Trench-Type EDRAM Capacitor with Electrode Depth and Dimension Control App 20140191366 - Brodsky; Colin J. ; et al. | 2014-07-10 |
| Differential Spacer Formation For A Field Effect Transistor App 20070249112 - Geene; Brian Joseph ; et al. | 2007-10-25 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 