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Patent applications and USPTO patent grants for Mochida; Tooru.The latest application filed is for "wire bonding apparatus".
Patent | Date |
---|---|
Wire bonding apparatus Grant 6,619,530 - Ushiki , et al. September 16, 2 | 2003-09-16 |
Wire bonding apparatus App 20020027152 - Ushiki, Hiroshi ;   et al. | 2002-03-07 |
Wire bonding apparatus App 20020023942 - Terakado, Yoshimitsu ;   et al. | 2002-02-28 |
Wire bonding method and apparatus App 20010004991 - Mochida, Tooru ;   et al. | 2001-06-28 |
Wire bonding apparatus App 20010002031 - Mochida, Tooru ;   et al. | 2001-05-31 |
Semiconductor device and wire bonding method therefor Grant 5,989,995 - Nishiura , et al. November 23, 1 | 1999-11-23 |
Wire bonding method Grant 5,967,401 - Nishiura , et al. October 19, 1 | 1999-10-19 |
Ultrasonic wire bonding method Grant 5,364,009 - Takahashi , et al. November 15, 1 | 1994-11-15 |
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