Mochizuki; Isamu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mochizuki; Isamu.The latest application filed is for "contacting component and structure containing said contacting component".

Company Profile

4.17.14

Mochizuki; Isamu - Tokyo N/A JP
Mochizuki; Isamu - Chuo-ku JP
Mochizuki; Isamu - Tachikawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Automobile interior part with reduced squeaking noises Grant 10,487,164 - Nagasaka , et al. Nov	2019-11-26
Contacting part made of thermoplastic resin composition with reduced squeaking noises Grant 10,227,486 - Mochizuki , et al.	2019-03-12
Contacting component and structure containing said contacting component Grant 10,189,982 - Mochizuki , et al. Ja	2019-01-29
Thermoplastic resin composition and molded article Grant 9,777,146 - Mochizuki , et al. October 3, 2	2017-10-03
Thermoplastic resin composition for reduction of squeaking noises and structure of reduced squeaking noises Grant 9,777,147 - Mochizuki , et al. October 3, 2	2017-10-03
Contacting component and structure containing said contacting component Grant 9,708,482 - Mochizuki , et al. July 18, 2	2017-07-18
Contacting Component And Structure Containing Said Contacting Component App 20170198128 - MOCHIZUKI; Isamu ; et al.	2017-07-13
Thermoplastic Resin Composition For Reduction Of Squeaking Noises And Structure Of Reduced Squeaking Noises App 20160237272 - MOCHIZUKI; Isamu ; et al.	2016-08-18
Contacting Part Made Of Thermoplastic Resin Composition With Reduced Squeaking Noises App 20160185949 - MOCHIZUKI; Isamu ; et al.	2016-06-30
Thermoplastic resin composition for reduction of squeaking noises and structure of reduced squeaking noises Grant 9,353,249 - Mochizuki , et al. May 31, 2	2016-05-31
Thermoplastic Resin Composition And Molded Article App 20160102200 - Mochizuki; Isamu ; et al.	2016-04-14
Contacting part made of thermoplastic resin composition with reduced squeaking noises Grant 9,309,390 - Mochizuki , et al. April 12, 2	2016-04-12
Contacting Component And Structure Containing Said Contacting Component App 20160060445 - MOCHIZUKI; Isamu ; et al.	2016-03-03
Thermoplastic Resin Composition For Reduction Of Squeaking Noises And Structure Of Reduced Squeaking Noises App 20140206803 - Mochizuki; Isamu ; et al.	2014-07-24
Contacting Part Made Of Thermoplastic Resin Composition With Reduced Squeaking Noises App 20130217817 - Mochizuki; Isamu ; et al.	2013-08-22
Semiconductor integrated circuit Grant 8,238,440 - Abe , et al. August 7, 2	2012-08-07
Automobile Interior Part With Reduced Squeaking Noises App 20120034467 - Nagasaka; Masahiko ; et al.	2012-02-09
Semiconductor Integrated Circuit App 20100303157 - Abe; Hiroshige ; et al.	2010-12-02
Sheet-like Probe, Method of Producing the Probe, and Application of the Probe App 20080048686 - Sato; Katsumi ; et al.	2008-02-28
Two-layer Film And Method Of Forming Pattern With The Same App 20070248905 - OHTA; Masaru ; et al.	2007-10-25
Two-layer film and method of forming pattern with the same Grant 7,247,420 - Ohta , et al. July 24, 2	2007-07-24
Two-layer film and method of forming pattern with the same App 20040131963 - Ohta, Masaru ; et al.	2004-07-08
Semiconductor device supporting integrated data transfer bridging between CPU memory and I/O device Grant 6,697,906 - Ayukawa , et al. February 24, 2	2004-02-24
Photosensitive resin composition, photosensitive resin film, and method of forming bumps using same Grant 6,423,463 - Oota , et al. July 23, 2	2002-07-23
Multiply connectable microprocessor and microprocessor system Grant 5,748,977 - Kawasaki , et al. May 5, 1	1998-05-05
Multiply connectable microprocessor and microprocessor system Grant 5,530,965 - Kawasaki , et al. June 25, 1	1996-06-25

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