Mo; Wang-Pen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mo; Wang-Pen.The latest application filed is for "lithography process on high topology features".
- Mo; Wang-Pen - Pingtung TW
- Mo; Wang-Pen - Pingtung City TW
- Mo; Wang-Pen - Pingtung County TW
| Patent | Date |
|---|---|
| Method of forming a photoresist layer Grant 9,875,892 - Chang , et al. January 23, 2 | 2018-01-23 |
| Lithography process on high topology features Grant 9,791,775 - Chang , et al. October 17, 2 | 2017-10-17 |
| Film portion at wafer edge Grant 9,651,869 - Chang , et al. May 16, 2 | 2017-05-16 |
| Lithography Process on High Topology Features App 20160195807 - Chang; Chun-Wei ; et al. | 2016-07-07 |
| Film portion at wafer edge Grant 9,372,406 - Chang , et al. June 21, 2 | 2016-06-21 |
| Thickening phase for spin coating process Grant 9,360,755 - Chang , et al. June 7, 2 | 2016-06-07 |
| Test structure placement on a semiconductor wafer Grant 9,349,662 - Wu , et al. May 24, 2 | 2016-05-24 |
| Lithography process on high topology features Grant 9,285,677 - Chang , et al. March 15, 2 | 2016-03-15 |
| Method of fabricating a metal grid for semiconductor device Grant 9,153,620 - Wang , et al. October 6, 2 | 2015-10-06 |
| Method Of Fabricating A Metal Grid For Semiconductor Device App 20150249109 - Wang; Chih-Chien ; et al. | 2015-09-03 |
| Method Of Forming A Photoresist Layer App 20150243500 - Chang; Chun-Wei ; et al. | 2015-08-27 |
| Film Portion At Wafer Edge App 20150212420 - CHANG; Chun-Wei ; et al. | 2015-07-30 |
| Method of forming a photoresist layer Grant 9,028,915 - Chang , et al. May 12, 2 | 2015-05-12 |
| Metal grid in backside illumination image sensor chips and methods for forming the same Grant 8,940,574 - Wang , et al. January 27, 2 | 2015-01-27 |
| Method of semiconductor integrated circuit fabrication Grant 8,883,403 - Chen , et al. November 11, 2 | 2014-11-11 |
| Lithography Process on High Topology Features App 20140272715 - Chang; Chun-Wei ; et al. | 2014-09-18 |
| Thickening Phase For Spin Coating Process App 20140272704 - Chang; Chun-Wei ; et al. | 2014-09-18 |
| Manufacturing techniques for workpieces with varying topographies Grant 8,771,534 - Chen , et al. July 8, 2 | 2014-07-08 |
| Method to form a CMOS image sensor Grant 8,759,225 - Wang , et al. June 24, 2 | 2014-06-24 |
| Test Structure Placement on a Semiconductor Wafer App 20140151699 - Wu; Chuan-Ling ; et al. | 2014-06-05 |
| Semiconductor devices and manufacturing methods thereof Grant 8,692,296 - Chen , et al. April 8, 2 | 2014-04-08 |
| Method Of Semiconductor Integrated Circuit Fabrication App 20140080067 - Chen; Chun-Chang ; et al. | 2014-03-20 |
| Method to Form a CMOS Image Sensor App 20140061738 - Wang; Chung Chien ; et al. | 2014-03-06 |
| Method of Forming a Photoresist Layer App 20140065843 - Chang; Chun-Wei ; et al. | 2014-03-06 |
| Manufacturing techniques to limit damage on workpiece with varying topographies Grant 8,623,229 - Chen , et al. January 7, 2 | 2014-01-07 |
| Method Of Removing Residue During Semiconductor Device Fabrication App 20130302985 - Wu; Chun-Chang ; et al. | 2013-11-14 |
| Metal Grid in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20130270667 - Wang; Chih-Chien ; et al. | 2013-10-17 |
| Film Portion At Wafer Edge App 20130273740 - CHANG; Chun-Wei ; et al. | 2013-10-17 |
| Semiconductor Devices and Manufacturing Methods Thereof App 20130207163 - Chen; Chun-Chang ; et al. | 2013-08-15 |
| Manufacturing Techniques for Workpieces with Varying Topographies App 20130181320 - Chen; Chun-Chang ; et al. | 2013-07-18 |
| Manufacturing Techniques To Limit Damage On Workpiece With Varying Topographies App 20130137266 - Chen; Chun-Chang ; et al. | 2013-05-30 |
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